# US 12,191,230 B2 · Technologies for liquid cooling systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,230 B2 - Document ID: US12191230B2 - Status: Granted - Kind: B2 - Application number: 17/213,347 - Filed: 2021-03-26 - Published: 2021-08-05 - Granted: 2025-01-07 - Earliest claimed: 2021-03-26 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Ralph W. Jensen; Michael Thomas Crocker; Wesley B. Morgan - Web page: https://patentgrep.com/patent/US12191230B2 ## CPC - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/776: {Arrangements for jet impingement, e.g. for spraying} - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H10W 40/475: {using jet impingement (H10W40/776 takes precedence)} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/00: Package configurations - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant. ## Claims ### Claim 1 A system comprising: an integrated circuit component; a water block including: a base; an inlet; an outlet; and a plurality of jet holes defined in the base, wherein each of the inlet and the outlet is fluidly coupled to each of the plurality of jet holes, wherein each of the plurality of jet holes is configured to create a jet of fluid coolant when fluid coolant is passed from the inlet and through the corresponding jet hole, and wherein each of the plurality of jet holes is configured to direct the corresponding jet of fluid coolant toward the jet of fluid coolant from a different jet hole of the plurality of jet holes; and an O-ring between the water block and the integrated circuit component. ### Claim 2 (depends on 1) The system of claim 1, wherein the plurality of jet holes is to provide a cooling of over 100 kilowatts per square meter per degree Celsius. ### Claim 3 (depends on 1) The system of claim 1, wherein fluid coolant from the jet of fluid coolant from each of the plurality of jet holes is to directly contact a die of the integrated circuit component. ### Claim 4 (depends on 1) The system of claim 1, the system further comprising: a gas pump to apply negative pressure to a coolant loop connected to the inlet and the outlet, wherein a seal is created by the O-ring between the water block and the integrated circuit component upon application of the negative pressure to the coolant loop. ### Claim 5 (depends on 1) The system of claim 1, wherein fluid coolant from the jet of fluid coolant from each of the plurality of jet holes is to directly contact an integrated heat spreader of the integrated circuit component. ### Claim 6 (depends on 1) The system of claim 1, wherein the water block comprises a cover forming a seal with the base of the water block, wherein the cover is thermally coupled to an integrated heat spreader of the integrated circuit component. ### Claim 7 (depends on 6) The system of claim 6, wherein the O-ring is between the cover of the water block and the integrated heat spreader, wherein negative pressure is applied to a volume of space between the water block and the integrated heat spreader. ### Claim 8 (depends on 1) The system of claim 1, wherein a case thermal resistance of the integrated circuit component is less than 0.02 degrees Celsius per Watt. ### Claim 9 A system comprising: an integrated circuit component; a water block comprising a base, an inlet, and an outlet; and wherein the water block is mated with the integrated circuit component to create a seal between the water block and the integrated circuit component, wherein the water block is configured to apply fluid coolant from the inlet directly onto a die of the integrated circuit component. ### Claim 10 (depends on 9) The system of claim 9, wherein the water block is permanently bonded to the integrated circuit component to create the seal. ### Claim 11 (depends on 9) The system of claim 9, further comprising a gas pump to apply negative pressure to a coolant loop connected to the inlet and the outlet. ### Claim 12 (depends on 11) The system of claim 11, further comprising an O-ring between the water block and the integrated circuit component, wherein the seal is created by the O-ring between the water block and the integrated circuit component upon application of the negative pressure to the coolant loop. ### Claim 13 A system comprising: an integrated circuit component; a water block comprising a base, an inlet, and an outlet; and a gas pump to apply negative pressure to a coolant loop connected to the inlet and the outlet, wherein a plurality of jet holes is defined in the base of the water block, wherein each of the inlet and the outlet is fluidly coupled to each of the plurality of jet holes, wherein each jet hole of the plurality of jet holes is configured to apply a jet of fluid coolant toward the integrated circuit component when fluid coolant is passed from the inlet and through the corresponding jet hole. ### Claim 14 (depends on 13) The system of claim 13, wherein each of the plurality of jet holes is configured to apply a jet of fluid coolant directly to a die of the integrated circuit component. ### Claim 15 (depends on 14) The system of claim 14, further comprising an O-ring between the water block and the integrated circuit component, wherein a seal is created by the O-ring between the water block and the integrated circuit component upon application of the negative pressure to the coolant loop. ### Claim 16 (depends on 13) The system of claim 13, wherein the water block comprises a cover, wherein the base and the cover surround a chamber defined in the water block, wherein the cover forms a seal with the base of the water block, wherein the cover is thermally coupled to an integrated heat spreader of the integrated circuit component, wherein each of the plurality of jet holes is configured to apply a jet of fluid coolant directly to the cover. ### Claim 17 (depends on 16) The system of claim 16, further comprising an O-ring between the cover of the water block and the integrated heat spreader, wherein the negative pressure is applied to a volume of space between the water block and the integrated heat spreader. ### Claim 18 (depends on 17) The system of claim 17, wherein the cover is directly in contact with the integrated heat spreader without use of a thermal interface material. ### Claim 19 (depends on 13) The system of claim 13, wherein each of the jet holes is separated from the integrated circuit component by a distance of less than 300 micrometers.