# US 12,191,082 B2 · Matrix assembly having solid dielectric elements and a tailored bulk dielectric constant and method of manufacturing same

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- Number: US 12,191,082 B2
- Document ID: US12191082B2
- Status: Granted
- Kind: B2
- Application number: 17/362,359
- Filed: 2021-06-29
- Published: 2021-12-30
- Granted: 2025-01-07
- Earliest claimed: 2020-06-29
- Assignees: HyQ Research Solutions, LLC
- Applicants: HyQ Research Solutions, LLC
- Inventors: Matthew Lanagan; Sebastian Rupprecht
- Web page: https://patentgrep.com/patent/US12191082B2

## CPC

- H01G 4/1227: {based on alkaline earth titanates}
- C04B 35/465: based on alkaline earth metal titanates
- C04B 35/4682: {based on BaTiO3 perovskite phase}
- C04B 35/47: based on strontium titanates
- C04B 35/628: Coating the powders {or the macroscopic reinforcing agents}
- C04B 35/62802: {Powder coating materials}
- C04B 35/638: Removal thereof
- C04B 35/645: Pressure sintering
- C04B 35/78: containing non-metallic materials
- H01B 3/10: metallic oxides (ceramics H01B3/12)
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- B82Y 40/00: Manufacture or treatment of nanostructures
- C04B 2235/3208: Calcium oxide or oxide-forming salts thereof, e.g. lime
- C04B 2235/3213: Strontium oxides or oxide-forming salts thereof
- C04B 2235/3215: Barium oxides or oxide-forming salts thereof
- C04B 2235/3236: Alkaline earth titanates
- C04B 2235/5436: micrometer sized, i.e. from 1 to 100 micron
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES

## Abstract

A dielectric assembly solid dielectric elements within a liquid or solid matrix material. The dielectric assembly may be manufactured by pressing a dielectric powder to form pressed dielectric elements, sintering the pressed dielectric elements to form the solid dielectric elements, and assembling the solid dielectric elements within the matrix material to form the dielectric assembly. The solid dielectric elements can be specifically oriented (e.g., in one or more tiled layers) or randomly oriented, and the dielectric assemblies can be molded and/or machined into desired 3D geometries. The dielectric assemblies can be relatively large (e.g., >1 mm3) while having bulk dielectric constants higher than conventional slurries and composites formed of dielectric powder in a liquid or solid matrix.

## Claims

### Claim 1

A method of manufacturing an article of manufacture comprising a dielectric assembly of solid dielectric elements within a matrix material, the method comprising:
(a) pressing the dielectric powder to form a plurality of pressed dielectric elements, wherein the dielectric powder is a ceramic powder coated with a binding agent;
(b) sintering a pressed dielectric elements to form the solid dielectric elements, wherein the binding agent is driven out of the pressed dielectric elements during step (b); and
(c) assembling the solid dielectric elements within the matrix material to form the dielectric assembly, wherein step (b) comprises:
(b1) heating the pressed dielectric elements to within a first temperature range to drive out the binding agent; and
(b2) heating the dielectric elements to within a second temperature range higher than the first temperature range to sinter the dielectric elements.

### Claim 2 (depends on 1)

The method of claim 1, wherein the matrix material physically interconnects the solid dielectric elements to form the dielectric assembly as a solid object.

### Claim 3 (depends on 2)

The method of claim 2, wherein the matrix material comprises a dielectric powder mixed with a binding material.

### Claim 4 (depends on 2)

The method of claim 2, wherein step (c) further comprises machining the solid object to form the dielectric assembly.

### Claim 5 (depends on 1)

The method of claim 1, wherein the matrix material comprises a liquid that fills gaps between the solid dielectric elements.

### Claim 6 (depends on 1)

The method of claim 1, wherein:
the dielectric powder has an average particle size less than 0.001 mm3; and
the solid dielectric elements have a size greater than 0.001 mm3.

### Claim 7 (depends on 6)

The method of claim 6, wherein the size of the solid dielectric elements is greater than 1 mm3.

### Claim 8 (depends on 1)

The method of claim 1, wherein step (c) comprises tiling the solid dielectric elements such that the matrix material fills volumes between the tiled solid dielectric elements.

### Claim 9 (depends on 8)

The method of claim 8, wherein the dielectric assembly comprises a single layer of tiled solid dielectric elements.

### Claim 10 (depends on 9)

The method of claim 9, wherein the single layer of tiled solid dielectric elements are assembled to form the dielectric assembly having a non-planar shape.

### Claim 11 (depends on 8)

The method of claim 8, wherein the dielectric assembly comprises multiple layers of tiled solid dielectric elements.

### Claim 12 (depends on 11)

The method of claim 11, wherein step (c) comprises:
(c1) tiling multiple layers of the solid dielectric elements such that the matrix material fills volumes between the solid dielectric elements; and
(c2) machining the multiple layers of tiled solid dielectric elements to form the dielectric assembly.

