# US 12,184,192 B2 · Systems for thermal management of a vehicle

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,184,192 B2
- Document ID: US12184192B2
- Status: Granted
- Kind: B2
- Application number: 18/056,622
- Filed: 2022-11-17
- Published: 2024-05-23
- Granted: 2024-12-31
- Earliest claimed: 2022-11-17
- Assignees: Dana Tm4 Inc.
- Applicants: Dana Tm4 Inc.
- Inventors: Michel Brazeau; Michel Tulane; Pascal Fleury; Alexandre Marquis; Francois Dube; Maxime Caron; Maalainine El Yacoubi; Martin Houle
- Web page: https://patentgrep.com/patent/US12184192B2

## CPC

- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 7/20927: {Liquid coolant without phase change}
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Systems are provided for a cooling system for an electric vehicle. In one example, a system includes a plate arranged between separate circuit boards. The plate directly cools one of the circuit boards and block thermal communication between the circuit boards.

## Claims

### Claim 1

A system, comprising: an inverter comprising a plate arranged between a power board and a control board, wherein the plate comprises a plurality of tabs for mounting the plate and the power board to a base; wherein the base comprises a coolant jacket into which the plurality of tabs extends.

### Claim 2 (depends on 1)

The system of claim 1, wherein the power board comprises a plurality of gate resistors.

### Claim 3 (depends on 2)

The system of claim 2, wherein each of the plurality of gate resistors is coupled to a thermal pad.

### Claim 4 (depends on 3)

The system of claim 3, wherein the thermal pad extends from the power board to the control board.

### Claim 5 (depends on 1)

The system of claim 1, wherein the control board is coupled to the power board via a connector, wherein the connector extends outside a profile of the plate.

### Claim 6 (depends on 1)

The system of claim 1, wherein the plate is above the power board and below the control board.

### Claim 7

An inverter, comprising: a control board above a power board; and a plate arranged between the control board and the power board, wherein the plate is configured to directly cool the power board; wherein the plate comprises a plurality of tabs extending into a coolant jacket.

### Claim 8 (depends on 7)

The inverter of claim 7, wherein the plate comprises metal.

### Claim 9 (depends on 7)

The inverter of claim 7, wherein the plurality of tabs extends through the power board and mount the power board to the inverter.

### Claim 10 (depends on 7)

The inverter of claim 7, wherein the plurality of tabs is adjacent to gate resistors of the power board.

### Claim 11 (depends on 7)

The inverter of claim 7, wherein the plate is spaced away from a top side of the power board and an underside of the control board.

### Claim 12 (depends on 7)

The inverter of claim 7, wherein the plate is configured to support the control board.

### Claim 13 (depends on 7)

The inverter of claim 7, wherein the plate comprises aluminum, and wherein the control board and the power board are printed circuit boards.

### Claim 14

A system for an inverter, comprising:
a control board above a power board; and
a plate arranged between the control board and the power board, wherein the plate is configured to mount the power board to a base comprising a cooling jacket, wherein the plate comprises a plurality of tabs that extend into the cooling jacket.

### Claim 15 (depends on 14)

The system of claim 14, wherein the plate comprises a plurality of openings through which thermal pads extend.

### Claim 16 (depends on 15)

The system of claim 15, wherein the thermal pads extend from gate resistors of the power board to an underside of the control board.

### Claim 17 (depends on 14)

The system of claim 14, wherein the plate comprises an indentation along a lateral edge, and wherein a connector for transmitting signals from the control board to the power board extends adjacent to the indentation.

### Claim 18 (depends on 14)

The system of claim 14, wherein the plate is actively cooled via coolant contacting the plurality of tabs.