# US 12,184,260 B2 · Bulk acoustic wave resonator structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,184,260 B2 - Document ID: US12184260B2 - Status: Granted - Kind: B2 - Application number: 18/054,727 - Filed: 2022-11-11 - Published: 2023-03-09 - Granted: 2024-12-31 - Earliest claimed: 2019-02-27 - Assignees: Skyworks Global Pte. Ltd. - Applicants: Skyworks Global Pte. Ltd. - Inventors: Kwang Jae Shin; Renfeng Jin; Li Chen - Web page: https://patentgrep.com/patent/US12184260B2 ## CPC - H03H 9/02086: {Means for compensation or elimination of undesirable effects} - H03H 9/587: {Air-gaps} - H03H 9/02015: {Characteristics of piezoelectric layers, e.g. cutting angles} - H03H 9/02047: {Treatment of substrates} - H03H 9/02118: {of lateral leakage between adjacent resonators} - H03H 9/02125: {of parasitic elements} - H03H 9/0504: {for bulk acoustic wave devices} - H03H 9/131: {consisting of a multilayered structure} - H03H 9/173: {Air-gaps} - H03H 9/205: having multiple resonators (crystal tuning forks H03H9/21) - H03H 9/582: {implemented with thin-film techniques} - H03H 9/589: {Acoustic mirrors} - H03H 9/605: {consisting of a ladder configuration} - H03H 9/703: {Networks using bulk acoustic wave devices} - H03H 9/706: {Duplexers} - H04B 1/0057: {using diplexing or multiplexing filters for selecting the desired band} - H03H 2009/02173: {of film bulk acoustic resonators [FBAR]} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H04B: TRANSMISSION ## Abstract Embodiments of this disclosure relate to bulk acoustic wave resonators on a substrate. The bulk acoustic wave resonators include a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, a conductor electrically connecting the first bulk acoustic wave resonator to the second bulk acoustic wave resonator, and an air gap positioned between the conductor and a surface of the substrate. ## Claims ### Claim 1 An acoustic wave filter with second harmonic suppression, the acoustic wave filter comprising: a first bulk acoustic wave resonator on a first side of a substrate, the first bulk acoustic wave resonator including an air cavity; a second bulk acoustic wave resonator on the first side of the substrate in anti-series with the first bulk acoustic wave resonator; and an air gap configured to cause parasitic capacitance associated with an electrical connection between the first bulk acoustic wave resonator and the second bulk acoustic wave resonator to be reduced, the air gap positioned between the electrical connection and the first side of the substrate, the air gap including an air bridge positioned a greater distance from a second side of the substrate than the air cavity, the second side of the substrate being opposite to the first side of the substrate, and the acoustic wave filter configured to filter a radio frequency signal. ### Claim 2 (depends on 1) The acoustic wave filter of claim 1 wherein the first bulk acoustic wave resonator includes a multi-layer raised frame structure. ### Claim 3 (depends on 1) The acoustic wave filter of claim 1 wherein the acoustic wave filter is a transmit filter. ### Claim 4 (depends on 3) The acoustic wave filter of claim 3 wherein the first bulk acoustic wave resonator and the second bulk acoustic wave resonator are series acoustic wave resonators, and all other series acoustic resonators of the acoustic wave filter are connected to an antenna node by way of the first bulk acoustic wave resonator and the second bulk acoustic wave resonator. ### Claim 5 (depends on 1) The acoustic wave filter of claim 1 wherein the first bulk acoustic wave resonator includes a first air cavity, the second bulk acoustic wave resonator includes a second air cavity, and the air gap is non-overlapping with both the first air cavity and the second air cavity. ### Claim 6 (depends on 1) The acoustic wave filter of claim 1 wherein the air cavity has a greater depth than the air bridge. ### Claim 7 (depends on 1) The acoustic wave filter of claim 1 wherein the air bridge is positioned between a layer of piezoelectric material and the electrical connection. ### Claim 8 (depends on 1) The acoustic wave filter of claim 1 wherein the air bridge is positioned between a layer of piezoelectric material and the first side of the substrate. ### Claim 9 (depends on 1) A radio frequency module comprising: the acoustic wave filter of claim 1; a radio frequency amplifier; and a packaging structure enclosing the acoustic wave filter and the radio frequency amplifier. ### Claim 10 (depends on 9) The radio frequency module of claim 9 further comprising a second acoustic wave filter, the acoustic wave filter and the second acoustic wave filter being included