# US 12,191,233 B2 · Embedded cooling systems and methods of manufacturing embedded cooling systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,233 B2 - Document ID: US12191233B2 - Status: Granted - Kind: B2 - Application number: 17/876,376 - Filed: 2022-07-28 - Published: 2024-02-01 - Granted: 2025-01-07 - Earliest claimed: 2022-07-28 - Assignees: Adeia Semiconductor Bonding Technologies Inc. - Applicants: Adeia Semiconductor Bonding Technologies Inc. - Inventors: Belgacem Haba; Thomas Workman; Cyprian Emeka Uzoh; Guilian Gao; Rajesh Katkar - Web page: https://patentgrep.com/patent/US12191233B2 ## CPC - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/242: {comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders} - H10W 40/251: {Organics} - H10W 40/253: {Semiconductors} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 72/073: {of die-attach connectors} - H10W 72/30: Die-attach connectors - H10W 72/90: Bond pads, in general - H10W 74/014: {using batch processing} - H10W 78/00: Detachable holders for supporting packaged chips in operation - H10W 90/00: Package configurations - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W 72/0198: {batch processes} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 80/312: {characterised by the direct bonding of electrically conductive pads} - H10W 80/327: {characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers} - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/796: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the cooling assembly includes a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body. The cold plate body has a first side adjacent to the singulated device and an opposite second side, and the manifold lid is attached to the second side. In some embodiments, the first side of the cold plate body and the backside of the singulated device each comprise a dielectric material surface, the cold plate body is attached to the singulated device by direct dielectric bonds formed between the dielectric material surfaces, the cold plate body, and the manifold lid define one or more cavities, and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid. ## Claims ### Claim 1 A cooling assembly attached to a singulated device, the cooling assembly comprising: a cold plate body comprising a first side adjacent to the singulated device and an opposite second side; and a manifold lid attached to the second side, wherein: the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces; the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of a backside of the singulated device and by direct metal bonds formed between the copper features; the cold plate body and the manifold lid define one or more cavities; and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid. ### Claim 2 (depends on 1) The cooling assembly of claim 1, wherein: sidewall surfaces of the cold plate body and the singulated device are substantially coplanar with each other. ### Claim 3 (depends on 2) The cooling assembly of claim 2, wherein the sidewall surfaces of the cold plate body are substantially perpendicular to the backside of the singulated device. ### Claim 4 (depends on 1) The cooling assembly of claim 1, wherein sidewall surfaces of the manifold lid are substantially coplanar with sidewall surfaces of the cold plate body. ### Claim 5 A cooling assembly comprising: a cold plate body comprising a first side adjacent to a singulated device and an opposite second side; and a manifold lid attached to the second side, wherein: the cold plate body comprises a plurality of base plates arranged in a stack; the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between a bonding surface of the first side of the cold plate body and a bonding surface of a backside of the singulated device; the cold plate body and the manifold lid define one or more cavities; and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid. ### Claim 6 (depends on 5) The cooling assembly of claim 5, wherein: the plurality of base plates comprises a lower base plate directly bonded to the singulated device and an upper base plate directly bonded to the lower base plate; and the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the lower base plate, and a third cavity disposed between the manifold lid and the upper base plate. ### Claim 7 (depends on 5) The cooling assembly of claim 5, wherein: the plurality of base plates comprises a lower base plate, an upper base plate, and one or more intervening base plates disposed between the lower and upper base plates; and the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the one or more intervening base plates, and a third cavity disposed between the one or more intervening base plates and the lower base plate. ### Claim 8 (depends on 1) The cooling assembly of claim 1, wherein: the cold plate body comprises one or more monocrystalline or polycrystalline silicon substrates; and the manifold lid comprises a metal, a polymer, or an epoxy material. ### Claim 9 (depends on 1) The cooling assembly of claim 1, wherein: the manifold lid and the cold plate body have different coefficients of thermal expansion; and the manifold lid is attached to the cold plate body by an adhesive material layer. ### Claim 10 (depends on 1) The cooling assembly of claim 1, wherein at least a portion of the backside of the singulated device is directly exposed to the fluid flow path. ### Claim 11 A cooling assembly attached to a singulated device, the cooling assembly comprising: a cold plate body comprising a first side adjacent to the singulated device and an opposite second side; and a manifold lid attached to the second side, wherein: the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces; the cold plate body is directly bonded to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of the singulated device and by direct metal bonds formed between the copper features; the bonding surfaces of the cold plate body and the singulated device are substantially flush with each other; and the cold plate body and the manifold lid define one or more cavities that form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid. ### Claim 12 (depends on 11) The cooling assembly of claim 11, wherein: sidewall surfaces of the cold plate body and the singulated device are substantially coplanar with each other. ### Claim 13 (depends on 12) The cooling assembly of claim 12, wherein the sidewall surfaces of the cold plate body are substantially perpendicular to the backside of the singulated device. ### Claim 14 (depends on 11) The cooling assembly of claim 11, wherein sidewall surfaces of the manifold lid are substantially coplanar with sidewall surfaces of the cold plate body. ### Claim 15 (depends on 11) The cooling assembly of claim 11, wherein the cold plate body comprises a plurality of base plates arranged in a stack. ### Claim 16 (depends on 15) The cooling assembly of claim 15, wherein: the plurality of base plates comprises a lower base plate directly bonded to the singulated device and an upper base plate directly bonded to the lower base plate; and the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the lower base plate, and a third cavity disposed between the manifold lid and the upper base plate. ### Claim 17 (depends on 15) The cooling assembly of claim 15, wherein: the plurality of base plates comprises a lower base plate, an upper base plate, and one or more intervening base plates disposed between the lower and upper base plates; and the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the one or more intervening base plates, and a third cavity disposed between the one or more intervening base plates and the lower base plate. ### Claim 18 (depends on 11) The cooling assembly of claim 11, wherein: the cold plate body comprises one or more monocrystalline or polycrystalline silicon substrates; and the manifold lid comprises a metal, a polymer, or an epoxy material. ### Claim 19 (depends on 11) The cooling assembly of claim 11, wherein: the manifold lid and the cold plate body have different coefficients of thermal expansion; and the manifold lid is attached to the cold plate body by an adhesive material layer. ### Claim 20 (depends on 11) The cooling assembly of claim 11, wherein at least a portion of a backside of the singulated device is directly exposed to the fluid flow path. ### Claim 21 (depends on 1) The cooling assembly of claim 1, wherein the cold plate comprises sloped sidewalls formed by a wet etch. ### Claim 22 (depends on 1) The cooling assembly of claim 1, wherein the cold plate comprises substantially vertical sidewalls formed by a dry etch. ### Claim 23 (depends on 11) The cooling assembly of claim 11, wherein the cold plate comprises sloped sidewalls formed by a wet etch. ### Claim 24 (depends on 11) The cooling assembly of claim 11, wherein the cold plate comprises substantially vertical sidewalls formed by a dry etch. ### Claim 25 (depends on 1) The cooling assembly of claim 1, wherein a first cavity of the one or more cavities forms a first portion of the fluid flow path, the cooling assembly further comprising: a plurality of features protruding into the first cavity, wherein the plurality of features defines a plurality of channels in the first portion of the fluid flow path. ### Claim 26 (depends on 11) The cooling assembly of claim 11, wherein a first cavity of the one or more cavities forms a first portion of the fluid flow path, the cooling assembly further comprising: a plurality of features protruding into the first cavity, wherein the plurality of features defines a plurality of channels in the first portion of the fluid flow path. ### Claim 27 (depends on 6) The cooling assembly of claim 6, wherein the fluid flow path comprises a third cavity, different from the first cavity, disposed between the manifold lid and the upper base plate. ### Claim 28 (depends on 7) The cooling assembly of claim 7, wherein the fluid flow path comprises a fourth cavity, different from the first cavity, disposed between the upper base plate and the manifold lid. ### Claim 29 (depends on 16) The cooling assembly of claim 16, wherein the fluid flow path comprises a third cavity, different from the first cavity, disposed between the manifold lid and the upper base plate. ### Claim 30 (depends on 17) The cooling assembly of claim 17, wherein the fluid flow path comprises a fourth cavity, different from the first cavity, disposed between the upper base plate and the manifold lid.