# US 12,191,123 B2 · Wafer placement table

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- Number: US 12,191,123 B2
- Document ID: US12191123B2
- Status: Granted
- Kind: B2
- Application number: 17/938,388
- Filed: 2022-10-06
- Published: 2023-04-20
- Granted: 2025-01-07
- Earliest claimed: 2021-10-19
- Assignees: NGK Insulators, Ltd.
- Applicants: NGK Insulators, Ltd.
- Inventors: Hiroshi Takebayashi; Tatsuya Kuno; Seiya Inoue
- Web page: https://patentgrep.com/patent/US12191123B2

## CPC

- H01J 37/32724: {Temperature}
- H10P 72/0432: {mainly by conduction}
- H10P 72/0434: {mainly by convection}
- H10P 72/72: using electrostatic chucks
- H10P 72/722: {Details of electrostatic chucks}
- H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support}
- H01J 2237/002: Cooling arrangements
- H01J 2237/2007: Holding mechanisms
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A wafer placement table includes a ceramic base including an electrode, a cooling base including a coolant flow path formed therein, a bonding layer bonding the ceramic base and the cooling base, a stepped hole penetrating the bonding layer and the cooling base and including an upper hole portion with a small diameter, a lower hole portion with a large diameter, and a hole stepped portion between the upper hole portion and the lower hole portion, the upper hole portion passing through a region in which the coolant flow path is formed, a stepped insulating pipe inserted through the stepped hole and including an upper pipe portion with a small diameter, a lower pipe portion with a large diameter, and a pipe stepped portion between the upper pipe portion and the lower pipe portion; and a connection terminal bonded to the electrode and inserted through the stepped insulating pipe.

## Claims

### Claim 1

A wafer placement table comprising:
a ceramic base having a wafer placement surface in an upper surface and including an electrode;
a cooling base including a coolant flow path formed therein;
a bonding layer bonding a lower surface of the ceramic base and an upper surface of the cooling base;
a stepped hole penetrating the bonding layer and the cooling base in an up-down direction and including an upper hole portion with a small diameter, a lower hole portion with a large diameter, and a hole stepped portion between the upper hole portion and the lower hole portion, the small diameter upper hole portion passing through a region in which the coolant flow path is formed and the large diameter lower hole portion positioned under the coolant flow path;
a stepped insulating pipe inserted through the stepped hole and including an upper pipe portion with a small diameter, a lower pipe portion with a large diameter, and a pipe stepped portion between the upper pipe portion and the lower pipe portion; and
a connection terminal bonded at an upper end to the electrode and inserted through the stepped insulating pipe; and
wherein a diameter of the connection terminal is less than or equal to half of a diameter of the lower pipe portion.

### Claim 2 (depends on 1)

The wafer placement table according to claim 1,
wherein a length of the upper hole portion is longer than a length of the lower hole portion.

### Claim 3 (depends on 1)

The wafer placement table according to claim 1,
wherein the wafer placement table comprises a socket that is arranged inside the lower pipe portion of the stepped insulating pipe and that includes an elastic support elastically supporting an outer peripheral surface of the connection terminal without abutting against a lower end surface of the connection terminal.

### Claim 4 (depends on 3)

The wafer placement table according to claim 3,
wherein the socket is in contact with the pipe stepped portion.

### Claim 5 (depends on 3)

The wafer placement table according to claim 3,
wherein the elastic support includes a plurality of leaf springs.

### Claim 6 (depends on 5)

The wafer placement table according to claim 5,
wherein the leaf springs are vertically arranged at intervals in a circumferential direction.

### Claim 7 (depends on 3)

The wafer placement table according to claim 3,
wherein the elastic support includes a plurality of plate members vertically arranged at intervals in a circumferential direction and an elastic member tightening the plate members from an outer side.

### Claim 8 (depends on 3)

The wafer placement table according to claim 3,
wherein a diameter of the connection terminal is smaller than or equal to a half of a diameter of a lower surface of the socket.

### Claim 9 (depends on 3)

The wafer placement table according to claim 3,
wherein a lower surface of the socket has a concave shape gradually recessed toward a center from an outer periphery.

### Claim 10 (depends on 3)

The wafer placement table according to claim 3,
wherein the socket includes a plug insertion opening into which a plug is insertable.