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US 12,187,842 B2Granted
Structural bonding adhesive
AssigneeZephyros, Inc.
InventorsDavid Kosal, Michael Czaplicki, Yuan Lu
Life of this patent
Estimating the term…
Abstract
A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.
Claims17
A curable material comprising:
- i) an epoxy/elastomer adduct;
- ii) a polymeric particle dispersed in epoxy and present in an amount of up to 30% by weight of the curable material;
- iii) an epoxy/diacid adduct present in an amount of from about 0.05% to about 20% by weight of the curable material;
- iv) a silane-modified epoxy;
- v) a curing agent;
- vi) an amine reaction product which is optionally adducted with epoxy and selected from the group consisting of 1-naphthylamine, 2-naphthylamine, ethanolamine, phenethylamine, oleylamine and a combination thereof;
- and
- vii) a phenoxy resin component;
- wherein when cured, the material exhibits a strain to failure of at least 8% as measured in accordance with ISO 527 and a tensile modulus from about 900 MPa to about 1700 MPa in accordance with ASTM D638 Type IV test method.
6 more elements
Dependencies are inferred from the claim text.