# US 12,191,229 B2 · Semiconductor package with blind hole attachment to heat sink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,229 B2 - Document ID: US12191229B2 - Status: Granted - Kind: B2 - Application number: 17/509,746 - Filed: 2021-10-25 - Published: 2023-04-27 - Granted: 2025-01-07 - Earliest claimed: 2021-10-25 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Ryan Tordillo Comadre; Victor Dela Cruz Del Rosario; Bernie Tabanao Rosales; Subaramaniym Senivasan; Heng Chen Tang - Web page: https://patentgrep.com/patent/US12191229B2 ## CPC - H10W 40/641: {Snap-on arrangements, e.g. clips} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 40/611: {Bolts or screws} - H10W 40/235: {attached to package parts} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/50: Bond wires - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body. ## Claims ### Claim 1 A semiconductor package, comprising: a lead frame that comprises a die pad and a plurality of leads; a semiconductor die mounted on a die attach surface of the die pad; an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame; and a fastener receptacle that comprises a blind hole in the encapsulant body or the die pad, and wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the blind hole is formed in the rear surface of the die pad or the first main face of the encapsulant body. ### Claim 3 (depends on 2) The semiconductor package of claim 2, wherein the fastener receptacle further comprises an insert that is disposed within the blind hole. ### Claim 4 (depends on 3) The semiconductor package of claim 3, wherein the insert comprises a central opening that is dimensioned to receive a cylindrical fastener. ### Claim 5 (depends on 3) The semiconductor package of claim 3, wherein the insert comprises a central opening that is dimensioned to receive a snap-fit connector, the snap-fit connector comprising at least one angled intersection between two linear surfaces. ### Claim 6 (depends on 2) The semiconductor package of claim 2, wherein the blind hole is formed in the rear surface of the die pad. ### Claim 7 (depends on 6) The semiconductor package of claim 6, wherein the semiconductor die overlaps with the fastener receptacle. ### Claim 8 (depends on 6) The semiconductor package of claim 6, wherein the fastener receptacle further comprises a metal insert that is disposed within the blind hole, and wherein the insert has a greater material hardness than the die pad. ### Claim 9 (depends on 6) The semiconductor package of claim 6, wherein the fastener receptacle further comprises a second blind hole is formed in the rear surface of the die pad. ### Claim 10 (depends on 2) The semiconductor package of claim 2, wherein the blind hole is formed in the first main face of the encapsulant body. ### Claim 11 (depends on 10) The semiconductor package of claim 10, wherein the fastener receptacle further comprises a metal or plastic insert that is disposed within the blind hole, and wherein the insert has a greater material hardness than the encapsulant body. ### Claim 12 (depends on 10) The semiconductor package of claim 10, wherein the leads are disposed in an area of the first main face that is between the die pad and a first outer edge side of the encapsulant body that the leads protrude out from. ### Claim 13 A semiconductor assembly comprising: a heat sink; a semiconductor package comprising an encapsulant body of electrically insulating material, a die pad with a rear surface that is exposed from a first main face of the encapsulant body, and a fastener receptacle that comprises a blind hole in the encapsulant body or the die pad; and a fastener that is securely retained by the fastener receptacle and affixes the semiconductor package to the heat sink. ### Claim 14 (depends on 13) The semiconductor assembly of claim 13, wherein the heat sink comprises a planar package interface surface, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body, and wherein the rear surface of the die pad faces and is retained against the planar package interface surface by the fastener. ### Claim 15 (depends on 13) The semiconductor assembly of claim 13, wherein the blind hole is formed in the rear surface of the die pad, wherein the heat sink comprises a perforation that extends between the planar package interface surface and an outer surface of the heat sink, and wherein the semiconductor assembly further comprises an electrically insulating liner that is disposed within the perforation and receives the fastener. ### Claim 16 (depends on 15) The semiconductor assembly of claim 15, wherein the semiconductor assembly further comprises an electrically insulating cap that covers an outer head of the fastener. ### Claim 17 A method of producing a semiconductor package, the method comprising: providing a lead frame that comprises a die pad; mounting a semiconductor die on a die attach surface of the die pad; forming an encapsulant body of electrically insulating material that covers the semiconductor die and portions of the lead frame; and forming a fastener receptacle in the semiconductor package, wherein forming the fastener receptacle comprises forming a blind hole in the encapsulant body or the die pad. ### Claim 18 (depends on 17) The method of claim 17, wherein the blind hole is formed in a rear surface of the die pad that is exposed from the encapsulant body, and wherein forming the blind hole comprises half-etching the die pad before forming the encapsulant body. ### Claim 19 (depends on 17) The method of claim 17, wherein the blind hole is formed in a first main face of the encapsulant body, and wherein the blind hole is formed during or after forming the encapsulant body. ### Claim 20 (depends on 17) The method of claim 17, wherein forming the fastener receptacle further comprises providing an insert within the blind hole.