Selective field-assisted machining system

A selective field-assisted machining system comprising:

• a micron-level high-speed identification module, an in-situ laser assisted module, an ultrasonic vibration module, an energy field loading high-speed control module, and a diamond tool, wherein
• the micron-level high-speed identification module is used to identify a type of a material of a region of a workpiece to be processed and to be cut by the diamond tool, to process identified information into a corresponding control signal, and to send the control signal to the energy field loading high-speed control module comprising an electro-optic modulator and an ultrasonic power controller, so that selective processing of the workpiece to be processed is implemented,
• the electro-optic modulator controls the in-situ laser assisted module to generate a laser field according to the control signal when the type of the material of the region of the workpiece to be processed and to be cut by the diamond tool identified by the micron-level high-speed identification module is particles comprising silicon or silicon carbide, wherein the laser field is focused on a cutting region between the diamond tool and the workpiece to be processed, assists the diamond tool in a cutting process and enhances a machinability of the particles;
• and the ultrasonic power controller controls the ultrasonic vibration module to generate an ultrasonic field according to the control signal when the type of the material of the region of the workpiece to be processed and to be cut by the diamond tool identified by the micron-level high-speed identification module is an aluminum-based metal substrate, and the ultrasonic field allows the diamond tool to be in intermittent contact with the workpiece to be processed, so that processing of the aluminum-based metal substrate is implemented,
• wherein the ultrasonic vibration module is installed at an end of the in-situ laser assisted module and is between the in-situ laser assisted module and the workpiece to be processed, the ultrasonic vibration module comprises an ultrasonic horn, an ultrasonic power supply, and a piezoelectric ceramic unit, and the piezoelectric ceramic unit is installed on the ultrasonic horn, wherein
• a center of the ultrasonic horn is a through hole and is used to focus the laser field generated by the in-situ laser assisted module on the cutting region,
• the ultrasonic power supply and the micron-level high-speed identification module are both connected to the ultrasonic power controller, and the ultrasonic power controller controls the ultrasonic power supply to generate a vibration signal according to the control signal sent by the micron-level high-speed identification module when the type of the material of the region of the workpiece to be processed and to be cut by the diamond tool identified by the micron-level high-speed identification module is the aluminum-based metal substrate, and
• the piezoelectric ceramic unit is connected to the ultrasonic power supply, is used to receive the vibration signal, and converts the vibration signal into a mechanical vibration signal, so that the diamond tool installed at an end of the ultrasonic horn generates two-dimensional ultrasonic vibration, and the intermittent contact between the diamond tool and the workpiece to be processed is implemented.