# US 12,191,276 B2 · Mounting apparatus

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- Number: US 12,191,276 B2
- Document ID: US12191276B2
- Status: Granted
- Kind: B2
- Application number: 17/642,948
- Filed: 2020-07-16
- Published: 2022-12-29
- Granted: 2025-01-07
- Earliest claimed: 2020-07-16
- Assignees: Kabushiki Kaisha Shinkawa
- Applicants: Shinkawa Ltd.
- Inventors: Alexander Dzhangirov; Kohei Seyama
- Web page: https://patentgrep.com/patent/US12191276B2

## CPC

- H10W 72/0711: {Apparatus therefor}
- H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07152: {Means for cooling}
- H10W 72/07168: {Means for storing or moving the material for the connector}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.

## Claims

### Claim 1

A mounting apparatus pressing a semiconductor chip arranged on a mounted body, the mounting apparatus comprising:
a bonding stage, holding the mounted body on which the semiconductor chip is arranged;
a base stand, supporting the bonding stage;
a mounting head, moving in a contacting/separating direction with respect to the mounted body and to which a pressing tool that presses the semiconductor chip on the mounted body is mounted on the tip; and
a film arranging mechanism, provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip and the pressing tool,
wherein the film arranging mechanism comprises:
film guides guiding the cover film, the film guide comprising a contact portion that contacts the bonding stage and defining a height of the cover film with respect to the bonding stage; and
lifting mechanisms, connected to the film guides via elastic members and lifting and lowering the film guides with respect to the bonding stage, wherein the lifting mechanism comprises a guide rail, sharing a base with the film arrangement mechanism in order that the lifting mechanism is able to move in an up-and-down direction along the guide rail affecting the height of the cover film with respect to the bonding stage.

### Claim 2 (depends on 1)

The mounting apparatus according to claim 1,
wherein the film guides and the lifting mechanisms are each provided at two sides of the bonding stage with the bonding stage sandwiched in between.

### Claim 3 (depends on 2)

The mounting apparatus according to claim 2,
wherein the film arranging mechanism comprises a linking member linking between the film guides each provided at the two sides of the bonding stage with the bonding stage sandwiched in between.

### Claim 4 (depends on 1)

The mounting apparatus according to claim 1,
wherein the lifting mechanism further comprises:
a slider, guided by the guide rail and moving in the up-and-down direction; and
a connecting member in which one end is mounted on the slider via the elastic members so as to be relatively movable in the up-and-down direction by a predetermined vertical width and the film guide is mounted on another end,
wherein the slider, when the contact portion of the film guide comes into contact with an upper surface of the bonding stage, presses the film guide on the upper surface of the bonding stage via the elastic members and the connecting member.

### Claim 5 (depends on 4)

The mounting apparatus according to claim 4,
wherein the film arranging mechanism comprises:
a film delivering mechanism, comprising a pair of rollers which are provided on the base stand at the two sides of the bonding stage with the bonding stage sandwiched in between and on which the cover film is hung, and sequentially delivering the new cover film, and
wherein the film delivering mechanism comprises a base supporting each of the rollers, and
the guide rail of the lifting mechanism is mounted on the base.

### Claim 6 (depends on 2)

The mounting apparatus according to claim 2,
wherein the film arranging mechanism comprises:
a one-side film guide and a one-side lifting mechanism, provided at one side of the bonding stage; and
an another-side film guide and an another-side lifting mechanism, provided at another side of the bonding stage, and
wherein the one-side lifting mechanism comprises:
the guide rail, provided on the base stand at one side and extending in an up-and-down direction;
a slider, guided by the guide rail and moving in the up-and-down direction; and
a connecting member in which one end is mounted on the slider via the elastic members so as to be relatively movable in the up-and-down direction by a predetermined vertical width and the one-side film guide is mounted on another end,
wherein the another-side lifting mechanism comprises:
an another-side guide rail, provided on the base stand at another side and extending in the up-and-down direction to guide the another-side film guide in the up-and-down direction, and
wherein the film arranging mechanism comprises a linking member linking the one-side film guide and the another-side film guide, and
the slider, when the contact portion of the one-side film guide and the contact portion of the another-side film guide come into contact with an upper surface of the bonding stage, presses the contact portion of the one-side film guide on the upper surface of the bonding stage via the elastic members and the connecting member and presses the contact portion of the another-side film guide on the upper surface of the bonding stage via the linking member.

