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US 12,187,424 B2Granted
Integrally stiffened bonded panel with vented pockets and methods of manufacture
AssigneeThe Boeing Company
InventorsDavid M. Anderson, Jeffrey P. Baucum
Life of this patent
Estimating the term…
Abstract
Methods, systems, and apparatuses are disclosed for the manufacture of composite components having incorporated reinforcing structures machined into composite material substrates, and composite components manufactured according to disclosed methods, and assemblies and larger structures comprising the composite material components.
Claims20
A composite component comprising:
- a first composite material substrate comprising:
- a first composite material substrate thickness;
- a first composite material substrate first surface;
- a first composite material substrate second surface, said first composite material substrate second surface comprising an inner mold line, said first composite material substrate further comprising a plurality of recesses, said plurality of recesses configured to extend from the first composite material second surface to a predetermined distance into the first composite material substrate thickness, said plurality of recesses each comprising a recess perimeter at the first composite material substrate material second surface, said plurality of recesses interconnected by at least one interconnecting channel to form a plurality of interconnected recesses, said interconnecting channel configured to extend from the first composite material second surface to a predetermined distance into the first composite material substrate thickness;
- a second composite material layer positioned adjacent to the first composite material substrate second surface, said second composite material layer comprising:
- a second composite material layer first surface comprising the inner mold line, said inner mold line configured to be imparted to the second composite material layer first surface from the first composite material substrate second surface, said second composite material layer first surface configured to contact said first composite material substrate second surface, said second composite material layer substrate first surface configured to be bonded to the first composite material substrate second surface to form the composite component;
- wherein said second composite material layer is dimensioned to
- cover the plurality of interconnected recesses and the at least one interconnecting channel to form a sealed internal pathway;
- and
- wherein said sealed internal pathway is bounded by the first composite material substrate and the second composite material layer.
7 more elements
An aircraft comprising:
- a composite component, said composite component comprising:
- a first composite material substrate comprising:
- a first composite material substrate thickness;
- a first composite material substrate first surface;
- said first composite material first surface comprising an outer mold line;
- a first composite material substrate second surface, said first composite material substrate second surface comprising an inner mold line, said first composite material second surface configured to comprise a plurality of recesses, said plurality of recesses recess configured to extend from the first composite material second surface to a predetermined distance into the first composite material substrate thickness, said plurality of recesses each comprising a recess perimeter at the first composite material substrate material second surface, said plurality of recesses interconnected by at least one interconnecting channel to form a plurality of interconnected recesses, said interconnecting channel configured to extend from the first composite material second surface to a predetermined distance into the first composite material substrate thickness;
- a second composite material layer positioned adjacent to the first composite material substrate second surface, said second composite material layer comprising:
- a second composite material layer first surface comprising the inner mold line, said inner mold line configured to be imparted to the second composite material layer first surface from the first composite material substrate second surface, said second composite material layer first surface configured to contact said first composite material substrate second surface, said second composite material layer first surface configured to be bonded to the first composite material substrate second surface to form the composite component;
- wherein said second composite material layer is dimensioned to cover the plurality of recesses and the at least one interconnecting channel to form a sealed internal pathway;
- and
- wherein said sealed internal pathway is bounded by the first composite material substrate and the second composite material layer.
8 more elements
Dependencies are inferred from the claim text.