# US 12,191,252 B2 · Semiconductor fuse with multi-bond wire > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,252 B2 - Document ID: US12191252B2 - Status: Granted - Kind: B2 - Application number: 17/546,383 - Filed: 2021-12-09 - Published: 2023-06-15 - Granted: 2025-01-07 - Earliest claimed: 2021-12-09 - Assignees: Texas Instruments Incorporated - Applicants: Texas Instruments Incorporated - Inventors: Enis Tuncer - Web page: https://patentgrep.com/patent/US12191252B2 ## CPC - H10W 20/493: {Fuses, i.e. interconnections changeable from conductive to non-conductive} - H10W 72/075: {of bond wires} - H10W 72/50: Bond wires - H10W 74/01: Manufacture or treatment - H10W 74/111: {the semiconductor body being completely enclosed} - H01F 5/04: Arrangements of electric connections to coils, e.g. leads - H01F 27/2804: {Printed windings} - H01F 27/292: {Surface mounted devices} - H01F 27/402: {Association of measuring or protective means} - H10W 72/01551: {Changing the shapes of bond wires} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5434: {the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 90/755: {between a chip and a laterally-adjacent insulating package substrate, interpose or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal. ## Claims ### Claim 1 An electronic device, comprising: a package structure; a conductive terminal extending outside the package structure; a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse; a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal via a ball bond; and a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond. ### Claim 2 An electronic device, comprising: a package structure; a conductive terminal extending outside the package structure; a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse; a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal; a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal; and a third bond wire enclosed by the package structure and having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal. ### Claim 3 (depends on 2) The electronic device of claim 2, wherein: the first end of the second bond wire is bonded to the first end of the first bond wire; and the first end of the third bond wire is bonded to the first end of the second bond wire. ### Claim 4 (depends on 3) The electronic device of claim 3, wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse. ### Claim 5 (depends on 2) The electronic device of claim 2, wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse. ### Claim 6 (depends on 2) The electronic device of claim 2, wherein: the first end of the first bond wire is coupled to the bond pad by a first bond; the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond; the first end of the third bond wire is bonded to the first end of the second bond wire by a third bond; and one the first, second, and third bonds is a ball bond. ### Claim 7 (depends on 6) The electronic device of claim 6, wherein another one the first, second, and third bonds is a stitch bond. ### Claim 8 (depends on 6) The electronic device of claim 6, wherein the first bond is formed on a stud bump. ### Claim 9 (depends on 2) The electronic device of claim 2, wherein the semiconductor die comprises a protected circuit coupled to a second portion of the fuse. ### Claim 10 (depends on 2) The electronic device of claim 2, wherein: the first end of the first bond wire is coupled to the bond pad by a first bond; the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond; and one the first and second bonds is a ball bond. ### Claim 11 (depends on 10) The electronic device of claim 10, wherein the other one the first and second bonds is a stitch bond. ### Claim 12 (depends on 10) The electronic device of claim 10, wherein the first bond is formed on a stud bump. ### Claim 13 A fuse circuit, comprising: a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit; a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal via a ball bond; and a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond. ### Claim 14 A fuse circuit, comprising: a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit; a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal; and a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal; and a third bond wire having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal. ### Claim 15 (depends on 14) The fuse circuit of claim 14, wherein: the first end of the first bond wire is coupled to the bond pad by a first bond; the first end of the second bond wire is bonded to the first end of the first bond wire by a second bond; and one the first and second bonds is a ball bond. ### Claim 16 (depends on 14) The fuse circuit of claim 14, wherein the first end of the first bond wire coupled to the bond pad by a stud bump. ### Claim 17 A method for fabricating an electronic device, the method comprising: attaching a semiconductor die to a die attach pad; performing a wire bonding process that includes: coupling a first end of a first bond wire to the bond pad, and coupling a second end of the first bond wire to a conductive terminal, and coupling a first end of a second bond wire to the first end of the first bond wire, and coupling a second end of the second bond wire to the conductive terminal; and performing a molding process that encloses the semiconductor die, the first and second bond wires, and a portion of the conductive terminal in a package structure. ### Claim 18 (depends on 17) The method of claim 17, wherein: the wire bonding process further includes coupling a first end of a third bond wire to the first end of the second bond wire, and coupling a second end of the third bond wire to the conductive terminal; and the molding process encloses the third bond wire in the package structure. ### Claim 19 (depends on 17) The method of claim 17, wherein the wire bonding process includes: forming a stud bump on the bond pad; and coupling the first end of the first bond wire to the stud bump. ### Claim 20 (depends on 17) The method of claim 17, wherein coupling the first end of the second bond wire to the first end of the first bond wire includes ball bonding or stitch bonding the first end of the second bond wire to the first end of the first bond wire. ### Claim 21 An electronic device, comprising: a package structure; a conductive terminal extending outside the package structure; a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse; a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a stud bump on the conductive terminal; and a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to another stud bump on the conductive terminal.