# US 12,191,081 B2 · Multilayer electronic component

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- Number: US 12,191,081 B2
- Document ID: US12191081B2
- Status: Granted
- Kind: B2
- Application number: 18/384,807
- Filed: 2023-10-27
- Published: 2024-02-15
- Granted: 2025-01-07
- Earliest claimed: 2022-02-03
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Eung Seok Lee; Tae Gyun Kwon; Yun Sung Kang
- Web page: https://patentgrep.com/patent/US12191081B2

## CPC

- H01G 4/0085: {Fried electrodes}
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/10: Metal-oxide dielectrics {(H01G4/085 takes precedence)}
- H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)}
- H01G 4/1272: {Semiconductive ceramic capacitors}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/306: {made by thin film techniques}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.

## Claims

### Claim 1

A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and
an external electrode disposed on the body and connected to the plurality of internal electrodes,
wherein each of the plurality of internal electrodes includes a plurality of metal layers, and an electrically conductive heterogeneous material layer disposed between the plurality of metal layers.

### Claim 2 (depends on 1)

The multilayer electronic component of claim 1, wherein the heterogeneous material layer is a heterogeneous metal layer.

### Claim 3 (depends on 2)

The multilayer electronic component of claim 2, wherein the heterogeneous metal layer comprises a metal, different from metal layers.

### Claim 4 (depends on 3)

The multilayer electronic component of claim 3, wherein the heterogeneous metal layer comprises at least one metal selected from the group consisting of Al, Ta, and Pt.

### Claim 5 (depends on 1)

The multilayer electronic component of claim 1, wherein the heterogeneous material layer is a functional ceramic layer.

### Claim 6 (depends on 5)

The multilayer electronic component of claim 5, wherein the functional ceramic layer comprises at least one ceramic selected from the group consisting of indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and strontium ruthenium oxide (SRO).

### Claim 7 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the plurality of internal electrodes is 10 to 300 nm.

### Claim 8 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the heterogeneous material layer is 10 to 100 nm.

### Claim 9 (depends on 1)

The multilayer electronic component of claim 1, wherein an average thickness of the plurality of metal layers is 10 to 100 nm.

### Claim 10 (depends on 1)

The multilayer electronic component of claim 1, wherein a ratio (W2/W1) of a thickness (W2) of the heterogeneous material layer to a thickness (W1) of the plurality of metal layers, in each of the plurality of internal electrodes, is 0.1 to 1.

### Claim 11 (depends on 1)

The multilayer electronic component of claim 1, wherein the plurality of metal layers included in each of the plurality of internal electrodes are two metal layers.

### Claim 12 (depends on 2)

The multilayer electronic component of claim 2, wherein the plurality of metal layers and the heterogeneous metal layer are formed in a vacuum deposition process.

### Claim 13 (depends on 11)

The multilayer electronic component of claim 11, wherein the body includes the dielectric layer, a first metal layer, a heterogeneous material layer, and a second metal layer, in order.

### Claim 14 (depends on 1)

The multilayer electronic component of claim 1, wherein the metal layers include 95 wt % or more of metal.

### Claim 15 (depends on 1)

The multilayer electronic component of claim 1, wherein the metal layers include nickel as a main component.

### Claim 16 (depends on 1)

The multilayer electronic component of claim 1, wherein the metal layers include 95 wt % or more of nickel.