# US 12,191,218 B2 · Semiconductor device including surface pressure absorbing member for fastening heat sink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,218 B2 - Document ID: US12191218B2 - Status: Granted - Kind: B2 - Application number: 16/754,992 - Filed: 2017-11-22 - Published: 2021-07-01 - Granted: 2025-01-07 - Earliest claimed: 2017-11-22 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Arata Iizuka; Korehide Okamoto - Web page: https://patentgrep.com/patent/US12191218B2 ## CPC - H10W 76/136: having other interconnections perpendicular to the conductive base - H10W 76/15: Containers comprising an insulating or insulated base - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/611: {Bolts or screws} - H10W 90/00: Package configurations - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/235: {attached to package parts} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/07554: {changes in dispositions} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 76/47: Solid or gel fillings - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a case made of resin, the case being mounted on the heat sink and containing the semiconductor element. A fastening hole is formed passing through the case and the heat sink. The case includes a surface pressure absorbing member on a portion including the fastening hole in plan view, the surface pressure absorbing member having a plate shape and being higher in rigidity than the resin. ## Claims ### Claim 1 A semiconductor device comprising: a semiconductor element; a heat sink on which the semiconductor element is mounted; a case made of resin, the case being mounted on the heat sink and containing the semiconductor element; and a fastening hole passing through the case and the heat sink, wherein a surface pressure absorbing member is at least partially embedded in the case and positioned at portion including the fastening hole in plan view, the surface pressure absorbing member having a substantially flat plate shape and being higher in rigidity than the resin. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein an upper surface of the surface pressure absorbing member at least around the fastening hole is exposed from the case, and a lower surface of the surface pressure absorbing member is in contact with the heat sink. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein a plurality of the fastening holes are provided, and all of the plurality of fastening holes is formed in the surface pressure absorbing member. ### Claim 4 A semiconductor device comprising: a semiconductor element; a heat sink on which the semiconductor element is mounted; a case made of resin, the case being mounted on the heat sink and containing the semiconductor element; and a fastening hole passing through the case and the heat sink, wherein the case includes a surface pressure absorbing member on a portion including the fastening hole in plan view, the surface pressure absorbing member having a plate shape and being higher in rigidity than the resin, and the surface pressure absorbing member includes a portion extending on an outer peripheral portion of the case and a beam portion extending across an inside of the case. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member has a frame shape extending on an outer peripheral portion of the case. ### Claim 6 (depends on 5) The semiconductor device according to claim 5, wherein the surface pressure absorbing member includes a beam portion extending across an inside of the case. ### Claim 7 (depends on 1) The semiconductor device according to claim 1, wherein a plurality of the fastening holes and a plurality of the surface pressure absorbing members are provided, and each of the plurality of surface pressure absorbing members has a shape including at least one fastening hole in plan view. ### Claim 8 (depends on 7) The semiconductor device according to claim 7, wherein the plurality of surface pressure absorbing members are all identical in shape. ### Claim 9 (depends on 7) The semiconductor device according to claim 7, wherein at least one of the plurality of surface pressure absorbing members has an L shape extending on two adjacent sides of the case. ### Claim 10 (depends on 7) The semiconductor device according to claim 7, wherein at least one of the plurality of surface pressure absorbing members has a frame shape including a portion extending to an outer peripheral portion of the case and a portion extending across an inside of the case. ### Claim 11 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member has a through hole, a depressed portion, or a dimple formed in a portion other than a portion around the fastening hole. ### Claim 12 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is enclosed by the case in plan view. ### Claim 13 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member has a portion around the fastening hole formed thicker than other portions. ### Claim 14 (depends on 13) The semiconductor device according to claim 13, wherein the surface pressure absorbing member has projections and depressions formed on a side surface of the portion around the fastening hole. ### Claim 15 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is insert-molded in the case. ### Claim 16 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is bonded to the case with an adhesive. ### Claim 17 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is higher in thermal conductivity than the resin. ### Claim 18 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is made of Fe. ### Claim 19 (depends on 1) The semiconductor device according to claim 1, wherein the surface pressure absorbing member is made of Cu. ### Claim 20 (depends on 1) The semiconductor device according to claim 1 further comprising a bolt configured to be inserted into the fastening hole to fasten the case and the heat sink to an external housing, wherein the surface pressure absorbing member is identical in material to the bolt.