# US 12,191,186 B2 · Actively clamped carrier assembly for processing tools > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,186 B2 - Document ID: US12191186B2 - Status: Granted - Kind: B2 - Application number: 18/338,443 - Filed: 2023-06-21 - Published: 2023-11-02 - Granted: 2025-01-07 - Earliest claimed: 2020-12-11 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Benjamin B. Riordon; James D. Strassner - Web page: https://patentgrep.com/patent/US12191186B2 ## CPC - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - B05C 21/005: {Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20)} - C23C 14/042: {using masks} - C23C 14/50: Substrate holders - C23C 16/042: {using masks} - C23C 16/4585: {Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds} - G02B 6/136: by etching - H01J 37/32715: {Workpiece holder} - H10K 71/166: {using selective deposition, e.g. using a mask} - H10P 14/6329: {using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition} - H10P 72/57: {Mask-wafer alignment} - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7606: {characterised by edge clamping, e.g. clamping ring} - H10P 72/7408: {the auxiliary support including alignment aids} - H10P 72/741: {the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip} - H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein. ## Claims ### Claim 1 A carrier assembly, comprising: a mask, the mask including a pattern of openings disposed through the mask, the mask including pinholes; a carrier, the carrier including: a magnet disposed in the carrier, the magnet magnetically coupled to the mask; a plurality of pockets recessed into the carrier, each pocket of the plurality of pockets having a width corresponding to a substrate to be disposed therein, each substrate of the plurality of substrates to be disposed in each pocket of the plurality of pockets abuts sidewalls of a respective pocket; and alignment pins disposed in the carrier and disposed through the pinholes in the mask, the alignment pins adjacent to a sidewall of the sidewalls of the plurality of pockets. ### Claim 2 (depends on 1) The carrier assembly of claim 1, wherein the pattern of openings correspond to a first region, a second region, and a third region of a waveguide combiner. ### Claim 3 (depends on 1) The carrier assembly of claim 1, wherein the mask includes a stainless steel material or a non-ferrous material. ### Claim 4 (depends on 1) The carrier assembly of claim 1, wherein the mask including a non-ferrous material is bonded to a ferrous strike plate, the ferrous strike plate is disposed between the mask and the magnet. ### Claim 5 (depends on 1) The carrier assembly of claim 1, wherein the mask is a clamp ring. ### Claim 6 (depends on 1) The carrier assembly of claim 1, wherein the carrier assembly is operable to be scanned vertically during processing. ### Claim 7 A carrier assembly, comprising: a mask, the mask including a pattern of openings disposed through the mask, the mask including pinholes; a carrier, the carrier including: a magnet disposed in the carrier, the magnet magnetically coupled to the mask; a plurality of pockets recessed into the carrier, one or more substrates disposed in the plurality of pockets, and the one or more substrates abut sidewalls of the plurality of pockets; and alignment pins disposed in the carrier and disposed through the pinholes in the mask, the alignment pins adjacent to one of the sidewalls of the plurality of pockets. ### Claim 8 (depends on 7) The carrier assembly of claim 7, wherein the pattern of openings correspond to a first region, a second region, and a third region of a waveguide combiner. ### Claim 9 (depends on 7) The carrier assembly of claim 7, wherein the mask includes a stainless steel material or a non-ferrous material. ### Claim 10 (depends on 7) The carrier assembly of claim 7, wherein the mask including a non-ferrous material is bonded to a ferrous strike plate, the ferrous strike plate is disposed between the mask and the magnet. ### Claim 11 (depends on 7) The carrier assembly of claim 7, wherein the mask is a clamp ring. ### Claim 12 (depends on 7) The carrier assembly of claim 7, wherein the carrier assembly is operable to be scanned vertically during processing.