# US 12,191,262 B2 · Package structure and method for fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,262 B2 - Document ID: US12191262B2 - Status: Granted - Kind: B2 - Application number: 18/353,909 - Filed: 2023-07-18 - Published: 2023-11-09 - Granted: 2025-01-07 - Earliest claimed: 2018-07-13 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Ltd. - Inventors: Harry-Hak-Lay Chuang; Chia-Hsiang Chen; Meng-Chun Shih; Ching-Huang Wang; Tien-Wei Chiang - Web page: https://patentgrep.com/patent/US12191262B2 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/287: {materials for magnetic shielding, e.g. ferromagnetic materials} - H10W 70/465: {Bumps or wires} - H10W 74/01: Manufacture or treatment - H10W 74/111: {the semiconductor body being completely enclosed} - H10B 61/00: Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices - H10W 70/40: Leadframes - H10W 72/01551: {Changing the shapes of bond wires} - H10W 72/07352: {changes in structures or sizes} - H10W 72/07511: {Treating the bonding area before connecting, e.g. by applying flux or cleaning} - H10W 72/07521: {Aligning} - H10W 72/07532: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/321: {Structures or relative sizes of die-attach connectors} - H10W 72/354: {comprising polymers} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10B: ELECTRONIC MEMORY DEVICES ## Abstract A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface. ## Claims ### Claim 1 A package structure, comprising: a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, wherein the semiconductor chip comprises: a first surface perpendicular to a thickness direction of the semiconductor chip; a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad; and a third surface connecting the first surface and the second surface; a first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip and facing the third surface of the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective; and a bonding wire electrically connecting the first surface and a lead frame, wherein at least one segment of the first magnetic field shielding is disposed between the bonding wire and the third surface of the semiconductor chip. ### Claim 2 (depends on 1) The package structure of claim 1, wherein the semiconductor chip further includes a fourth surface opposite to the third surface and connecting the first surface and the second surface, and the first magnetic field shielding includes a first sidewall facing the third surface and a second sidewall facing the fourth surface and isolated from the first sidewall. ### Claim 3 (depends on 2) The package structure of claim 2, wherein each of the first sidewall and second sidewall of the first magnetic field shielding is at a position between the first surface of the semiconductor chip and the first portion of the mounting surface from a top perspective view. ### Claim 4 (depends on 1) The package structure of claim 1, wherein the segments are separated from each other. ### Claim 5 (depends on 1) The package structure of claim 1, wherein each of the segments is independently disconnected and in contact with at least one adjacent segment. ### Claim 6 (depends on 1) The package structure of claim 1, wherein each segment is in contact with adjacent segments. ### Claim 7 (depends on 1) The package structure of claim 1, wherein a total area of the mounting surface is greater than a total area of the second surface. ### Claim 8 (depends on 1) The package structure of claim 1, further comprising a molding surrounding the mounting pad, the first magnetic field shielding, the bonding wire and in direct contact with the mounting surface, wherein the first magnetic field shielding is disposed inside the molding. ### Claim 9 (depends on 8) The package structure of claim 8, further comprising a second magnetic field shielding disposed over the mounting surface, the first magnetic field shielding and the semiconductor chip from a top view perspective. ### Claim 10 (depends on 9) The package structure of claim 9, wherein the second magnetic field shielding is surrounded by the molding. ### Claim 11 (depends on 10) The package structure of claim 10, wherein the second magnetic field shielding is attached to the semiconductor chip and spacing between the semiconductor chip and the molding. ### Claim 12 (depends on 1) The package structure of claim 1, further comprising a third magnetic field shielding disposed over the second surface. ### Claim 13 A package structure, comprising: a mounting pad having a mounting surface; a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip comprises: a first surface perpendicular to a thickness direction of the semiconductor chip; a second surface opposite to the first surface and facing the mounting surface; and a plurality of third surfaces connecting the first surface and the second surface; a first magnetic field shielding including a plurality of segments disposed on the mounting surface, and each of the segments faces a corresponding one of the third surfaces; a lead frame adjacent to and separated from the mounting pad; and a bonding wire electrically connecting the semiconductor chip and the lead frame, wherein the bonding wire is in a state of crossing over at least one segment of the first magnetic field shielding, and the segment of the first magnetic field shielding is disposed between the bonding wire and the corresponding one of the third surface. ### Claim 14 (depends on 13) The package structure of claim 13, wherein a height of the first magnetic field shielding is less than a height of the bonding wire, as the height of the bonding wire is measured from the mounting surface to a point on the bonding wire distal to the mounting surface. ### Claim 15 (depends on 14) The package structure of claim 14, further comprising a second magnetic field shielding over the first surface. ### Claim 16 (depends on 15) The package structure of claim 15, wherein the second magnetic field shielding is disposed between the second surface and the mounting surface of the mounting pad. ### Claim 17 A package structure, comprising: a mounting pad having a mounting surface; a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip comprises: a first surface perpendicular to a thickness direction of the semiconductor chip; a second surface opposite to the first surface and facing the mounting surface; and a third surface connecting the first surface and the second surface; a first magnetic field shielding disposed on the mounting surface and facing the third surface of the semiconductor chip; a lead frame adjacent to the mounting pad; a bonding wire electrically connecting the first surface and the lead frame; a molding surrounding the mounting pad, the semiconductor chip, the bonding wire, the first magnetic field shielding and at least a portion of the lead frame; a second magnetic field shielding disposed over the semiconductor chip and the first magnetic field shielding from a top view perspective, and in direct contact with a surface of the molding, and a third magnetic field shielding disposed under the semiconductor chip, wherein the first magnetic field shielding is disposed between the bonding wire and the third surface of the semiconductor chip. ### Claim 18 (depends on 17) The package structure of claim 17, wherein the second magnetic field shielding is in direct contact with an outer surface of the molding. ### Claim 19 (depends on 17) The package structure of claim 17, wherein the first magnetic field shielding includes a plurality of segments disposed adjacent to the semiconductor chip. ### Claim 20 (depends on 17) The package structure of claim 17, wherein the third magnetic field shielding is disposed between the second surface of the semiconductor chip and the mounting surface of the mounting pad or disposed under the mounting pad.