# US 12,191,434 B2 · Method for making electronic device arrays using a temporary substrate

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- Number: US 12,191,434 B2
- Document ID: US12191434B2
- Status: Granted
- Kind: B2
- Application number: 18/377,872
- Filed: 2023-10-09
- Published: 2024-02-01
- Granted: 2025-01-07
- Earliest claimed: 2017-11-08
- Assignees: SemiLEDS Optoelectronics Co., Ltd.
- Applicants: SemiLEDS Optoelectronics Co., Ltd.
- Inventors: David Trung Doan; Trung Tri Doan
- Web page: https://patentgrep.com/patent/US12191434B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/018: {Bonding of wafers}
- H10H 20/852: Encapsulations
- H10W 90/00: Package configurations
- H10H 20/01: Manufacture or treatment
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.

## Claims

### Claim 1

A method for making electronic device arrays comprising:
providing a plurality of separate electronic devices with at least one of the devices comprising a light emitting diode (LED);
providing a temporary substrate configured as an attaching substrate for the electronic devices;
attaching the electronic devices to the temporary substrate;
forming one or more insulator layers on the electronic devices while attached to the temporary substrate;
forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry; and
separating the electronic devices along with the metal layers and the insulator layers from the temporary substrate.

### Claim 2 (depends on 1)

The method of claim 1 wherein the electronic devices comprise bare dice, packaged dice, or optical devices having a desired configuration.

### Claim 3 (depends on 1)

The method of claim 1 wherein the forming of the metal layers step and the forming of the insulator layers step are performed in stages such that each completed electronic device array has a structural integrity configured to support the electronic devices.

### Claim 4 (depends on 1)

The method of claim 1 wherein each completed electronic device array has at least two metal layers and at least two insulator layers.

### Claim 5 (depends on 1)

The method of claim 1 wherein each completed electronic device array includes one or more vias configured to electrically connect the metal layers.

### Claim 6

A method for making electronic device arrays comprising:
providing a plurality of separate electronic devices with at least one of the electronic devices comprising a vertical light emitting diode (VLED) or a planar light emitting diode (PLED);
providing a temporary substrate configured as an attaching substrate for attaching the electronic devices;
attaching the electronic devices to the temporary substrate;
forming one or more insulator layers on the electronic devices attached to the temporary substrate;
forming one or more metal layers on the insulator layers configured to electrically connect the electronic devices to form a desired circuitry; and
separating the electronic devices along with the metal layers and the insulator layers from the temporary substrate.

### Claim 7 (depends on 6)

The method of claim 6 wherein the electronic devices are physically connected by the one or more insulator layers.

### Claim 8 (depends on 6)

The method of claim 6 wherein the electronic devices comprise a plurality of vertical light emitting diodes (VLEDs).

### Claim 9 (depends on 6)

The method of claim 6 wherein the electronic devices comprise a plurality of planar light emitting diodes (PLEDs).

### Claim 10 (depends on 6)

The method of claim 6 further comprising prior to the separating step planarizing at least one insulator layer.

### Claim 11 (depends on 6)

The method of claim 6 further comprising prior to the separating step planarizing at least one metal layer.

### Claim 12

A method for making electronic device arrays comprising:
providing a plurality of separate electronic devices, with at least one of the electronic devices comprising a light emitting diode (LED) having a desired configuration with extended pads;
providing a temporary substrate configured as an attaching substrate for attaching the electronic devices;
attaching the electronic devices to the temporary substrate;
forming a plurality of metal posts on the temporary substrate in electrical contact with the electronic devices and encapsulating the metal posts in an insulator layer; and
separating the electronic devices along with the metal posts and the insulator layer from the temporary substrate.

### Claim 13 (depends on 12)

The method of claim 12 further comprising prior to the encapsulating the metal posts step, forming a plurality of electrical connectors in electrical contact with the metal posts and with pads on the electronic devices.

### Claim 14 (depends on 13)

The method of claim 13 further comprising forming a common electrode in electrical communication with the electrical connectors.

### Claim 15 (depends on 14)

The method of claim 14 wherein the common electrode comprises an anode or a cathode.