# US 12,191,261 B2 · Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture

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- Number: US 12,191,261 B2
- Document ID: US12191261B2
- Status: Granted
- Kind: B2
- Application number: 17/870,338
- Filed: 2022-07-21
- Published: 2022-11-10
- Granted: 2025-01-07
- Earliest claimed: 2020-03-30
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Po-Yao Chuang; Meng-Wei Chou; Shin-Puu Jeng
- Web page: https://patentgrep.com/patent/US12191261B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/01: Manufacture or treatment
- H10W 74/016: {using moulds}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/124: {the encapsulations having cavities other than that occupied by chips}
- H10W 90/00: Package configurations
- H10W 72/0198: {batch processes}
- H10W 74/10: characterised by their shape or disposition
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Semiconductor devices and method of manufacture are provided. In embodiments a conductive connector is utilized to provide an electrical connection between a substrate and an overlying shield. The conductive connector is placed on the substrate and encapsulated with an encapsulant. Once encapsulated, an opening is formed through the encapsulant to expose a portion of the conductive connector. The shield is deposited through the encapsulant to make an electrical connection to the conductive connector.

## Claims

### Claim 1

A method of manufacturing a semiconductor device, the method comprising:
forming a redistribution substrate, the redistribution substrate comprising sidewalls of a dielectric material, the dielectric material extending from a first side of the redistribution substrate to a second side of the redistribution substrate opposite the first side;
placing a plurality of modules on a first side of the redistribution substrate, the plurality of modules being interconnected through the redistribution substrate, wherein the plurality of modules comprises a first system on chip module, a passive module, a second system on chip module, and an integrated passive device;
placing a conductive connector on the first side of the redistribution substrate;
encapsulating the conductive connector and the plurality of modules with an encapsulant, the encapsulant extending over a second side of the conductive connector, the second side facing away from the redistribution substrate; and
placing a shield through the encapsulant to make physical contact with the conductive connector, wherein the shield located below a topmost surface of the encapsulant forms a “U”-shape, wherein the shield covers the dielectric material from a first side of the redistribution substrate to a second side of the redistribution substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein the conductive connector is a conductive pillar.

### Claim 3 (depends on 2)

The method of claim 2, wherein placing the conductive connector comprises forming a seed layer.

### Claim 4 (depends on 2)

The method of claim 2, wherein placing the conductive connector comprises placing a solder paste.

### Claim 5 (depends on 1)

The method of claim 1, wherein the first system on chip module is adjacent to the conductive connector after the placing the conductive connector.

### Claim 6 (depends on 5)

The method of claim 5, wherein the integrated passive device is adjacent to the first system on chip module.

### Claim 7 (depends on 1)

The method of claim 1, wherein the conductive connector is a conductive cube.

### Claim 8

A method of manufacturing a semiconductor device, the method comprising:
forming a redistribution substrate;
forming a conductive connector in electrical connection with the redistribution substrate, the conductive connector having a first height, a first width, and a first length, the first height being between about 50 μm and about 500 μm, the first width being between about 50 μm and about 500 μm, and the first length being between about 50 μm and about 500 μm;
placing an encapsulant over the redistribution substrate, the encapsulant extending away from the redistribution substrate a first distance larger than the first height, wherein a first module, a second module, a third module, and a fourth module are embedded in the encapsulant and electrically connected to the redistribution substrate, wherein the first module has a first module height of between about 30 μm and about 800 μm, the second module has a second module height of between about 50 μm and about 1000 μm, the second module height being less than the first module height, the third module has a third module height of between about 30 μm and about 800 μm, the third module height being greater than the second module height, and the fourth module has a fourth module height of between about 50 μm and about 1000 μm, the fourth module height being less than the first module height, the second module height, and the third module height; and
placing a shield extending through the encapsulant to make physical contact with the conductive connector and also extending along a top surface of the encapsulant to be located over the first module and the second module.

### Claim 9 (depends on 8)

The method of claim 8, wherein placing the shield places the shield along a sidewall of the encapsulant, the sidewall being at a right angle to the top surface.

### Claim 10 (depends on 8)

The method of claim 8, wherein forming the conductive connector further comprising forming a seed layer adjacent to the redistribution substrate.

### Claim 11 (depends on 10)

The method of claim 10, further comprising recessing the seed layer from a sidewall of the conductive connector.

### Claim 12 (depends on 8)

The method of claim 8, further comprising placing a solder paste adjacent to the redistribution substrate prior to forming the conductive connector.

### Claim 13 (depends on 8)

The method of claim 8, wherein the conductive connector is a copper cube.

### Claim 14 (depends on 8)

The method of claim 8, wherein the conductive connector is a copper pillar.

### Claim 15

A method of manufacturing a semiconductor device, the method comprising:
placing a plurality of modules onto a substrate, wherein the placing the plurality of modules includes a first system on chip module, a passive module, a second system on chip module, and an integrated passive device;
placing a conductive connector onto the substrate;
encapsulating the conductive connector and the plurality of modules with an encapsulant;
forming an opening through the encapsulant to expose at least a portion of the conductive connector; and
depositing a shield layer over the encapsulant and in the opening to make electrical connection with the conductive connector, the shield layer fully covering sidewalls of the substrate, wherein each portion of the sidewalls of the substrate in physical contact with the shield layer is a dielectric material, wherein a height from a side of the substrate opposite the plurality of modules to a side of the shield layer facing away from the encapsulant and over the encapsulant is between about 50 μm and about 2,000 μm.

### Claim 16 (depends on 15)

The method of claim 15, wherein depositing the shield layer is performed prior to any grinding of the encapsulant.

### Claim 17 (depends on 15)

The method of claim 15, wherein placing the conductive connector comprises a pick and place process.

### Claim 18 (depends on 15)

The method of claim 15, wherein placing the conductive connector further comprises:
depositing a seed layer;
patterning a photoresist over the seed layer; and
plating the conductive connector onto the seed layer through the photoresist.

### Claim 19 (depends on 18)

The method of claim 18, further comprising:
removing the photoresist; and
wet etching the seed layer.

### Claim 20 (depends on 19)

The method of claim 19, wherein the wet etching the seed layer recesses the seed layer away from a sidewall of the conductive connector.