### Claim 13 (depends on 1)

The method of claim 1, wherein:
the dielectric powder is a ceramic nano-powder coated with the binding agent; and
step (a) comprises pressing the dielectric powder within a uniaxial press to form the pressed dielectric elements.

### Claim 14 (depends on 1)

The method of claim 1, wherein step (c) comprises:
(c1) machining the solid dielectric elements to form polygonal-shaped solid dielectric elements; and
(c2) tiling the polygonal-shaped solid dielectric elements within the matrix material to form the dielectric assembly.

### Claim 15 (depends on 1)

The method of claim 1, wherein step (c) comprises stacking multiple solid dielectric elements on top of one another with intervening matrix material to form a stack of solid dielectric elements.

### Claim 16 (depends on 15)

The method of claim 15, wherein step (c) further comprises machining the stack of solid dielectric elements to form the assembly.

### Claim 17 (depends on 1)

The method of claim 1, wherein the bulk dielectric constant of the dielectric assembly is greater than 10% of an intrinsic dielectric constant of the material of the dielectric powder.

### Claim 18 (depends on 17)

The method of claim 17, wherein the bulk dielectric constant of the dielectric assembly is greater than 30% of the intrinsic dielectric constant of the material of the dielectric powder.

### Claim 19 (depends on 18)

The method of claim 18, wherein the bulk dielectric constant of the dielectric assembly is greater than 50% of the intrinsic dielectric constant of the material of the dielectric powder.

### Claim 20 (depends on 19)

The method of claim 19, wherein the bulk dielectric constant of the dielectric assembly is greater than 70% of the intrinsic dielectric constant of the material of the dielectric powder.

### Claim 21 (depends on 1)

The method of claim 1, wherein the dielectric assembly comprises a volume fraction of the solid dielectric elements greater than or equal to 50%.

### Claim 22 (depends on 21)

The method of claim 21, wherein the dielectric assembly comprises a volume fraction of the solid dielectric elements greater than or equal to 70%.

### Claim 23 (depends on 22)

The method of claim 22, wherein the dielectric assembly comprises a volume fraction of the solid dielectric elements greater than or equal to 90%.

### Claim 24 (depends on 1)

The method of claim 1, wherein step (c) comprises randomly assembling the solid dielectric elements within the matrix material to form the dielectric assembly.

### Claim 25 (depends on 24)

The method of claim 24, wherein step (c) further comprises machining the randomly assembled solid dielectric elements to form the dielectric assembly.

### Claim 26 (depends on 1)

The method of claim 1, further comprising selecting sizes and shapes of the solid dielectric elements to achieve the bulk dielectric constant of the dielectric assembly substantially equal to the target dielectric constant value.

### Claim 27 (depends on 26)

The method of claim 26, further comprising selecting dimensions of spacing between the solid dielectric elements filled with the matrix material in the dielectric assembly to achieve the bulk dielectric constant of the dielectric assembly substantially equal to the target dielectric constant value.

### Claim 28 (depends on 1)

The method of claim 1, further comprising placing the dielectric assembly between an RF component and a sample to improve sensitivity of RF detection of the sample using the RF component.

### Claim 29

A method of manufacturing an article of manufacture comprising a dielectric assembly of solid dielectric elements within a matrix material, the method comprising:
(a) pressing a dielectric powder to form a plurality of pressed dielectric elements;
(b) sintering the pressed dielectric elements to form the solid dielectric elements; and
(c) assembling the solid dielectric elements within the matrix material to form the dielectric assembly, wherein:
the dielectric powder is a ceramic nano-powder coated with a binding agent; and
step (a) comprises pressing the dielectric powder within a uniaxial press to form the pressed dielectric elements, wherein the binding agent is driven out of the pressed dielectric elements during step (b).

### Claim 30 (depends on 29)

The method of claim 29, wherein step (b) comprises:
(b1) heating the pressed dielectric elements to within a first temperature range to drive out the binding agent; and
(b2) heating the dielectric elements to within a second temperature range higher than the first temperature range to sinter the dielectric elements.

### Claim 31

A method of manufacturing an article of manufacture comprising a dielectric assembly of solid dielectric elements within a matrix material, the method comprising:
(a) pressing a dielectric powder to form a plurality of pressed dielectric elements;
(b) sintering the pressed dielectric elements to form the solid dielectric elements; and
(c) randomly assembling the solid dielectric elements within the matrix material to form the dielectric assembly.

### Claim 32 (depends on 31)

The method of claim 31, wherein step (c) further comprises machining the randomly assembled solid dielectric elements to form the dielectric assembly.

### Claim 33 (depends on 31)

The article of manufacture manufactured using the method of claim 31.