# US 12,184,253 B2 · Filter radio frequency module packaging structure and method for manufacturing same

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- Number: US 12,184,253 B2
- Document ID: US12184253B2
- Status: Granted
- Kind: B2
- Application number: 18/038,371
- Filed: 2021-07-27
- Published: 2024-01-04
- Granted: 2024-12-31
- Earliest claimed: 2021-06-21
- Assignees: Institute of Semiconductors, Guangdong Academy of Sciences
- Applicants: Institute of Semiconductors, Guangdong Academy of Sciences
- Inventors: Yingqiang Yan; Chuan Hu; Xun Xiang; Wei Zheng; Zhitao Chen; Zhikuan Chen
- Web page: https://patentgrep.com/patent/US12184253B2

## CPC

- H03H 1/0007: {of radio frequency interference filters}
- H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)}
- H03H 9/0523: {for flip-chip mounting}
- H03H 9/059: {consisting of mounting pads or bumps}
- H03H 2001/0021: {Constructional details}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.

## Claims

### Claim 1

A filter radio-frequency module packaging structure, comprising:
a substrate; an encapsulating material; and at least two chips with different functions, wherein
the at least two chips with different functions comprise a first filter chip, a packaging circuit is arranged on the substrate, and the first filter chip comprises a chip body and a wall structure arranged on the chip body of the first filter chip,
the chip body of the first filter chip has a functional area configured to realize a filtering function, wherein the functional area is located on a functional surface of the chip body of the first filter chip, and chip pins of the first filter chip are provided on the functional surface,
the first filter chip is flip-mounted on the substrate and the chip pins are electrically connected to the packaging circuit on the substrate,
the wall structure is arranged on the functional surface of the chip body, and the wall structure, the functional surface and the substrate jointly form a closed cavity, or the wall structure and the functional surface jointly form a closed cavity,
the at least two chips with different functions further comprise a non-filter chip, wherein the non-filter chip is electrically connected to the packaging circuit on the substrate through flip-mounting or wire bonding processes, and
the encapsulating material and the substrate encapsulate the at least two chips with different functions.

### Claim 2 (depends on 1)

The filter radio-frequency module packaging structure according to claim 1, wherein the first filter chip is flip-mounted on the substrate, the chip pins of the first filter chip are connected to the packaging circuit on a surface of the substrate through bumps, and the wall structure comprises a dam protruding from the functional surface, wherein the dam forms a cavity with an opening, and a side of the dam away from the chip body abuts against the substrate, so that the substrate blocks the opening of the cavity, and the dam, the functional surface, the encapsulating material and the substrate jointly form a closed cavity.

### Claim 3 (depends on 2)

The filter radio-frequency module packaging structure according to claim 2, wherein the first filter chip comprises a plurality of functions of a filter device.

### Claim 4 (depends on 2)

The filter radio-frequency module packaging structure according to claim 2, wherein the encapsulating material is formed by transfer molding, die-casting molding, injection molding, or vacuum coating process.

### Claim 5 (depends on 2)

The filter radio-frequency module packaging structure according to claim 2, wherein the substrate comprises a first surface and a second surface opposite to each other, and the packaging circuit on the substrate comprises a first circuit layer located on the first surface and a second circuit layer located on the second surface, and the dam abuts against the first circuit layer, the bumps are connected to the first circuit layer.

### Claim 6 (depends on 2)

The filter radio-frequency module packaging structure according to claim 2, wherein the at least two chips with different functions further comprise a second filter chip electrically connected to the packaging circuit on the substrate, wherein a closed cavity is formed at a functional surface of the second filter chip.

### Claim 7 (depends on 6)

The filter radio-frequency module packaging structure according to claim 6, wherein the substrate comprises a first surface and a second surface opposite to each other, and the packaging circuit on the substrate comprises a first circuit layer located on the first surface and a second circuit layer located on the second surface, wherein an insulating protection layer is laid on the first surface, and a groove is formed on the insulating protection layer to expose at least a part of the packaging circuit and a part of a surface of the substrate, the second filter chip is flip-mounted on the first surface, pins on the functional surface of the second filter chip are connected to the packaging circuit exposed by the groove through bumps, and a part of the functional surface of the second filter chip abuts against the insulating protection layer, the other part forms a closed cavity with the surface of the substrate exposed from the groove, a sidewall of the groove, and the encapsulating material.

