# US 12,184,034 B2 · Laser module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,184,034 B2 - Document ID: US12184034B2 - Status: Granted - Kind: B2 - Application number: 17/607,419 - Filed: 2020-05-20 - Published: 2022-07-14 - Granted: 2024-12-31 - Earliest claimed: 2019-06-17 - Assignees: Sumitomo Electric Industries, Ltd. - Applicants: Sumitomo Electric Industries, Ltd. - Inventors: Yohei Enya; Yuki Nakamura; Hiromi Nakanishi - Web page: https://patentgrep.com/patent/US12184034B2 ## CPC - H01S 5/0236: using an adhesive - H01S 5/02212: Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis - H01S 5/0222: Gas-filled housings - H01S 5/02255: using beam deflecting elements - H01S 5/024: Arrangements for thermal management - H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element} - H01S 5/0282: {Passivation layers or treatments} - H01S 5/4012: {Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms} - H10W 76/60: Seals - H01S 5/0021: {Degradation or life time measurements} - H01S 5/02253: using lenses - H01S 5/02326: Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses - H01S 5/02438: {Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens} - H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements} - H01S 5/06804: {by monitoring an external parameter, e.g. temperature} - H01S 5/4031: {Edge-emitting structures} - H01S 5/4093: {Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A laser module includes a base, a carrier mounted on the base, a laser diode mounted on the carrier, an organic adhesive layer provided between the laser diode and the carrier, the organic adhesive layer having an exposed portion exposed between the laser diode and the carrier, a cap fixed to the base, the cap covering the carrier, the laser diode, and the organic adhesive layer, and a cover material covering at least a part of the exposed portion of the organic adhesive layer. ## Claims ### Claim 1 A laser module comprising: a base; a carrier mounted on the base; a laser diode mounted on the carrier; an organic adhesive layer provided between the laser diode and the carrier, the organic adhesive layer having an exposed portion exposed between the laser diode and the carrier; a cap fixed to the base, the cap covering the carrier, the laser diode, and the organic adhesive layer; and a cover material covering at least a part of the exposed portion of the organic adhesive layer, the cover material being a film member, wherein the cover material is in direct contact with the laser diode, the carrier and the organic adhesive layer. ### Claim 2 (depends on 1) The laser module according to claim 1, wherein an emission wavelength of the laser diode is 500nm or less. ### Claim 3 A laser module comprising: a base; a carrier mounted on the base; a laser diode mounted on the carrier; an organic adhesive layer provided between the carrier and the base, the organic adhesive layer having an exposed portion exposed between the carrier and the base; a cap fixed to the base, the cap covering the carrier, the laser diode, and the organic adhesive layer; and a cover material covering at least a part of the exposed portion of the organic adhesive layer, the cover material being a film member, wherein the cover material is in direct contact with the carrier, the base and the organic adhesive layer. ### Claim 4 (depends on 3) The laser module according to claim 3, wherein the cover material covers at least a part of the base. ### Claim 5 (depends on 3) The laser module according to claim 3, wherein a temperature adjust element is provided in the carrier. ### Claim 6 A laser module comprising: a base; a carrier mounted on the base; a laser diode mounted on the carrier; an optical element mounted on the carrier; an organic adhesive layer provided between the optical element and the carrier, the organic adhesive layer having an exposed portion exposed between the optical element and the carrier; a cap fixed to the base, the cap covering the carrier, the laser diode, the optical element, and the organic adhesive layer; and a cover material covering at least a part of the exposed portion of the organic adhesive layer, the cover material being a film member, wherein the cover material is in direct contact with the optical element, the carrier and the organic adhesive layer. ### Claim 7 (depends on 1) The laser module according to claim 1, wherein the cover material also covers at least a part of the carrier. ### Claim 8 (depends on 1) The laser module according to claim 1, wherein the cover material covers whole of the exposed portion of the organic adhesive layer. ### Claim 9 (depends on 1) The laser module according to claim 1, wherein the cover material includes silicon oxide. ### Claim 10 (depends on 9) The laser module according to claim 9, wherein the organic adhesive layer includes an organic compound including at least one of Si and O, and wherein the silicon oxide includes at least one of Si and O included in the organic compound. ### Claim 11 (depends on 3) The laser module according to claim 3, wherein the cover material also covers at least a part of the carrier. ### Claim 12 (depends on 3) The laser module according to claim 3, wherein the cover material covers whole of the exposed portion of the organic adhesive layer. ### Claim 13 (depends on 3) The laser module according to claim 3, wherein the cover material includes silicon oxide. ### Claim 14 (depends on 13) The laser module according to claim 13, wherein the organic adhesive layer includes an organic compound including at least one of Si and O, and wherein the silicon oxide includes at least one of Si and O included in the organic compound. ### Claim 15 (depends on 6) The laser module according to claim 6, wherein the cover material also covers at least a part of the carrier. ### Claim 16 (depends on 6) The laser module according to claim 6, wherein the cover material covers whole of the exposed portion of the organic adhesive layer. ### Claim 17 (depends on 6) The laser module according to claim 6, wherein the cover material includes silicon oxide. ### Claim 18 (depends on 17) The laser module according to claim 17, wherein the organic adhesive layer includes an organic compound including at least one of Si and O, and wherein the silicon oxide includes at least one of Si and O included in the organic compound.