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US 12,188,231 B2Granted
Systems and methods for a wall assembly having an acoustic panel
AssigneeHercuTech, Inc.
InventorRandall C. Hartwick
Life of this patent
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Abstract
Various embodiments for a wall assembly having an acoustic panel defining a plurality of thru-holes that act to break low density mechanically coupled pathways for sound transmission through the acoustic panel for reducing sound transmission are disclosed herein.
Claims5
A method, comprising:
- forming a panel body defining a front side, a rear side, a top side, a bottom side, a first lateral side, a second lateral side opposite the first lateral side;
- forming a plurality of thru-holes through the panel body from the front side of the panel body to the rear side of the panel body;
- forming a plurality of vertical voids through the panel body from the top side to the bottom side;
- forming a vertical slit along the panel body that communicates between a vertical void of the plurality of vertical voids and the front side or the rear side of the panel body;
- and
- coupling a reinforcement strip within the vertical slit such that a plurality of laterally extending tab portions of the reinforcement strip couple within a respective vertical void of the plurality of vertical voids.
3 more elements
Dependencies are inferred from the claim text.