# US 12,191,278 B2 · Method for manufacturing electronic component

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- Number: US 12,191,278 B2
- Document ID: US12191278B2
- Status: Granted
- Kind: B2
- Application number: 17/839,182
- Filed: 2022-06-13
- Published: 2022-09-29
- Granted: 2025-01-07
- Earliest claimed: 2019-12-13
- Assignees: Connectec America, Inc.; CONNECTEC JAPAN Corporation
- Applicants: Connectec America, Inc.; Connectec Japan Corporation
- Inventors: Katsunori Hirata; Nozomi Shimoishizaka; Takahiro Nakano
- Web page: https://patentgrep.com/patent/US12191278B2

## CPC

- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/013: {of die-attach connectors}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 72/01223: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01333: {in liquid form, e.g. spin coating, spray coating or immersion coating}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/223: {characterised by the structure of the outermost layers, e.g. multilayered coatings}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/245: {of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/354: {comprising polymers}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A manufacturing method comprises preparing a bonding substrate having bumps thereon; preparing a mounted member having external conductive members; applying a fixing material to the surface of the bonding substrate and/or to a surface of the mounted member; and fixing the bonding substrate and the mounted member with the fixing material such that the bumps contact the external conductive members. The fixing material is prepared to contain a first compound and a second compound, each having respective viscosities which change depending on their respective temperature profiles; and applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing comprises pressing the bonding substrate against the mounted member when the fixing material has a temperature lower than the first temperature; and heating the fixing material to a temperature higher than the second temperature and curing the fixed material.

## Claims

### Claim 1

A method for manufacturing an electronic component, the method comprising:
a step of preparing a bonding substrate on which a plurality of bumps are provided;
a step of preparing a mounted member that has a plurality of external conductive members;
a step of applying a fixing material to a surface of the bonding substrate on which the bumps have been formed and/or to a surface of the mounted member on which the external conductive members have been formed; and
a step for pressing the bonding substrate against the mounted member such that the bumps and the external conductive members come into contact and fixing the bonding substrate and the mounted member with the fixing material,
wherein the step of applying the fixing material comprises:
a step of preparing as the fixing material a material containing a first base compound having a characteristic of viscosity which changes depending on the temperature and a second base compound having a characteristic of viscosity which changes depending on the temperature, the first base compound having a first viscosity at a first temperature, the first base compound having the lowest viscosity at the first temperature, the second base compound having a second viscosity at a second temperature higher than the first temperature, the second base compound having the lowest viscosity at the second temperature, and the fixing material having a viscosity higher than the first viscosity and the second viscosity at a third temperature lower than the first temperature, and having a characteristic of being cured at a fourth temperature higher than the second temperature; and
a step of applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than the first temperature, and
wherein the fixing step comprises:
a step of pressing the bonding substrate against the mounted member when the temperature of the fixing material is lower than the first temperature; and
a step of heating the fixing material to a temperature higher than the second temperature to cure the fixed material.