Composite integrated film, composite integrated film supply wafer, and semiconductor composite device

A semiconductor composite device,

• a circuit board;
• and
• a plurality of composite integrated films,
• wherein each of the plurality of composite integrated films includes:
• a base member thin film having a base member first surface and a base member second surface facing each other;
• one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film;
• one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side;
• and
• one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes,
• wherein the electrode surface and the base member second surface form a same flat surface;
• wherein the circuit board includes:
• a drive circuit that selectively drives a plurality of the elements,
• a plurality of first direction wires,
• a plurality of second direction wires, and
• a plurality of connection pads each being electrically connected to the first direction wire or the second direction wire;
• wherein the electrode surfaces of the composite integrated films are joined to the connection pads of the circuit board by intermolecular forces;
• wherein at least a part of the base member second surface of the composite integrated film is joined to a front surface of the circuit board by intermolecular forces;
• and
• wherein the circuit board includes sub-connection pads that are joined to the base member second surfaces by intermolecular forces without being joined to the electrode surfaces of the composite integrated films.