# US 12,191,227 B2 · Heat dissipating substrate comprising diamond and semiconductor integrated device including the same

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- Number: US 12,191,227 B2
- Document ID: US12191227B2
- Status: Granted
- Kind: B2
- Application number: 17/518,511
- Filed: 2021-11-03
- Published: 2022-06-16
- Granted: 2025-01-07
- Earliest claimed: 2020-12-14
- Assignees: Electronics and Telecommunications Research Institute
- Applicants: Electronics and Telecommunications Research Institute
- Inventors: Hyung Seok Lee; Sung-Bum Bae
- Web page: https://patentgrep.com/patent/US12191227B2

## CPC

- H10W 40/254: {Diamond}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a heat dissipating substrate including a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other, and insulation patterns that fill the recessed regions. The insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

## Claims

### Claim 1

A heat dissipating substrate comprising:
a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other; and
insulation patterns that fill the recessed regions, bottom surfaces and side surfaces of the insulation patterns being in contact with the diamond substrate,
wherein the insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

### Claim 2 (depends on 1)

The heat dissipating substrate of claim 1, wherein each of the recessed regions extends from a top surface of the diamond substrate into the diamond substrate, and
at least a portion of each of the insulation patterns fills each of the recessed regions and is disposed in the diamond substrate.

### Claim 3 (depends on 2)

The heat dissipating substrate of claim 2, wherein a top surface of each of the insulation patterns is disposed at a height equal to or greater than that of the top surface of the diamond substrate.

### Claim 4 (depends on 3)

The heat dissipating substrate of claim 3, wherein a distance between the top surface of each of the insulation patterns and the top surface of the diamond substrate is equal to or greater than about 0 μm and equal to or less than about 10 μm.

### Claim 5 (depends on 1)

The heat dissipating substrate of claim 1, wherein each of the insulation patterns has a line shape extending in one direction, a polygonal shape, or a circular shape.

### Claim 6

A method for manufacturing a heat dissipating substrate, comprising:
providing a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other;
forming an insulation layer, which fills the recessed regions, on a top surface of the diamond substrate; and
forming insulation patterns that fill the recessed regions by planarizing the insulation layer,
wherein bottom surfaces and side surfaces of the insulation patterns are in contact with the diamond substrate, and
wherein the insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

### Claim 7 (depends on 6)

The method of claim 6, wherein the providing of the diamond substrate comprises:
providing a semiconductor substrate, wherein an upper portion of the semiconductor substrate has a concave-convex structure including preliminary recessed regions that are spaced apart from each other;
forming the diamond substrate, which fills the preliminary recessed regions, on a top surface of the semiconductor substrate; and
removing the semiconductor substrate from the diamond substrate,
wherein as the diamond substrate fills the preliminary recessed regions, the concave-convex structure of the semiconductor substrate is transferred to the diamond substrate.

### Claim 8 (depends on 7)

The method of claim 7, wherein the providing of the semiconductor substrate comprises:
forming mask patterns on the top surface of the semiconductor substrate;
forming the preliminary recessed regions in the semiconductor substrate by etching the upper portion of the semiconductor substrate by using the mask patterns as an etching mask; and
removing the mask patterns.

### Claim 9 (depends on 6)

The method of claim 6, wherein the providing of the diamond substrate comprises:
forming the diamond substrate on a semiconductor substrate;
removing the semiconductor substrate from the diamond substrate;
forming mask patterns on the top surface of the diamond substrate;
forming the recessed regions in the diamond substrate by etching the upper portion of the diamond substrate by using the mask patterns as an etching mask; and
removing the mask patterns.

### Claim 10 (depends on 6)

The method of claim 6, wherein the forming of the insulation patterns comprises planarizing the insulation layer until the top surface of the diamond substrate is exposed.

### Claim 11

A semiconductor integrated device comprising:
a heat dissipating substrate;
first metal pads disposed on the heat dissipating substrate; and
a semiconductor device integrated onto the heat dissipating substrate,
wherein the semiconductor device includes electrode pads bonded to the first metal pads,
the heat dissipating substrate includes a diamond substrate and insulation patterns disposed on an upper portion of the diamond substrate and spaced apart from each other, and
each of the first metal pads contacts top surfaces of corresponding insulation patterns of the insulation patterns and a top surface of the diamond substrate.

### Claim 12 (depends on 11)

The semiconductor integrated device of claim 11, wherein the insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

### Claim 13 (depends on 11)

The semiconductor integrated device of claim 11, wherein the semiconductor device is a nitride semiconductor device, and
the electrode pads comprise a gate electrode pad, a source electrode pad, and a drain electrode pad of the nitride semiconductor device.

### Claim 14 (depends on 11)

The semiconductor integrated device of claim 11, wherein the semiconductor device is one of a nitride semiconductor device, a group III-V compound semiconductor device, a silicon-based semiconductor device, and an optical device.

### Claim 15 (depends on 11)

The semiconductor integrated device of claim 11, wherein each of the top surfaces of the insulation patterns is disposed at a height equal to or greater than that of the top surface of the diamond substrate.

### Claim 16 (depends on 11)

The semiconductor integrated device of claim 11, wherein each of the insulation patterns has a line shape extending in one direction, a polygonal shape, or a circular shape.

### Claim 17 (depends on 11)

The semiconductor integrated device of claim 11, further comprising:
second metal pads disposed on the heat dissipating substrate; and
metal wires configured to connect the first metal pads and the second metal pads,
wherein each of the second metal pads and the metal wires contacts top surfaces of corresponding insulation patterns of the insulation patterns and the top surface of the diamond substrate.

### Claim 18 (depends on 17)

The semiconductor integrated device of claim 17, wherein each of the first metal pads, the second metal pads, and the metal wires comprises at least one of Cr, Ti, Al, Au, Cu, W, Ni, and Pt.