### Claim 7 (depends on 6)

The mounting apparatus according to claim 6,
wherein the film arranging mechanism comprises:
a film delivering mechanism, comprising a pair of rollers which are provided on the base stand at two sides of the bonding stage with the bonding stage sandwiched in between and on which the cover film is hung, and sequentially delivering the new cover film, and
wherein the film delivering mechanism comprises a base supporting each of the rollers, and
the guide rail is mounted on the base at one side, and the another-side guide rail is mounted on the base at another side.

### Claim 8 (depends on 4)

The mounting apparatus according to claim 4,
wherein the connecting member is a groove-shaped cross-sectional member configured by an upper flange, a lower flange facing the upper flange, and a web connecting between the upper flange and the lower flange, the connecting member comprising:
a slider-guide, extending in the up-and-down direction between the upper flange and the lower flange, and
wherein the slider is guided by the slider-guide so as to be movable with respect to the connecting member in the up-and-down direction between the upper flange and the lower flange, and
the elastic members are provided between a lower end of the slider and an upper surface of the lower flange.

### Claim 9 (depends on 5)

The mounting apparatus according to claim 5,
wherein the film arranging mechanism comprises moving mechanisms moving the film delivering mechanism in a horizontal direction with respect to the bonding stage.

### Claim 10 (depends on 2)

The mounting apparatus according to claim 2,
wherein the lifting mechanism further comprises:
a slider, guided by the guide rail and moving in the up-and-down direction; and
a connecting member in which one end is mounted on the slider via the elastic members so as to be relatively movable in the up-and-down direction by a predetermined vertical width and the film guide is mounted on another end,
wherein the slider, when the contact portion of the film guide comes into contact with an upper surface of the bonding stage, presses the film guide on the upper surface of the bonding stage via the elastic members and the connecting member.

### Claim 11 (depends on 3)

The mounting apparatus according to claim 3,
wherein the lifting mechanism further comprises:
a slider, guided by the guide rail and moving in the up-and-down direction; and
a connecting member in which one end is mounted on the slider via the elastic members so as to be relatively movable in the up-and-down direction by a predetermined vertical width and the film guide is mounted on another end,
wherein the slider, when the contact portion of the film guide comes into contact with an upper surface of the bonding stage, presses the film guide on the upper surface of the bonding stage via the elastic members and the connecting member.

### Claim 12 (depends on 5)

The mounting apparatus according to claim 5,
wherein the connecting member is a groove-shaped cross-sectional member configured by an upper flange, a lower flange facing the upper flange, and a web connecting between the upper flange and the lower flange, the connecting member comprising:
a slider-guide, extending in the up-and-down direction between the upper flange and the lower flange, and
wherein the slider is guided by the slider-guide so as to be movable with respect to the connecting member in the up-and-down direction between the upper flange and the lower flange, and
the elastic members are provided between a lower end of the slider and an upper surface of the lower flange.

### Claim 13 (depends on 6)

The mounting apparatus according to claim 6,
wherein the connecting member is a groove-shaped cross-sectional member configured by an upper flange, a lower flange facing the upper flange, and a web connecting between the upper flange and the lower flange, the connecting member comprising:
a slider-guide, extending in the up-and-down direction between the upper flange and the lower flange, and
wherein the slider is guided by the slider-guide so as to be movable with respect to the connecting member in the up-and-down direction between the upper flange and the lower flange, and
the elastic members are provided between a lower end of the slider and an upper surface of the lower flange.

### Claim 14 (depends on 7)

The mounting apparatus according to claim 7,
wherein the connecting member is a groove-shaped cross-sectional member configured by an upper flange, a lower flange facing the upper flange, and a web connecting between the upper flange and the lower flange, the connecting member comprising:
a slider-guide, extending in the up-and-down direction between the upper flange and the lower flange, and
wherein the slider is guided by the slider-guide so as to be movable with respect to the connecting member in the up-and-down direction between the upper flange and the lower flange, and
the elastic members are provided between a lower end of the slider and an upper surface of the lower flange.

### Claim 15 (depends on 7)

The mounting apparatus according to claim 7,
wherein the film arranging mechanism comprises moving mechanisms moving the film delivering mechanism in a horizontal direction with respect to the bonding stage.