### Claim 8 (depends on 1)

The filter radio-frequency module packaging structure according to claim 1, wherein the first filter chip comprises a plurality of functions of a filter device.

### Claim 9 (depends on 8)

The filter radio-frequency module packaging structure according to claim 8, wherein the encapsulating material is formed by transfer molding, die-casting molding, injection molding, or vacuum coating process.

### Claim 10 (depends on 1)

The filter radio-frequency module packaging structure according to claim 1, wherein the encapsulating material is formed by transfer molding, die-casting molding, injection molding, or vacuum coating process.

### Claim 11 (depends on 1)

The filter radio-frequency module packaging structure according to claim 1, wherein the substrate comprises a first surface and a second surface opposite to each other, the circuit on the substrate comprises a first circuit layer located on the first surface and a second circuit layer located on the second surface, and the first filter chip is arranged on the first surface of the substrate, and the substrate further comprises an insulating protection layer laid on the first circuit layer and the second circuit layer, and at least a part of circuits of the first circuit layer and the second circuit layer is exposed from the insulating protection layer.

### Claim 12 (depends on 11)

The filter radio-frequency module packaging structure according to claim 11, wherein the insulating protection layer has a flatness of 0-10 microns.

### Claim 13 (depends on 1)

The filter radio-frequency module packaging structure according to claim 1, wherein the non-filter chip is a power amplifier, a radio frequency switch, a low noise amplifier, a filter duplexer or a power amplifier.

### Claim 14

A method for manufacturing a filter radio-frequency module packaging structure, comprising following steps:
obtaining a substrate, wherein a packaging circuit is provided on the substrate;
obtaining a non-filter chip, and electrically connecting the non-filter chip with the packaging circuit on the substrate through flip-mounting or wire bonding processes;
obtaining a chip body of a first filter chip, wherein the chip body has a functional area configured to realize a filtering function, the functional area is located on a functional surface of the chip body, and chip pins are provided on the functional surface;
fabricating a wall structure on the functional surface of the chip body to obtain the first filter chip, and making the wall structure form a cavity;
flip-mounting the first filter chip on the substrate so that the chip pins are electrically connected to the packaging circuit on the substrate, wherein the wall structure and the functional surface of the first filter chip and the substrate jointly form a closed cavity, or the wall structure and the functional surface jointly form a closed cavity; and
wrapping each chip with an encapsulating material.

### Claim 15 (depends on 14)

The method for manufacturing a filter radio-frequency module packaging structure according to claim 14, wherein the wall structure comprises a dam protruding from the functional surface, and the dam forms a cavity with an opening; and the flip-mounting the first filter chip on the substrate so that the chip pins are electrically connected to the packaging circuit comprises:
flip-mounting the first filter chip on the substrate, using the bumps to connect the chip pins of the chip body and the packaging circuit on the substrate, wherein a side of the dam away from the chip body abuts against the substrate, so that the substrate blocks the opening of the cavity, and the dam, the functional surface and the substrate jointly form a closed cavity.

### Claim 16 (depends on 14)

The method for manufacturing a filter radio-frequency module packaging structure according to claim 14, wherein the wall structure comprises a dam protruding from the functional surface and a cover connected to the dam, wherein the dam forms a cavity with an opening, and the cover covers the opening of the cavity so that the dam, the cover and the functional surface jointly form a closed cavity.

### Claim 17 (depends on 14)

The method for manufacturing a filter radio-frequency module packaging structure according to claim 14, wherein the encapsulating material is wrapped outside each chip by using transfer molding, die-casting molding, injection molding or vacuum coating processes.

### Claim 18 (depends on 14)

The method for manufacturing a filter radio-frequency module packaging structure according to claim 14, wherein the obtaining a substrate further comprises: fabricating an insulating protection layer to selectively cover the packaging circuit.