Method for manufacturing an opto-electronic component substrate
AssigneesCentre National De La Recherche Scientifique, Universite Paul Sabatier Toulouse III
InventorsManuel Lopes, Benoit Schlegel, David Buso, Georges Zissis
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Abstract
The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.
Claims6
A method for manufacturing a substrate of an optoelectronic component comprising a stack of layers, the method comprising a step of:
- preforming a substrate comprising a face having a pattern with at least one zone made of a first material and a zone made of a second material, wherein the first material and the second material each are thermosetting or thermoplastic materials, wherein the first material is an electrically conductive material and the second material is an electrically insulating material, wherein the face of the substrate is planar, and wherein the zone made of the second material completely surrounds the at least one zone made of the first material,
- and
- molding by compression the face of the substrate with a face of a reference element presenting a surface roughness less than or equal to 50 nanometers.
Dependencies are inferred from the claim text.