# US 12,191,241 B2 · Fine pitch copper pillar package and method

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- Number: US 12,191,241 B2
- Document ID: US12191241B2
- Status: Granted
- Kind: B2
- Application number: 17/397,259
- Filed: 2021-08-09
- Published: 2022-06-16
- Granted: 2025-01-07
- Earliest claimed: 2009-03-30
- Assignees: Amkor Technology Singapore Holding Pte. Ltd.
- Applicants: Amkor Technology Singapore Holding Pte. Ltd.
- Inventors: Robert Francis Darveaux; David McCann; John McCormick; Louis W. Nicholls
- Web page: https://patentgrep.com/patent/US12191241B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/00: Apparatus or processes for manufacturing printed circuits
- H10W 70/69: Insulating materials thereof
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/0367: Metallic bump or raised conductor not used as solder bump
- H05K 2201/10977: Encapsulated connections
- H05K 2203/0415: Small preforms other than balls, e.g. discs, cylinders or pillars
- H10W 70/654: Top-view layouts
- H10W 72/01235: {by plating, e.g. electroless plating or electroplating}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/221: {Structures or relative sizes}
- H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/387: {Flow barriers}
- H10W 72/921: {Structures or relative sizes of bond pads}
- H10W 72/922: {Bond pads being integral with underlying chip-level interconnections}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

## Claims

### Claim 1

An electronic component assembly comprising:
an electronic component comprising a pad, the pad comprising a longitudinal pad length and a latitudinal pad width; and
a conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width, the conductive pillar having a first end, a second end, and a planar side extending entirely across the latitudinal pillar width between the first end and the second end, the first end coupled to the pad, the second end coupled on a trace via solder, wherein the solder is directly coupled to both the second end of the conductive pillar and the trace without contacting any pads,
wherein:
a latitudinal width of at least a portion of the solder directly between the second end of the conductive pillar and the trace is greater than a latitudinal width of the trace directly coupled to the solder;
the latitudinal pillar width is greater than the latitudinal width of the trace;
the longitudinal pillar length is at least double the latitudinal pillar width of the planar side;
the latitudinal pad width is different from the latitudinal pillar width;
the longitudinal pad length is different from the longitudinal pillar length; and
a majority of the planar side of the conductive pillar is free of solder.

### Claim 2 (depends on 1)

The electronic component assembly of claim 1, wherein an end surface of the conductive pillar is covered with reflowed solder while the planar side of the conductive pillar is substantially free of solder.

### Claim 3 (depends on 1)

The electronic component assembly of claim 1, wherein the conductive pillar comprises a solder capped copper pillar.

### Claim 4 (depends on 1)

The electronic component assembly of claim 1, wherein the electronic component comprises a chip, and the pad comprises a bond-pad of the chip.

### Claim 5 (depends on 1)

The electronic component assembly of claim 1, wherein:
the electronic component comprises a chip, the chip comprising a bond-pad and a metallization structure electrically coupled to the bond-pad; and
the pad comprises a terminal of the metallization structure laterally displaced from the bond-pad.

### Claim 6 (depends on 1)

The electronic component assembly of claim 1, wherein the conductive pillar is one of a plurality of conductive pillars arranged in a staggered configuration.

### Claim 7 (depends on 1)

The electronic component assembly of claim 1, wherein:
the electronic component comprises a second pad that is latitudinally adjacent to the pad, and wherein the second pad and the pad are aligned in a latitudinal direction; and
the latitudinal pad width is greater than a latitudinal distance between the pad and the second pad.

### Claim 8 (depends on 1)

The electronic component assembly of claim 1, wherein the conductive pillar is coupled to the pad through an under bump metallization.

### Claim 9 (depends on 1)

The electronic component assembly of claim 1, wherein:
the pad comprises a first longitudinal pad axis; and
the electronic component comprises a second pad comprising a second longitudinal pad axis that is angled at a diagonal relative to the first longitudinal pad axis.

### Claim 10

An electronic component assembly comprising:
an electronic component comprising a pad, the pad comprising a first pad side facing away from the electronic component, the first pad side comprising an exposed area having a longitudinal pad length and a latitudinal pad width; and
a conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width, the conductive pillar having a first end and a second end, the first end coupled to the pad, the second end coupled on a trace via solder, wherein the solder is directly coupled to both the second end of the conductive pillar and the trace without contacting any pads,
wherein:
a latitudinal width of the trace is narrower than the latitudinal pad width;
the latitudinal pillar width is greater than the latitudinal width of the trace;
the latitudinal pillar width is less than the longitudinal pillar length;
the latitudinal pad width is different from the latitudinal pillar width;
the longitudinal pad length is different from the longitudinal pillar length; and
a majority of a lateral side of the conductive pillar is free of solder.

### Claim 11 (depends on 10)

The electronic component assembly of claim 10, wherein an end surface of the conductive pillar is covered with reflowed solder while the lateral side of the conductive pillar is substantially free of solder.

### Claim 12 (depends on 10)

The electronic component assembly of claim 10, wherein the electronic component comprises a chip, and the pad comprises a bond-pad of the chip.

### Claim 13 (depends on 10)

The electronic component assembly of claim 10, wherein the conductive pillar comprises a solder capped copper pillar.

### Claim 14 (depends on 10)

The electronic component assembly of claim 10, wherein a latitudinal width of at least a portion of the solder directly between the second end of the conductive pillar and the trace is greater than the latitudinal width of the trace directly coupled to the solder.

### Claim 15

An electronic component assembly comprising:
an electronic component comprising:
a first conductor on a first side of the electronic component;
a non-conductive material surrounding the first conductor such that a first surface area of the first conductor is exposed from the non-conductive material, where the first surface area comprises a first longitudinal length and a first latitudinal width; and
a second conductor that is latitudinally adjacent to the first conductor, and wherein the second conductor and the first conductor are aligned in a latitudinal direction; and
a conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width, the conductive pillar having a first end and a second end, the first end coupled to the first surface area, the second end coupled on a trace via solder, wherein the solder is directly coupled to both the second end of the conductive pillar and the trace without contacting any pads,
wherein:
the latitudinal pillar width is greater than a latitudinal width of the trace;
the latitudinal pillar width is less than the longitudinal pillar length;
the first latitudinal width is different from the latitudinal pillar width;
the first longitudinal length is different from the longitudinal pillar length;
a majority of a lateral side of the conductive pillar is free of solder; and
the first latitudinal width is greater than a latitudinal distance between the first conductor and the second conductor aligned in the latitudinal direction.

### Claim 16 (depends on 15)

The electronic component assembly of claim 15, wherein the conductive pillar is plated directly on the first surface area.

### Claim 17 (depends on 15)

The electronic component assembly of claim 15, wherein the conductive pillar is one of a plurality of conductive pillars arranged in a staggered configuration.

### Claim 18 (depends on 15)

The electronic component assembly of claim 15, wherein the conductive pillar comprises a solder capped copper pillar.

### Claim 19 (depends on 15)

The electronic component assembly of claim 15, wherein no portion of the first conductor protrudes from the non-conductive material.

### Claim 20 (depends on 15)

The electronic component assembly of claim 15, wherein the first surface area of the first conductor corresponds to an entirety of a first side of the first conductor.

### Claim 21 (depends on 15)

The electronic component assembly of claim 15, comprising a dielectric material that contacts and laterally surrounds an entirety of the conductive pillar, and contacts the first surface area.

### Claim 22 (depends on 15)

The electronic component assembly of claim 15, wherein a latitudinal width of at least a portion of the solder directly between the second end of the conductive pillar and the trace is greater than the latitudinal width of the trace_directly coupled to the solder.