# US 12,191,243 B2 · Cantilevered power planes to provide a return current path for high-speed signals

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- Number: US 12,191,243 B2
- Document ID: US12191243B2
- Status: Granted
- Kind: B2
- Application number: 17/743,723
- Filed: 2022-05-13
- Published: 2023-11-16
- Granted: 2025-01-07
- Earliest claimed: 2022-05-13
- Assignees: Avago Technologies International Sales Pte. Limited
- Applicants: Avago Technologies International Sales Pte. Limited
- Inventors: Arun Ramakrishnan; Dharmendra Saraswat; Reza Sharifi; Sam Zhao; Sam Karikalan; Mayank Mayukh; Liming Tsau
- Web page: https://patentgrep.com/patent/US12191243B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 44/243: {for decoupling, e.g. bypass capacitors}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/072: {of bump connectors}
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Novel tools and techniques are provided for implementing cantilevered power planes to provide a return current path for high-speed signals. In various embodiments, a semiconductor package includes a substrate core, a plurality of layers, and an AC coupler(s). The plurality of layers includes power, ground, and signal layers each layer disposed on or above the substrate core, each signal layer being disposed between a power layer and a ground layer, the power layer and the ground layer each providing a return path for high frequency (e.g., 1 kHz or greater) signals carried by each signal layer. Each dielectric layer is disposed between and in contact with a pair of power, ground, or signal layer. The AC coupler(s) is coupled to each of a power layer(s) and a ground layer(s), without any portion of any power layer that is near an edge of the substrate core being anchored to the substrate core.

## Claims

### Claim 1

A semiconductor package, comprising:
a semiconductor substrate comprising:
a core layer;
a first plurality of layers disposed on or above the core layer, the first plurality of layers comprising:
one or more first power layers disposed on or above the core layer;
one or more first ground layers disposed on or above the core layer;
one or more first signal layers disposed on or above the core layer, each signal layer among the one or more first signal layers being disposed between a closest power layer among the one or more first power layers and a closest ground layer among the one or more first ground layers, the closest power layer and the closest ground layer each providing a return path for high frequency signals carried by said each signal layer; and
a plurality of first dielectric layers, each dielectric layer being disposed between and in contact with two of a power layer among the one or more first power layers, a ground layer among the one or more first ground layers, or a signal layer among the one or more first signal layers; and
at least one alternating current (“AC”) coupler coupled to each of at least one power layer among the one or more first power layers and at least one ground layer among the one or more first ground layers, without any portion of any of the one or more first power layers that is within a first distance from an edge of the core layer being anchored to the core layer, the first distance being half a distance between the edge of the core layer and a closest edge of one of a semiconductor chip or a mount for the chip that is mounted on or above the semiconductor substrate.

### Claim 2 (depends on 1)

The semiconductor package of claim 1, wherein each AC coupler among the at least one AC coupler is configured to reduce noise signals carried by each of the at least one first power layer to which it is coupled.

### Claim 3 (depends on 1)

The semiconductor package of claim 1, wherein the at least one AC coupler is disposed on or above the first plurality of layers, wherein the at least one AC coupler each comprises one of one or more capacitors, one or more inductors, one or more metal traces, one or more small gaps, one or more dielectric materials, or one or more structures with dielectric sub-structures.

### Claim 4 (depends on 1)

The semiconductor package of claim 1, wherein at least a portion of the at least one AC coupler is disposed within the first plurality of layers, wherein the at least a portion of the at least one AC coupler each comprises one of one or more capacitors, one or more inductors, one or more metal traces, one or more small gaps, one or more vias, one or more dielectric materials, or one or more structures with dielectric sub-structures.

### Claim 5 (depends on 1)

The semiconductor package of claim 1, wherein the closest power layer and the closest ground layer to each signal layer each provides a return path for high frequency signals carried by said each signal layer based on magnetic induction.

### Claim 6 (depends on 1)

The semiconductor package of claim 1, wherein the first plurality of layers further comprises a solder mask layer as a top-most layer among other layers of the first plurality of layers, wherein the semiconductor package further comprises:
the semiconductor chip that is mounted on or above the top-most layer of the first plurality of layers; and
at least one decoupling capacitor that is mounted on or above the top-most layer of the first plurality of layers in proximity to the semiconductor chip, the at least one decoupling capacitor being coupled to a top-most power layer among the one or more first power layers and a ground layer among the one or more first ground layers, the at least one decoupling capacitor being configured to reduce or prevent rapid power supply fluctuations.

