# US 12,184,191 B2 · Power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,184,191 B2 - Document ID: US12184191B2 - Status: Granted - Kind: B2 - Application number: 18/010,392 - Filed: 2021-07-01 - Published: 2023-09-21 - Granted: 2024-12-31 - Earliest claimed: 2020-09-17 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Tan Nhat Hoang; Yoshihisa Tsukamoto - Web page: https://patentgrep.com/patent/US12184191B2 ## CPC - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 1/088: for the simultaneous control of series or parallel connected semiconductor devices - H10W 44/401: {Resistive arrangements (H10W44/20, H10W42/80 take precedence)} - H10W 90/00: Package configurations - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 2201/0723: provided by an inner layer of PCB - H05K 2201/09618: Via fence, i.e. one-dimensional array of vias - H05K 2201/10166: Transistor - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided are switching elements 4, gate driver ICs 5 controlling the switching elements, and substrate 1 carrying the gate driver ICs. Substrate 1 includes base 2 and conductive portion 3 with obverse and reverse surface conductive layers 31, 32. Obverse surface conductive layer 31 includes first connection portion 311 connected to control signal output terminal 51 of gate driver IC 5, second connection portion 312 connected to gate electrode 411 of switching element 4, and first wiring portion 313 interposed between first and second connection portions 311, 312. At least one obverse surface-side first electronic component 61 is provided on obverse surface of substrate 1, forming a circuit portion connecting first and second connection portions 311, 312 together with first wiring portion 313. No conductive member penetrating through base 2 in the thickness direction is connected to first wiring portion 313. These configurations increase the speed of drive control. ## Claims ### Claim 1 A power conversion device including: a plurality of switching elements that each have a gate electrode, a source electrode, and a drain electrode; a plurality of gate driver ICs configured to perform drive control of the plurality of switching elements, respectively; and a substrate on which the plurality of gate driver ICs are mounted, wherein the substrate includes: an insulating base having an obverse surface and a reverse surface that face mutually opposite sides in a thickness direction; and a conductive portion that is supported by the base, the conductive portion includes an obverse surface conductive layer arranged on the obverse surface and a reverse surface conductive layer arranged on the reverse surface, the obverse surface conductive layer includes: a first connection portion to which a control signal output terminal of one of the gate driver ICs; a second connection portion to which the gate electrode of a corresponding one of the switching elements; and a first wiring portion that is interposed between the first connection portion and the second connection portion, the power conversion device further comprises at least one obverse surface-side first electronic component that is mounted on the obverse surface and forms a circuit portion connecting the first connection portion and the second connection portion together with the first wiring portion, the first wiring portion is connected to no conductive member penetrating through the base in the thickness direction. ### Claim 2 (depends on 1) The power conversion device according to claim 1, wherein the conductive portion includes a first intermediate conductive layer located between the obverse surface conductive layer and the reverse surface conductive layer in the thickness direction. ### Claim 3 (depends on 2) The power conversion device according to claim 2, wherein a thickness of the first intermediate conductive layer is less than each of thicknesses of the obverse surface conductive layer and the reverse surface conductive layer. ### Claim 4 (depends on 2) The power conversion device according to claim 2, wherein a distance between the obverse surface conductive layer and the first intermediate conductive layer is smaller than each of thicknesses of the obverse surface conductive layer and the first intermediate conductive layer. ### Claim 5 (depends on 2) The power conversion device according to claim 2, wherein the conductive portion includes a second intermediate conductive layer located between the first intermediate conductive layer and the reverse surface conductive layer in the thickness direction. ### Claim 6 (depends on 5) The power conversion device according to claim 5, wherein a thickness of the second intermediate conductive layer is less than each of thicknesses of the obverse surface conductive layer and the reverse surface conductive layer. ### Claim 7 (depends on 5) The power conversion device according to claim 5, wherein a distance between the reverse surface conductive layer and the second intermediate conductive layer is smaller than each of thicknesses of the reverse surface conductive layer and the second intermediate conductive layer. ### Claim 8 (depends on 5) The power conversion device according to claim 5, wherein a distance between the first intermediate conductive layer and the second intermediate conductive layer is greater than each of thicknesses of the obverse surface conductive layer, the reverse surface conductive layer, the first intermediate conductive layer, and the second intermediate conductive layer. ### Claim 9 (depends on 5) The power conversion device according to claim 5, wherein the first intermediate conductive layer includes a first ground pattern portion connected to ground wiring. ### Claim 10 (depends on 9) The power conversion device according to claim 9, wherein the second intermediate conductive layer includes a second ground pattern portion connected to ground wiring. ### Claim 11 (depends on 10) The power conversion device according to claim 10, wherein the second intermediate conductive layer includes a power source pattern portion connected to power source wiring, and the power source pattern portion overlaps with the first ground pattern portion as viewed along the thickness direction. ### Claim 12 (depends on 5) The power conversion device according to claim 5, wherein the obverse surface conductive layer includes: a third connection portion to which a Miller clamp terminal of the above-mentioned one of the gate driver ICs; and a second wiring portion that is interposed between the third connection portion and the second connection portion, the power conversion device further comprises at least one obverse surface-side second electronic component that is mounted on the obverse surface and forms a circuit portion connecting the third connection portion and the second connection portion together with the second wiring portion, and the second wiring portion is connected to no conductive member penetrating through the base in the thickness direction. ### Claim 13 (depends on 5) The power conversion device according to claim 5, wherein the reverse surface conductive layer includes a third wiring portion that is electrically connected to the second connection portion and a fourth wiring portion that is connected to ground wiring, and the power conversion device further comprises at least one reverse surface-side electronic component that is mounted on the reverse surface and is electrically connected to the third wiring portion and the fourth wiring portion. ### Claim 14 (depends on 5) The power conversion device according to claim 5, wherein the obverse surface conductive layer includes a first input pattern portion that is electrically connected to an external positive electrode-side input terminal, the reverse surface conductive layer includes a second input pattern portion that is connected to internal negative electrode-side input terminals of an upper arm circuit and a lower arm circuit formed by the switching elements, the first intermediate conductive layer includes a third input pattern portion, the second intermediate conductive layer includes a fourth input pattern portion, the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion overlap with each other as viewed along the thickness direction, and the conductive portion includes a through-out conductive portion that electrically connects the second input pattern portion, the third input pattern portion, and the fourth input pattern portion to each other, and a shunt resistor portion that electrically connects the first input pattern portion and the second input pattern portion to each other. ### Claim 15 (depends on 14) The power conversion device according to claim 14, wherein the conductive portion includes: a plurality of through-out conductive portions; and a through-out conductive member that penetrates through and electrically connects the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion to each other, with a portion of the through-out conductive member forming the shunt resistor portion. ### Claim 16 (depends on 15) The power conversion device according to claim 15, wherein an electric resistance of the plurality of through-out conductive portions is smaller than an electric resistance of the through-out conductive member. ### Claim 17 (depends on 1) The power conversion device according to claim 1, wherein each of the gate driver ICs includes an analog power source input terminal, a ground terminal, and a digital signal input terminal, and the conductive portion includes: an analog ground wiring portion connected to the ground terminal; and a digital ground wiring portion that is connected to the analog ground wiring portion via a coil component. ### Claim 18 (depends on 1) The power conversion device according to claim 1, wherein the switching elements are SiC-MOSFETs.