# US 12,191,264 B2 · Thermal performance improvement and stress reduction in semiconductor device modules

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- Number: US 12,191,264 B2
- Document ID: US12191264B2
- Status: Granted
- Kind: B2
- Application number: 17/658,118
- Filed: 2022-04-06
- Published: 2023-10-12
- Granted: 2025-01-07
- Earliest claimed: 2022-04-06
- Assignees: Semiconductor Components Industries, LLC
- Applicants: Semiconductor Components Industries, LLC
- Inventors: Yong Liu; Qing Yang
- Web page: https://patentgrep.com/patent/US12191264B2

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 7/14329: {specially adapted for the configuration of power bus bars}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 74/016: {using moulds}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/00: Package configurations
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.

## Claims

### Claim 1

A semiconductor device module comprising:
a substrate including:
a first ceramic layer; and
a first metal layer disposed on a first surface of the substrate; and
a first semiconductor die, a first side of the first semiconductor die being coupled to the first metal layer;
a second semiconductor die, a first side of the second semiconductor die being coupled to the first metal layer; and
a signal distribution assembly including a second metal layer, the second metal layer having:
a first side, the first side being planar; and
a second side opposite the first side, the second side being non-planar and including:
a base portion;
a first post extending from the base portion, the first post being coupled with a second side of the first semiconductor die opposite the first side of the first semiconductor die; and
a second post extending from the base portion, the second post being coupled with a second side of the second semiconductor die opposite the first side of the second semiconductor die, the signal distribution assembly electrically coupling the first semiconductor die with the second semiconductor die.

### Claim 2 (depends on 1)

The semiconductor device module of claim 1, further comprising a second ceramic layer coupled with the first side of the second metal layer.

### Claim 3 (depends on 2)

The semiconductor device module of claim 2, wherein the second ceramic layer is a thermally conductive ceramic layer that is coupled with the first side of the second metal layer via a thermally conductive epoxy adhesive.

### Claim 4 (depends on 1)

The semiconductor device module of claim 1, wherein:
the signal distribution assembly is pre-molded and includes a molding compound disposed on the second side of the second metal layer;
a surface of the first post that is coupled with the first semiconductor die is exposed through the molding compound; and
a surface of the second post that is coupled with the second semiconductor die is exposed through the molding compound.

### Claim 5 (depends on 1)

The semiconductor device module of claim 1, further comprising:
an insulator layer, a first surface of the insulator layer being coupled with the first side of the second metal layer; and
a third metal layer coupled with a second surface of the insulator layer opposite the first surface of the insulator layer.

### Claim 6 (depends on 5)

The semiconductor device module of claim 5, wherein the insulator layer electrically insulative and thermally conductive.

### Claim 7 (depends on 1)

The semiconductor device module of claim 1, wherein:
the second metal layer has an overall thickness of less than 1 millimeter (mm); and
the first post and the second post have a same height of less than 0.5 mm.

### Claim 8 (depends on 7)

The semiconductor device module of claim 7, wherein the same height is less than 0.2 mm.

### Claim 9 (depends on 1)

The semiconductor device module of claim 1, wherein:
the base portion is a first base portion;
the first base portion, the first post and the second post are included in a first portion of the second metal layer; and
the second metal layer further includes a second portion having:
a second base portion; and
a third post extending from the second base portion, the third post being coupled with the second side of the first semiconductor die.

### Claim 10 (depends on 9)

The semiconductor device module of claim 9, wherein:
the first semiconductor die is one of an insulated-gate bipolar transistor (IGBT) or a metal-oxide-silicon field-effect transistor (MOSFET);
the second semiconductor die is a fast-recovery diode (FRD); and
the first post being coupled with one of an emitter terminal of the IGBT, or with a source terminal of the MOSFET;
the second post being coupled with a cathode of the FRD; and
the third post being coupled with a gate terminal of the IGBT, or with a gate terminal of the MOSFET.

### Claim 11 (depends on 10)

The semiconductor device module of claim 10, wherein the first portion of the second metal layer further includes a fourth post extending from the first base portion, the fourth post being coupled with a signal terminal of a leadframe of the semiconductor device module, the signal terminal being an emitter signal terminal, or a source signal terminal.

### Claim 12 (depends on 10)

The semiconductor device module of claim 10, wherein the first portion of the second metal layer includes a fourth post extending from the first base portion, the fourth post being coupled with a thermal sense signal pin of a leadframe of the semiconductor device module.

### Claim 13 (depends on 10)

The semiconductor device module of claim 10, wherein the second portion of the second metal layer includes a fourth post extending from the second base portion, the fourth post being coupled with a gate signal pin of a leadframe of the semiconductor device module.

### Claim 14 (depends on 10)

The semiconductor device module of claim 10, wherein:
the signal distribution assembly is pre-molded and includes a molding compound disposed on the second side of the second metal layer;
a surface of the first post that is coupled with the first semiconductor die is exposed through the molding compound;
a surface of the second post that is coupled with the second semiconductor die is exposed through the molding compound; and
a surface of the third post that is coupled with the gate terminal of the IGBT, or with the gate terminal of the MOSFET is exposed through the molding compound.

### Claim 15 (depends on 10)

The semiconductor device module of claim 10, wherein:
the first base portion of the second metal layer is coupled with a signal terminal of a leadframe of the semiconductor device module, the signal terminal being an emitter signal terminal, or a source signal terminal;
the first base portion of the second metal layer is further coupled with a thermal sense signal pin of the leadframe; and
the second base portion of the second metal layer is coupled with a gate signal pin of the leadframe.

### Claim 16

A signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly comprising:
a metal layer, the metal layer having:
a first side, the first side being planar; and
a second side opposite the first side, the second side being non-planar and including:
a base portion;
a first post extending from the base portion; and
a second post extending from the base portion; and
a molding compound disposed on the second side of the metal layer, an upper surface of the first post and an upper surface of the second post being exposed through the molding compound; and
a thermally conductive ceramic layer coupled with the first side of the metal layer, the thermally conductive ceramic layer being coupled with the first side of the metal layer via a thermally conductive epoxy adhesive.

### Claim 17 (depends on 16)

The signal distribution assembly of claim 16, wherein:
the base portion is a first base portion;
the first base portion, the first post and the second post are included in a first portion of the metal layer; and
the metal layer further includes a second portion having:
a second base portion; and
a third post extending from the second base portion, an upper surface of the third post being coupled being exposed through the molding compound.

### Claim 18 (depends on 17)

The signal distribution assembly of claim 17, wherein:
the first portion of the metal layer further includes:
a fourth post extending from the first base portion, an upper surface of the fourth post being exposed through the molding compound; and
a fifth post extending from the first base portion, an upper surface of the fourth post being exposed through the molding compound; and
the second portion of the metal layer further includes a sixth post extending from the second base portion, an upper surface of the sixth post being exposed through the molding compound.

### Claim 19

A signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly comprising:
a first metal layer, the first metal layer having:
a first side, the first side being planar; and
a second side opposite the first side, the second side being non-planar and including:
a base portion;
a first post extending from the base portion; and
a second post extending from the base portion; and
a thermally conductive insulator layer, a first surface of the thermally conductive insulator layer being coupled with the first side of the first metal layer; and
a second metal layer coupled with a second surface of the thermally conductive insulator layer opposite the first surface of the thermally conductive insulator layer.

### Claim 20 (depends on 19)

The signal distribution assembly of claim 19, wherein:
the base portion is a first base portion;
the first base portion, the first post and the second post are included in a first portion of the first metal layer; and
the first metal layer further includes a second portion having:
a second base portion; and
a third post extending from the second base portion.