### Claim 7 (depends on 1)

The semiconductor package of claim 1, wherein the core layer comprises a top surface and a bottom surface, wherein the first plurality of layers is disposed on or above the top surface of the core layer, wherein the semiconductor package further comprises:
a second plurality of layers disposed on or below the bottom surface of the core layer, the second plurality of layers comprising:
one or more second power layers disposed on or below the core layer;
one or more second ground layers disposed on or below the core layer;
one or more second signal layers disposed on or below the core layer, each signal layer among the one or more second signal layers being disposed between a closest power layer among the one or more second power layers and a closest ground layer among the one or more second ground layers, the closest power 11 layer and the closest ground layer each providing a return path for high 12 frequency signals carried by said each signal layer; and
a plurality of second dielectric layers, each dielectric layer being disposed between and in contact with two of a power layer among the one or more second power layers, a ground layer among the one or more second ground layers, or a signal layer among the one or more second signal layers; and
at least one signal anchor disposed on or below a bottom-most layer of the second plurality of layers that is furthest from the core layer, the at least one signal anchor being connected to the one or more signal layers of the first plurality of layers and the one or more second signal layers of the second plurality of layers near the edge of the 21 core layer and through the core layer, thereby anchoring the one or more signal layers 22 of the first plurality of layers and the one or more second signal layers of the second plurality of layers that are near the edge of the core layer to the core layer; and
at least one ground anchor disposed on or below the bottom-most layer of the second plurality of layers, the at least one ground anchor being connected to the one or more ground layers of the first plurality of layers and the one or more second ground layers of the second plurality of layers near the edge of the core layer and through the core layer, thereby anchoring the one or more ground layers of the first plurality of layers and the one or more second ground layers of the second plurality of layers that are near the edge of the core layer to the core layer.

### Claim 8 (depends on 7)

The semiconductor package of claim 7, wherein the at least one AC coupler is coupled to two or more of the at least one power layer among the one or more first power layers, the at least one ground layer among the one or more first ground layers, at least one power layer among the one or more second power layers, or at least one ground layer among the one or more second ground layers, without any portion of any of the one or more first power layers and the one or more second power layers that is near the edge of the core layer being anchored to the core layer.

### Claim 9 (depends on 7)

The semiconductor package of claim 7, wherein a ground layer of the one or more first ground layers is at least one of a top-most layer of the first plurality of layers and a bottom-most layer of the first plurality of layers, wherein a ground layer of the one or more second ground layers is at least one of a top-most layer of the second plurality of layers and a bottom-most layer of the second plurality of layers.

### Claim 10 (depends on 1)

The semiconductor package of claim 1, wherein the first plurality of layers comprises:
a first ground layer among the one or more first ground layers that is disposed on or above the core layer;
a first dielectric layer among the one or more first dielectric layers on the first ground layer;
a first power layer among the one or more first power layers that is disposed on the first dielectric layer;
a second dielectric layer among the one or more first dielectric layers on the first power layer;
a first signal layer among the one or more first signal layers that is disposed on the second dielectric layer;
a third dielectric layer among the one or more first dielectric layers on the first signal layer;
a second ground layer among the one or more first ground layers that is disposed on the third dielectric layer;
a fourth dielectric layer among the one or more first dielectric layers on the second ground layer;
a second signal layer among the one or more first signal layers that is disposed on the fourth dielectric layer;
a fifth dielectric layer among the one or more first dielectric layers on the second signal layer;
a second power layer among the one or more first power layers that is disposed on the fifth dielectric layer;
a sixth dielectric layer among the one or more first dielectric layers on the second power layer;
a third signal layer among the one or more first signal layers that is disposed on the sixth dielectric layer;
a seventh dielectric layer among the one or more first dielectric layers on the third signal layer; and
a third ground layer among the one or more first ground layers that is disposed on the seventh dielectric layer;
wherein the first power layer and the second ground layer each provides a return path for high frequency signals carried by the first signal layer, wherein the second ground layer and the second power layer each provides a return path for high frequency signals carried by the second signal layer, wherein the second power layer and the third ground layer each provides a return path for high frequency signals carried by the third signal layer.

### Claim 11

A method, comprising:
forming a first plurality of layers disposed on or above a core layer of a semiconductor substrate, comprising:
forming a first ground layer among one or more first ground layers on the core layer;
forming a first dielectric layer among one or more first dielectric layers on the first ground layer;
forming a first power layer among one or more first power layers on the first dielectric layer;
forming a second dielectric layer among the one or more first dielectric layers on the first power layer;
forming a first signal layer among one or more first signal layers on the second dielectric layer;
forming a third dielectric layer among the one or more first dielectric layers on the first signal layer; and
forming a second ground layer among the one or more first ground layers on the third dielectric layer, wherein the first power layer and the second ground layer each provides a return path for high frequency signals carried by the first 18 signal layer; and
mounting at least one alternating current (“AC”) coupler on or above the first plurality of layers and coupling the at least one AC coupler to each of at least one power layer among the one or more first power layers and at least one ground layer among the one or more first ground layers, without any portion of any of the one or more first power layers that within a first distance from an edge of the core layer being anchored to the core layer, the first distance being half a distance between the edge of the core layer and a closest edge of one of a semiconductor chip or a mount for the chip that is mounted on or above the semiconductor substrate.

### Claim 12 (depends on 11)

The method of claim 11, wherein each AC coupler among the at least one AC coupler is configured to reduce noise signals carried by each of the at least one power layer to which it is coupled.

### Claim 13 (depends on 11)

The method of claim 11, wherein the at least one AC coupler each comprises one of one or more capacitors, one or more inductors, one or more metal traces, one or more small gaps, one or more dielectric materials, or one or more structures with dielectric sub-structures.