in a multiplexer. ### Claim 11 (depends on 9) The radio frequency module of claim 9 wherein the acoustic wave filter is configured to filter fifth generation New Radio signal within a frequency band in Frequency Range 1. ### Claim 12 An acoustic wave filter with second harmonic suppression, the acoustic wave filter comprising: a first bulk acoustic wave resonator on a substrate, the first bulk acoustic wave resonator including a first air cavity; a second bulk acoustic wave resonator on the substrate in anti-series with the first bulk acoustic wave resonator, the second bulk acoustic wave resonator including a second air cavity; and an air gap configured to cause parasitic capacitance associated with an electrical connection between the first bulk acoustic wave resonator and the second bulk acoustic wave resonator to be reduced, the air gap positioned between the electrical connection and the substrate, the air gap overlaps with both the first air cavity and the second air cavity, and the acoustic wave filter configured to filter a radio frequency signal. ### Claim 13 An acoustic wave filter with second harmonic suppression, the acoustic wave filter comprising: a first bulk acoustic wave resonator on a substrate; a second bulk acoustic wave resonator on the substrate in anti-series with the first bulk acoustic wave resonator; a first air bridge configured to cause parasitic capacitance associated with an electrical connection between the first bulk acoustic wave resonator and the second bulk acoustic wave resonator to be reduced, the first air bridge positioned between the electrical connection and the substrate; and a second air bridge configured to cause the parasitic capacitance associated with the electrical connection to be reduced, and the acoustic wave filter configured to filter a radio frequency signal. ### Claim 14 An acoustic wave filter with second harmonic suppression, the acoustic wave filter comprising: a first bulk acoustic wave resonator on a substrate; a second bulk acoustic wave resonator on the substrate in anti-series with the first bulk acoustic wave resonator; and an air gap configured to cause parasitic capacitance associated with an electrical connection between the first bulk acoustic wave resonator and the second bulk acoustic wave resonator to be reduced, the air gap positioned between the electrical connection and the substrate, the air gap including an air bridge that has a depth in a range from 0.1 micrometer to 0.2 micrometer, and the acoustic wave filter configured to filter a radio frequency signal. ### Claim 15 (depends on 14) The acoustic wave filter of claim 14 wherein the first bulk acoustic wave resonator is a solidly mounted bulk acoustic wave resonator. ### Claim 16 (depends on 14) The acoustic wave filter of claim 14 wherein the first bulk acoustic wave resonator includes an air cavity, the first bulk acoustic wave resonator is on a first side of the substrate, and the air gap is a greater distance from a second side of the substrate than the air cavity, the second side of the substrate being opposite to the first side of the substrate. ### Claim 17 An acoustic wave filter with second harmonic suppression, the acoustic wave filter comprising: a first bulk acoustic wave resonator on a substrate; a second bulk acoustic wave resonator on the substrate in anti-series with the first bulk acoustic wave resonator; and an air gap configured to cause parasitic capacitance associated with an electrical connection between the first bulk acoustic wave resonator and the second bulk acoustic wave resonator to be reduced, the air gap positioned between the electrical connection and the substrate, the air gap including an air cavity, the air cavity being a common air cavity that extends from under an electrode of the first bulk acoustic wave resonator to under an electrode of the second bulk acoustic wave resonator, and the acoustic wave filter configured to filter a radio frequency signal. ### Claim 18 (depends on 17) The acoustic wave filter of claim 17 further comprising an air bridge configured to cause the parasitic capacitance associated with the electrical connection to be reduced. ### Claim 19 (depends on 1) A wireless communication device comprising: a baseband processor; a transceiver in communication with the baseband processor; a radio frequency front end in communication with the transceiver, the radio frequency front end including the acoustic wave filter of claim 1; and an antenna in communication with the radio frequency front end. ### Claim 20 (depends on 19) The wireless communication device of claim 19 wherein the wireless communication device is a mobile phone.