# US 12,191,433 B2 · Display module, manufacturing method thereof, and display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,433 B2 - Document ID: US12191433B2 - Status: Granted - Kind: B2 - Application number: 17/485,150 - Filed: 2021-09-24 - Published: 2022-08-04 - Granted: 2025-01-07 - Earliest claimed: 2021-02-03 - Assignees: Chendu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Applicants: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Inventors: Wenqiang Bao; Zhihui Wang - Web page: https://patentgrep.com/patent/US12191433B2 ## CPC - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H10H 20/01: Manufacture or treatment - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10K 59/19: Segment displays - H10W 70/69: Insulating materials thereof - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - H10H 20/036: {of packages} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure provides a display module, a manufacturing method thereof, and a display device. The display module includes: a display panel including a substrate; a chip on film connected to the display panel; a circuit board connected to the chip on film; and a first film layer attached to surfaces of the display panel and the circuit board facing away from the substrate and covering at least the chip on film and the circuit board. ## Claims ### Claim 1 A display module comprising: a display panel comprising a substrate; a chip on film connected to the display panel; a circuit board connected to the chip on film; and a first film layer attached to surfaces of the display panel and the circuit board facing away from the substrate and covering at least the chip on film and the circuit board, wherein the first film layer comprises a first adhesive area and a non-adhesive area, the first adhesive area comprises a first part and a second part extending in a first direction, wherein the non-adhesive area is between the first part and the second part of the first adhesive area, and the non-adhesive area and an orthographic projection of the chip on film on the first film layer at least partially overlap. ### Claim 2 (depends on 1) The display module of claim 1, wherein the circuit board comprises an integrated circuit chip and a timing controller, the first film layer comprises a plurality of openings, and the plurality of openings at least expose the integrated circuit chip and the timing controller. ### Claim 3 (depends on 1) The display module of claim 1, wherein an adhesion of the first part and the second part of the first adhesive area is 3-10 gf/inch. ### Claim 4 (depends on 1) The display module of claim 1, wherein the non-adhesive area is coated with ink. ### Claim 5 (depends on 1) The display module of claim 1, wherein four sides of the first film layer respectively extend beyond the chip on film and the circuit board, and the first film layer covers a part of the substrate of the display panel. ### Claim 6 (depends on 1) The display module of claim 1, wherein a thickness of the first film layer in a direction perpendicular to the substrate is less than or equal to 0.1 mm. ### Claim 7 (depends on 1) The display module of claim 1, wherein the first film layer comprises a connecting strip adhered to the display module. ### Claim 8 (depends on 3) The display module of claim 3, further comprising a second film layer, wherein the second film layer is attached to the substrate of the display panel, and the second film layer covers surfaces of the display panel, the chip on film, and the circuit board facing away from the first film layer. ### Claim 9 A display module comprising: a display panel comprising a substrate; a chip on film connected to the display panel; a circuit board connected to the chip on film; and a first film layer attached to surfaces of the display panel and the circuit board facing away from the substrate and covering at least the chip on film and the circuit board, wherein the first film layer comprises a first adhesive area, the first adhesive area comprises a first part and a second part extending in a first direction, wherein the display module further comprises a second film layer, the second film layer is attached to the substrate of the display panel, and the second film layer covers surfaces of the display panel, the chip on film, and the circuit board facing away from the first film layer, wherein two opposite sides of the second film layer respectively extend beyond the chip on film and the circuit board, the two opposite sides of the second film layer extend in a second direction intersecting with the first direction, and wherein the first film layer further comprises a second adhesive area extending in the second direction and on both sides of the first adhesive area, an adhesion of the second adhesive area is greater than the adhesion of the first adhesive area, the second adhesive area extends beyond the chip on film and the circuit board, and the second adhesive area is adhered to the two opposite sides of the second film layer. ### Claim 10 (depends on 9) The display module of claim 9, wherein the adhesion of the second adhesive area is 30 gf/inch. ### Claim 11 (depends on 8) The display module of claim 8, wherein the second film layer comprises at least two sub-film layers separated from each other, and the at least two sub-film layers are both attached to the substrate of the display panel. ### Claim 12 (depends on 8) The display module of claim 8, wherein a width of the second film layer in the first direction gradually increases in a direction from the display panel to the circuit board. ### Claim 13 (depends on 8) The display module of claim 8, wherein four sides of the second film layer respectively extend beyond the display panel, the chip on film, and the circuit board by at least 3-5 mm. ### Claim 14 (depends on 8) The display module of claim 8, wherein a thickness of the second film layer in a direction perpendicular to the substrate is 0.3-0.5 mm. ### Claim 15 (depends on 8) The display module of claim 8, wherein an adhesion of the second film layer is 3-10 gf/inch. ### Claim 16 A display module comprising: a display panel comprising a substrate; a chip on film connected to the display panel; a circuit board connected to the chip on film; and a first film layer attached to surfaces of the display panel and the circuit board facing away from the substrate and covering at least the chip on film and the circuit board, wherein the first film layer comprises a first adhesive area, the first adhesive area comprises a first part and a second part extending in a first direction, wherein the display module further comprises a second film layer, the second film layer is attached to the substrate of the display panel, and the second film layer covers surfaces of the display panel, the chip on film, and the circuit board facing away from the first film layer, and wherein both sides of the first film layer extending in a second direction intersecting with the first direction comprise first lugs, and both sides of the second film layer extending in the second direction comprise second lugs. ### Claim 17 (depends on 1) A display device comprising the display module of claim 1. ### Claim 18 (depends on 1) A method for manufacturing the display module according to claim 1, comprising the following steps: providing the display panel, the display panel comprising the substrate; connecting the chip on film to the display panel; connecting the circuit board to the chip on film; attaching the first film layer to surfaces of the display panel and the circuit board facing away from the substrate, so that the first film layer covers at least the chip on film and the circuit board; temporarily removing the first film layer to expose the chip on film and the circuit board during an operation of the chip on film and the circuit board; and resetting the first film layer after completing the operation of the chip on film and the circuit board. ### Claim 19 (depends on 18) The method of claim 18, before the step of attaching the first film layer to surfaces of the display panel and the circuit board facing away from the substrate, further comprising: attaching a second film layer to the substrate of the display panel, so that the second film layer covers surfaces of the display panel, the chip on film, and the circuit board facing away from the first film layer.