Semiconductor device

A semiconductor device comprising:

• a first chip having a substrate and a first wiring layer formed on a first surface of the substrate;
• and
• a second wiring layer formed on a second surface of the substrate opposite to the first surface of the substrate;
• wherein the second wiring layer includes
• a first power supply line to which a first power supply potential is supplied, and
• a second power supply line to which a second power supply potential is supplied;
• wherein the first chip includes
• a first ground line,
• a third power supply line to which the first power supply potential is supplied,
• a fourth power supply line to which the second power supply potential is supplied,
• one or more vias formed in the substrate and connecting the first power supply line and the third power supply line,
• a first area in which the first ground line and the fourth power supply line are arranged, and
• a first circuit connected between the first ground line and the third power supply line;
• wherein a switch is connected between the first power supply line and the second power supply line;
• and
• wherein, in a plan view, the third power supply line, the one or more vias, and the first circuit are arranged in the first area.