# US 12,191,137 B2 · Method for manufacturing a component arrangement for a package, method for manufacturing a package having a component arrangement, a component arrangement and a package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,191,137 B2 - Document ID: US12191137B2 - Status: Granted - Kind: B2 - Application number: 17/618,920 - Filed: 2020-06-22 - Published: 2022-12-29 - Granted: 2025-01-07 - Earliest claimed: 2019-06-24 - Assignees: Msg Lithoglas AG - Applicants: MSG Lithoglas GmbH - Inventors: Simon Maus; Ulli Hansen - Web page: https://patentgrep.com/patent/US12191137B2 ## CPC - H01S 5/02255: using beam deflecting elements - H10P 90/126: {by chemical etching} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - G02B 5/0808: {having a single reflecting layer (G02B5/0883, G02B5/0891 take precedence)} - H01S 5/02208: characterised by the shape of the housings - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H01S 5/02345: Wire-bonding - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided is a method for manufacturing a component arrangement for a package, including providing a wafer made of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured near the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed near a surface portion of the polished wafer surface and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a carrier substrate using the mounting surface in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein the optical surface is arranged as an inclined exposed surface. Furthermore, a component arrangement and a package are provided having a component arrangement. ## Claims ### Claim 1 A method for manufacturing a component arrangement for a package, comprising: providing a wafer of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured in a region of the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed in a region of a surface portion of the polished wafer surface, and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a support substrate using the mounting surface, in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein hereby the optical surface is arranged as an inclined exposed surface; wherein the mounting surface is formed having a mounting functional layer manufactured in a region of the mounting surface, and the mounting functional layer is manufactured having a solderable metal coating. ### Claim 2 (depends on 1) The method according to claim 1, wherein the optical surface is manufactured having an optical functional surface, wherein hereby an optical functional layer is applied in the surface portion of the polished wafer surface in such a manner that the optical properties of the polished wafer surface are changed in the surface portion. ### Claim 3 (depends on 2) The method according to claim 2, wherein the optical functional surface is applied at wafer level prior to separation. ### Claim 4 (depends on 2) The method according to claim 2, wherein the optical functional surface is manufactured having a microstructured layer. ### Claim 5 (depends on 2) The method according to claim 2, wherein the optical functional layer is applied as a multilayer system. ### Claim 6 (depends on 1) The method according to claim 1, wherein the anisotropically etched surface is manufactured having an inclination angle of approximately 45 degrees in relation to the polished wafer surface. ### Claim 7 (depends on 1) The method according to claim 1, wherein a wafer made of silicon is provided and is etched in an anisotropic manner. ### Claim 8 (depends on 1) The method according to claim 1, wherein the mounting functional layer is applied at wafer level prior to separation. ### Claim 9 (depends on 1) The method for manufacturing a package having a component arrangement manufactured by a method according to claim 1, wherein a housing is manufactured by a housing component, in which at least the separated component is accommodated. ### Claim 10 A method for manufacturing a component arrangement for a package, comprising: providing a wafer of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured in a region of the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed in a region of a surface portion of the polished wafer surface, and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a support substrate using the mounting surface, in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein hereby the optical surface is arranged as an inclined exposed surface; wherein the mounting surface is formed having a mounting functional layer manufactured in a region of the mounting surface, and the mounting functional layer is applied at wafer level prior to separation.