# US 12,191,435 B2 · Semiconductor light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,435 B2 - Document ID: US12191435B2 - Status: Granted - Kind: B2 - Application number: 18/459,793 - Filed: 2023-09-01 - Published: 2023-12-28 - Granted: 2025-01-07 - Earliest claimed: 2007-03-30 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Masahiko Kobayakawa - Web page: https://patentgrep.com/patent/US12191435B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H 20/852: Encapsulations - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10W 70/421: {Shapes or dispositions} - H10H 20/8582: {characterised by their shape} - H10H 20/8585: {being an interconnection} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. ## Claims ### Claim 1 A semiconductor device comprising: a first portion of a lead frame including a bonding portion; a second portion of a lead frame spaced apart from the first portion of lead frame in a first direction perpendicular to a thickness direction of the bonding portion; a semiconductor element mounted on a first surface of the bonding portion and electrically connected to the first portion of lead frame and the second portion of lead frame; and a case covering a part of the first portion of lead frame and a part of the second portion of lead frame, wherein the bonding portion includes a first exposed surface that is opposite from the first surface and exposed from the case, the first portion of lead frame further includes a plurality of thin extensions and a plurality of thick extensions, each thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, each thin extension being smaller in thickness than the bonding portion, and each thick extension extending from the bonding portion in the second direction, the plurality of thick extensions are disposed next to the plurality of thin extensions and have a same thickness as the bonding portion, each thick extension including a second exposed surface that is exposed from the case, the second exposed surface of each thick extension and the first exposed surface of the bonding portion are contained in a same flat plane, and the positions of the plurality of thick extensions are at different locations in the first direction from the positions of the plurality of thin extensions. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the first portion of lead frame is made of a metal. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein no semiconductor elements are mounted on the first portion of lead frame other than the above-mentioned semiconductor element. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein the plurality of thick extensions and the plurality of thin extensions of the first portion of lead frame are disposed next to and spaced apart from each other in the first direction. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, wherein the plurality of thin extensions and the plurality of thick extensions are disposed alternately in the first direction. ### Claim 6 (depends on 5) The semiconductor device according to claim 5, wherein the plurality of thin extensions comprise three thin extensions, and the plurality of thick extensions comprise two thick extensions, the three thin extensions and the two thick extensions are disposed alternately in the first direction. ### Claim 7 A semiconductor device comprising: a first portion of a lead frame including a bonding portion; a second portion of a lead frame spaced apart from the first portion of lead frame in a first direction perpendicular to a thickness direction of the bonding portion; a semiconductor element mounted on a first surface of the bonding portion and electrically connected to the first portion of lead frame and the second portion of lead frame; and a case covering a part of the first portion of lead frame and a part of the second portion of lead frame, wherein the bonding portion includes a first exposed surface that is opposite from the first surface and exposed from the case, the first portion of lead frame further includes a plurality of thin extensions and at least one a plurality of thick extensions, each thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, each thin extension being smaller in thickness than the bonding portion, each thick extension extending from the bonding portion in the second direction, each thick extension has a same thickness as the bonding portion and includes a second exposed surface that is exposed from the case, the plurality of thick extensions and the plurality of thin extensions are disposed next to and spaced apart from each other in the first direction, the second exposed surface of each thick extension and the first exposed surface of the bonding portion are contained in a same flat plane, and the positions of the plurality of thick extensions are at different locations in the first direction from the positions of the plurality of thin extensions. ### Claim 8 (depends on 7) The semiconductor device according to claim 7, wherein the plurality of thin extensions and the plurality of thick extensions are disposed alternately in the first direction. ### Claim 9 (depends on 8) The semiconductor device according to claim 8, wherein the plurality of thin extensions comprise three thin extensions, and the plurality of thick extensions comprise two thick extensions, and the three thin extensions and the two thick extensions are disposed alternately in the first direction.