### Claim 14 (depends on 11)

The method of claim 11, wherein at least a portion of the at least one AC coupler is disposed within the first plurality of layers, wherein the at least a portion of the at least one AC coupler each comprises one of one or more capacitors, one or more inductors, one or more metal traces, one or more small gaps, one or more vias, one or more dielectric materials, or one or more structures with dielectric sub-structures.

### Claim 15 (depends on 11)

The method of claim 11, further comprising:
forming a solder mask layer as a top-most layer among other layers of the first plurality of layers;
mounting the semiconductor chip on or above the top-most layer of the first plurality of layers; and
mounting at least one decoupling capacitor on or above the top-most layer of the first plurality of layers in proximity to the semiconductor chip, the at least one decoupling capacitor being coupled to a top-most power layer among the one or more first power layers and a ground layer among the one or more first ground layers, the at least one decoupling capacitor being configured to reduce or prevent rapid power supply fluctuations.

### Claim 16 (depends on 11)

The method of claim 11, wherein forming the first plurality of layers further comprises:
forming a fourth dielectric layer among one or more first dielectric layers on the second ground layer;
forming a second signal layer among one or more first signal layers on the fourth dielectric layer;
forming a fifth dielectric layer among the one or more first dielectric layers on the second signal layer;
forming a second power layer among one or more first power layers on the fifth dielectric layer;
forming a sixth dielectric layer among the one or more first dielectric layers on the second power layer;
forming a third signal layer among one or more first signal layers on the sixth dielectric layer;
forming a seventh dielectric layer among the one or more first dielectric layers on the third signal layer; and
forming a third ground layer among the one or more first ground layers on the seventh dielectric layer;
wherein the second ground layer and the second power layer each provides a return path for high frequency signals carried by the second signal layer, wherein the second power layer and the third ground layer each provides a return path for high frequency signals carried by the third signal layer.

### Claim 17 (depends on 11)

The method of claim 11, wherein the core layer comprises a top surface and a bottom surface, wherein the first plurality of layers is disposed on or above the top surface of the core layer, wherein the method further comprises:
forming a second plurality of layers disposed on or below the core layer, comprising:
rotating the semiconductor package such that the bottom surface of the core layer faces upward;
forming a first ground layer among one or more second ground layers on or above the bottom surface of the core layer;
forming a first dielectric layer among one or more second dielectric layers on the first ground layer;
forming a first power layer among one or more second power layers on the first dielectric layer;
forming a second dielectric layer among the one or more second dielectric layers on the first power layer;
forming a first signal layer among one or more second signal layers on the second dielectric layer;
forming a third dielectric layer among the one or more second dielectric layers on the first signal layer; and
forming a second ground layer among the one or more second ground layers on the third dielectric layer, wherein the first power layer and the second ground layer each provides a return path for high frequency signals carried by the first signal layer.

### Claim 18 (depends on 17)

The method of claim 17, wherein the at least one AC coupler is coupled to two or more of the at least one power layer among the one or more first power layers, the at least one ground layer among the one or more first ground layers, at least one power layer among the one or more second power layers, or at least one ground layer among the one or more second ground layers, without any portion of any of the one or more first power layers and the one or more second power layers that is near the edge of the core layer being anchored to the core layer.

### Claim 19 (depends on 17)

The method of claim 17, further comprising:
forming a solder mask layer as a bottom-most layer among other layers of the second plurality of layers that is furthest from the core layer, when the semiconductor package is rotated such that the first plurality of layers is facing upward and the second plurality of layers is facing downward;
forming at least one first solder anchor as at least one signal anchor on or above the bottom-most layer of the second plurality of layers, the at least one signal anchor being connected, using corresponding at least one anchor via, to the one or more signal layers of the first plurality of layers and the one or more second signal layers of the second plurality of layers near the edge of the core layer and through the core layer, thereby anchoring the one or more signal layers of the first plurality of layers and the one or more second signal layers of the second plurality of layers that are near the edge of the core layer to the core layer;
forming at least one second solder anchor as at least one ground anchor on or above the bottom-most layer of the second plurality of layers, the at least one ground anchor being connected, using corresponding at least one anchor via, to the one or more ground layers of the first plurality of layers and the one or more second ground layers of the second plurality of layers near the edge of the core layer and through the core layer, thereby anchoring the one or more ground layers of the first plurality of layers and the one or more second ground layers of the second plurality of layers that are near the edge of the core layer to the core layer.

### Claim 20 (depends on 19)

The method of claim 19, wherein each of the at least one anchor via is formed by a process comprising one of:
forming a hole through all intervening layers among the first and second plurality of layers and filling the hole with a conductive material, wherein a corresponding one of the at least one signal anchor or the at least one ground anchor is formed to make contact with the conductive material; or
forming a hole through each intervening layer among the first and second plurality of layers and filling the hole with a conductive material after each intervening layer has been formed and before a next intervening layer is formed, and repeating hole formation and hole filling until all the at least one anchor via has been formed in all intervening layers, wherein a corresponding one of the at least one signal anchor or the at least one ground anchor is formed to make contact with the conductive material.