# US 12,191,080 B2 · Multilayer ceramic electronic component

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- Number: US 12,191,080 B2
- Document ID: US12191080B2
- Status: Granted
- Kind: B2
- Application number: 17/983,850
- Filed: 2022-11-09
- Published: 2023-06-29
- Granted: 2025-01-07
- Earliest claimed: 2021-12-27
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Woong Gi Kang; Hyung Joon Jeon; Ji Seop Oh; Jeong Ryeol Kim; Eun Jung Kim
- Web page: https://patentgrep.com/patent/US12191080B2

## CPC

- H01G 4/005: Electrodes
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G 4/10: Metal-oxide dielectrics {(H01G4/085 takes precedence)}
- H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)}
- H01G 4/1218: {based on titanium oxides or titanates (H01G4/1245 takes precedence)}
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A multilayer ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the exterior of the body. The dielectric layer includes a plurality of dielectric grains and a grain boundary present between the dielectric grains. A molar ratio (Al/Ti) of Al and Ti included in the grain boundary satisfies 0.022 to 0.028.

## Claims

### Claim 1

A multilayer ceramic electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the exterior of the body,
wherein the dielectric layer includes a plurality of dielectric grains and a grain boundary present between the dielectric grains, and
a molar ratio (Al/Ti) of Al and Ti included in the grain boundary satisfies 0.022 to 0.028.

### Claim 2 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric grains have a core-shell structure.

### Claim 3 (depends on 2)

The multilayer ceramic electronic component of claim 2, wherein Rg/Rs is 0.953 or less, where Rg is the molar ratio (Al/Ti) of Al and Ti included in the grain boundary, and Rs is a molar ratio (Al/Ti) of Al and Ti included in a shell.

### Claim 4 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric grains include a main ingredient represented by ABO3, where A is at least one of Ba, Sr, Pb, and Ca, and B is at least one of Ti and Zr.

### Claim 5 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer includes one or more of Y, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, La, and Lu.

### Claim 6 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer includes one or more of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn, and Mg.

### Claim 7 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer includes an oxide or carbonate including Ba.

### Claim 8 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer includes an oxide or carbonate including one or more of Ca, Ti, and Zr.

### Claim 9 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric grains have an average grain size of 50 to 500 nm.

### Claim 10 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the grain boundary has an average thickness of 0.7 to 1.5 nm.

### Claim 11 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer has an average thickness of 0.4 μm or less.

### Claim 12 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric grains include BaTiO3 as a main ingredient.

### Claim 13 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein the dielectric layer includes Dy.

### Claim 14 (depends on 1)

A method for manufacturing the multilayer ceramic electronic component of claim 1, comprising:
preparing barium titanate (BaTiO3) powder including mixing barium titanate (BaTiO3) particles with a solution including Dy and aluminum nitrate.

### Claim 15 (depends on 14)

The method of claim 14, wherein the preparing of the barium titanate (BaTiO3) powder excludes mixing the barium titanate (BaTiO3) particles with an oxide of aluminum.

### Claim 16 (depends on 14)

The method of claim 14, further comprising applying the barium titanate (BaTiO3) powder to a sheet.

### Claim 17 (depends on 16)

The method of claim 16, further comprising sintering the sheet to form the dielectric layer.

### Claim 18

A multilayer ceramic electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the exterior of the body,
wherein the dielectric layer includes dielectric grains having a core-shell structure and a grain boundary present between the dielectric grains, and
Rg/Rs is 0.953 or less, Rg is a molar ratio (Al/Ti) of Al and Ti included in the grain boundary, and Rs is a molar ratio (Al/Ti) of Al and Ti included in a shell.

### Claim 19 (depends on 18)

The multilayer ceramic electronic component of claim 18, wherein the grain boundary has an average thickness of 0.7 to 1.5 nm.

### Claim 20 (depends on 18)

The multilayer ceramic electronic component of claim 18, wherein the dielectric layer has an average thickness of 0.4 μm or less.