# US 12,191,257 B2 · Electrical bridge package with integrated off-bridge photonic channel interface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,257 B2 - Document ID: US12191257B2 - Status: Granted - Kind: B2 - Application number: 18/407,410 - Filed: 2024-01-08 - Published: 2024-05-02 - Granted: 2025-01-07 - Earliest claimed: 2022-07-26 - Assignees: Celestial AI Inc. - Applicants: Celestial AI Inc. - Inventors: Ankur Aggarwal - Web page: https://patentgrep.com/patent/US12191257B2 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - G02B 6/1225: {comprising photonic band-gap structures or photonic lattices} - G02B 6/136: by etching - G02B 6/428: {containing printed circuit boards [PCB]} - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - H10W 70/685: comprising multiple insulating layers - H10W 90/00: Package configurations - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/295: {optical coupling} - H10W 90/722: {between stacked chips} - H10W 90/725: {between a chip and a laterally-adjacent insulating package substrate, interposer or RDL} - H10W 90/791: {of direct-bonded pads} - H10W 90/792: {between multiple chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract A circuit package is described that includes a photonic interposer, a second interposer, and a die partially overlapping and connected to both the photonic interposer and the second interposer. ## Claims ### Claim 1 A circuit package, comprising: a photonic interposer; an electrical interposer; a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the photonic interposer includes a modulator; and a plurality of electrical interconnects between the photonic interposer and the die. ### Claim 2 (depends on 1) The circuit package of claim 1, wherein the modulator is a thermally stable modulator. ### Claim 3 (depends on 2) The circuit package of claim 2, wherein the thermally stable modulator is an electro-absorption modulator (EAM). ### Claim 4 (depends on 1) The circuit package of claim 1, wherein the photonic interposer includes a photodetector. ### Claim 5 (depends on 4) The circuit package of claim 4, wherein the photodetector includes a photodiode. ### Claim 6 (depends on 1) The circuit package of claim 1, wherein one or more of the plurality of electrical interconnects are less than 100 microns in length. ### Claim 7 (depends on 1) The circuit package of claim 1, wherein one or more of the plurality of electrical interconnects is one or more of one or more of soldering bumps, wires, copper pillars, wirebonds, through-substrate vias (TSVs), through-dielectric via (TDVs), re-distribution layers (RDLs), or landing pads. ### Claim 8 (depends on 1) The circuit package of claim 1, wherein the photonic interposer includes a photonic integrated circuit. ### Claim 9 A circuit package, comprising: a photonic interposer; an electrical interposer; a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a driver; and a plurality of electrical interconnects between the photonic interposer and the die. ### Claim 10 (depends on 9) The circuit package of claim 9, wherein the plurality of electrical interconnects includes a first electrical interconnect connecting the photonic interposer to the analog-mixed signal portion, and wherein the driver is connected to a first end of the first electrical interconnect. ### Claim 11 (depends on 10) The circuit package of claim 10, wherein the photonic interposer includes a modulator, wherein the modulator is connected to a second end of the first electrical interconnect. ### Claim 12 A circuit package, comprising: a photonic interposer; an electrical interposer; a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a transimpedance amplifier (TIA); and a plurality of electrical interconnects between the photonic interposer and the die. ### Claim 13 (depends on 12) The circuit package of claim 12, wherein the plurality of electrical interconnects includes a second electrical interconnect connecting the photonic interposer and the analog-mixed signal portion, and wherein the TIA is connected to a first end of the second electrical interconnect. ### Claim 14 (depends on 13) The circuit package of claim 13, wherein the photonic interposer includes a photodetector, and wherein the photodetector is connected to a second end of the second electrical interconnect of the plurality of electrical interconnects. ### Claim 15 A circuit package, comprising: a photonic interposer; an electrical interposer; a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer; a plurality of electrical interconnects between the photonic interposer and the die; and a second die including a processing element, the processing element electrically connected to the electrical interposer. ### Claim 16 (depends on 15) The circuit package of claim 15, wherein the second die is electrically connected to the electronic portion through the electrical interposer. ### Claim 17 (depends on 16) The circuit package of claim 16, wherein the second die is electrically connected to the analog-mixed signal portion through the electronic portion and the electrical interposer. ### Claim 18 (depends on 17) The circuit package of claim 17, wherein the second die is electrically connected to the photonic interposer through the analog-mixed signal portion, the electronic portion, and the electrical interposer. ### Claim 19 (depends on 18) The circuit package of claim 18, wherein the second die is electrically connected to the photonic interposer through a driver in the analog-mixed signal portion. ### Claim 20 (depends on 19) The circuit package of claim 19, wherein the second die is electrically connected to the photonic interposer through a modulator in the photonic interposer. ### Claim 21 (depends on 18) The circuit package of claim 18, wherein the second die is electrically connected to the photonic interposer through the analog-mixed signal portion, the electronic portion, and the electrical interposer and optically connected to a fiber array unit through the photonic interposer. ### Claim 22 A circuit package, comprising: a photonic interposer; an electrical interposer; a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer; a plurality of electrical interconnects between the photonic interposer and the die; and a fiber array unit (FAU) between the photonic interposer and the die. ### Claim 23 (depends on 22) The circuit package of claim 22, wherein one or more of a modulator or a photodetector are connected to the FAU with an FAU connection. ### Claim 24 (depends on 23) The circuit package of claim 23, wherein the FAU connection is a bidirectional channel. ### Claim 25 (depends on 24) The circuit package of claim 24, wherein the bidirectional channel includes one or more waveguides.