# US 12,191,298 B2 · Back-to-back solid state lighting devices and associated methods

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- Number: US 12,191,298 B2
- Document ID: US12191298B2
- Status: Granted
- Kind: B2
- Application number: 18/340,602
- Filed: 2023-06-23
- Published: 2023-11-02
- Granted: 2025-01-07
- Earliest claimed: 2010-09-02
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: Cem Basceri; Casey Kurth; Kevin Tetz
- Web page: https://patentgrep.com/patent/US12191298B2

## CPC

- H10W 90/00: Package configurations
- H10H 20/8312: {extending at least partially through the bodies}
- H10H 20/8506: {Containers}
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 2201/10106: Light emitting diode [LED]
- H10H 20/036: {of packages}
- H10H 20/0361: {of wavelength conversion means}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.

## Claims

### Claim 1

A method of forming a solid state light (SSL), comprising:
providing a carrier substrate having a first electrically insulative material at a first surface of the carrier substrate, a second electrically insulative material at a second surface opposite the first surface, and a through substrate interconnect (TSI) extending from the first surface to the second surface;
disposing a first reflective material in direct contact with the first electrically insulative material;
mounting a first solid state emitter (SSE) over the first reflective material and electrically coupling the first SSE to the TSI;
disposing a second reflective material in direct contact with the second electrically insulative material; and
mounting a second SSE over the second reflective material and electrically coupling the second SSE to the TSI.

### Claim 2 (depends on 1)

The method of claim 1, wherein:
the first SSE comprises a first semiconductor material at a first side of the first SSE, a second semiconductor material at a second side of the first SSE opposite the first side, wherein the second side faces the first surface of the carrier substrate, wherein the first semiconductor material includes a first contact and the second semiconductor material includes a second contact,
the second SSE comprises a first semiconductor material at a first side of the second SSE, a second semiconductor material at a second side of the second SSE opposite from the first side, wherein the second side faces the second surface of the carrier substrate, and wherein the first semiconductor material includes a first contact and the second semiconductor material includes a second contact, and
the first contacts of the first and second SSEs are electrically coupled to the first TSI, and
the second contacts of the first and second SSEs are electrically coupled to a second TSI extending from the first surface of the carrier substrate to the second surface of the carrier substrate.

### Claim 3 (depends on 2)

The method of claim 2, wherein:
the second contact of the first SSE is exposed; and
the second contact is electrically coupled to the second TSI with a conductive member.

### Claim 4 (depends on 2)

The method of claim 2, wherein:
the first contacts of the first and second SSEs are buried contacts;
the first SSE includes a first aperture extending from the second side of the first SSE to the first contact buried in the first SSE;
the second SSE includes a second aperture extending from the second side of the second SSE to the first contact buried in the second SSE;
a first electrical connector extends from the first TSI through the first aperture to the first contact buried in the first SSE;
a second electrical connector extends from the first TSI through the second aperture to the first contact buried in the second SSE; and
a dielectric material is disposed in the first and second apertures, wherein the dielectric material is configured to electrically isolate the first and second electrical connectors from at least the second semiconductor material.

### Claim 5 (depends on 2)

The method of claim 2 wherein the carrier substrate comprises a conductive core electrically isolated from the first and second TSIs and the first and second SSEs.

### Claim 6 (depends on 1)

The method of claim 1 wherein the carrier substrate comprises aluminum nitride.

### Claim 7 (depends on 1)

The method of claim 1, further comprising:
coupling a rotation device to the first and second SSEs to rotate the first and second SSEs around at least one axis.

### Claim 8 (depends on 7)

The method of claim 7 wherein the rotation device is configured to rotate the SSL at a speed at least sufficient to emulate a generally constant stream of light from the SSL.

### Claim 9 (depends on 8)

The method of claim 8 wherein the rotation device is configured to rotate the SSL at a speed that produces intermittent flashes of light from the SSL.

### Claim 10 (depends on 1)

The method of claim 1 wherein the first SSE is one of a plurality of first SSEs, the second SSE is one of a plurality of second SSEs, and the first TSI is one of a plurality of first TSIs corresponding to the plurality of first and second SSEs.

### Claim 11 (depends on 1)

The method of claim 1 wherein the first SSE is configured to emit a first color of light and the second SSE is configured to emit a second color of light different from the first color of light.

### Claim 12 (depends on 1)

The method of claim 1, further comprising:
disposing a first converter material at least partially over the first SSE; and
disposing a second converter material different from the first converter material at least partially over the second SSE.

### Claim 13 (depends on 1)

The method of claim 1, further comprising:
mounting at least one additional SSE to a third surface of the carrier substrate,
wherein the first TSI is electrically coupled to the additional SSE.

### Claim 14

A method of forming a solid state light (SSL), comprising:
providing a carrier substrate having a first electrically insulative material at a first surface of the carrier substrate, a second electrically insulative material at a second surface opposite the first surface, a first through substrate interconnect (TSI) extending from the first surface to the second surface, and a second TSI extending from the first surface to the second surface;
disposing a first reflective material in direct contact with the first electrically insulative material;
mounting a first solid state emitter (SSE) over the first reflective material and overlapping the first TSI and electrically coupling the first SSE to the first and second TSIs;
disposing a second reflective material in direct contact with the second electrically insulative material; and
mounting a second SSE over the second reflective material overlapping the first TSI and electrically coupling the second SSE to the first and second TSIs.

### Claim 15 (depends on 14)

The method of claim 14, wherein the first and second TSIs are electrically coupled to the second TSI with respective first and second conductive members.

### Claim 16 (depends on 15)

The method of claim 15, wherein the first and second conductive members comprise wirebonds.

### Claim 17 (depends on 14)

The method of claim 14 wherein the carrier substrate comprises aluminum nitride.

### Claim 18 (depends on 14)

The method of claim 14 wherein the first SSE is configured to emit a first color of light and the second SSE is configured to emit a second color of light different from the first color of light.

### Claim 19 (depends on 14)

The method of claim 14, further comprising:
disposing a first converter material at least partially over the first SSE; and
disposing a second converter material different from the first converter material at least partially over the second SSE.

### Claim 20

A method of forming a solid state light (SSL), comprising:
providing a carrier substrate having a first electrically insulative material at a first surface of the carrier substrate, a second electrically insulative material at a second surface different from the first surface, a first through substrate interconnect (TSI) extending from the first surface to the second surface, and a second TSI extending from the first surface to the second surface;
disposing a first reflective material in direct contact with the first electrically insulative material;
mounting a first solid state emitter (SSE) over the first reflective material overlapping the first TSI and electrically coupling the first SSE to the first and second TSIs;
disposing a second reflective material in direct contact with the second electrically insulative material; and
mounting a second SSE over the reflective material overlapping the first TSI and electrically coupling the second SSE to the first and second TSIs.