# US 12,184,005 B2 · Connector and method for manufacturing the same

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- Number: US 12,184,005 B2
- Document ID: US12184005B2
- Status: Granted
- Kind: B2
- Application number: 17/661,282
- Filed: 2022-04-28
- Published: 2023-09-14
- Granted: 2024-12-31
- Earliest claimed: 2022-03-08
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: Ching-Ho Hsieh; Ming-Hsing Wu; Keui-Sheng Wu
- Web page: https://patentgrep.com/patent/US12184005B2

## CPC

- H01R 12/58: terminals for insertion into holes
- H01R 13/17: with spring member on the pin
- H01R 12/7076: {for connection between PCB and component, e.g. display}
- H01R 12/7082: {Coupling device supported only by cooperation with PCB}
- H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.

## Claims

### Claim 1

A connector, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a conductive through hole extending between the first surface and the second surface;
a coverlay, disposed on the first surface and including a first opening; and
a spring contact, including:
an anchor member, disposed between the substrate and the coverlay;
a rising member, extending from the anchor member and through the first opening in a direction away from the substrate, wherein a first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening; and
a pin, extending from the anchor member to an inside of the conductive through hole, and electrically connected to the conductive through hole, wherein the pin comprises a rear end with a first width positioned inside the conductive through hole and a connective end with a second width positioned opposite the rear end and connected to the anchor member, and a width of the pin between the rear end and the connective end is not larger than the second width.

### Claim 2 (depends on 1)

The connector of claim 1, wherein the pin directly contacts an inner wall of the conductive through hole.

### Claim 3 (depends on 1)

The connector of claim 1, wherein
the first width is less than a diameter of the conductive through hole; and
the second width is larger than the diameter of the conductive through hole.

### Claim 4 (depends on 3)

The connector of claim 3, wherein the width of the pin is gradually increased from the rear end to the connective end.

### Claim 5 (depends on 3)

The connector of claim 3, wherein a ratio of the second width to the diameter of the conductive through hole is between 1.1 and 1.3.

### Claim 6 (depends on 3)

The connector of claim 3, wherein the pin includes a hollow portion extending from the connective end to the rear end.

### Claim 7 (depends on 6)

The connector of claim 6, wherein the hollow portion has a third width, and a ratio of the third width to the second width is between 0.25 and 0.50.

### Claim 8 (depends on 1)

The connector of claim 1, further comprising:
an adhesive layer, disposed between the anchor member and the substrate, and including a second opening formed above the conductive through hole, wherein a width of the second opening is the same as or larger than a diameter of the conductive through hole such that the pin is inserted into the conductive through hole through the second opening.

### Claim 9 (depends on 8)

The connector of claim 8, wherein the adhesive layer is exposed in the first opening.

### Claim 10

A method for manufacturing a connector, comprising:
providing a substrate, wherein the substrate has a first surface, a second surface opposite to the first surface, and a conductive through hole extending between the first surface and the second surface;
providing a first coverlay and a plurality of first spring contacts attached to the first coverlay, wherein the first coverlay includes a first opening and each of the plurality of first spring contacts includes:
an anchor member, connected to the first coverlay;
a rising member, extending from the anchor member and through the first opening, wherein a portion of the rising member is above the first opening; and
a pin, extending from the anchor member in a direction away from the first opening, wherein the pin comprises a rear end with a first width and a connective end with a second width, the connective end is positioned opposite the rear end and connected to the anchor member, and a width of the pin between the rear end and the connective end is not larger than the second width;
disposing the first coverlay and the plurality of first spring contacts attached to the first coverlay onto the first surface of the substrate, wherein the anchor member is between the substrate and the first coverlay;
inserting the pin into the conductive through hole, wherein the rear end is positioned inside the conductive through hole; and
electrically connecting the pin and the conductive through hole.

### Claim 11 (depends on 10)

The method for manufacturing the connector of claim 10, wherein electrically connecting the pin and the conductive through hole comprises making the pin directly contact the conductive through hole.

### Claim 12 (depends on 10)

The method for manufacturing the connector of claim 10, wherein a method for manufacturing the plurality of first spring contacts attached to the first coverlay comprises:
providing a metal foil;
patterning the metal foil to form a plurality of planar spring contacts, wherein each of the plurality of planar spring contacts is connected to each other and includes a rising portion and a pin portion;
punching the plurality of planar spring contacts such that the rising portion and the pin portion of each of the plurality of planar spring contacts are respectively bent to different directions to form the plurality of first spring contacts, wherein the rising portion becomes the rising member, and the pin portion becomes the pin;
attaching the metal foil to the first coverlay, wherein the rising member is inserted through the first opening of the first coverlay and a portion of the rising member is above the first opening; and
patterning the metal foil to separate the plurality of first spring contacts, wherein the plurality of first spring contacts are still attached to the first coverlay.

### Claim 13 (depends on 12)

The method for manufacturing the connector of claim 12, wherein patterning the metal foil to form the plurality of planar spring contacts comprises forming a hollow portion in the pin portion.

### Claim 14 (depends on 13)

The method for manufacturing the connector of claim 13, wherein after inserting the pin into the conductive through hole, the hollow portion is inside the conductive through hole.

### Claim 15 (depends on 10)

The method for manufacturing the connector of claim 10, further comprising:
disposing an adhesive layer on the first surface of the substrate, wherein the adhesive layer includes a second opening, and the conductive through hole is exposed in the second opening.

### Claim 16 (depends on 15)

The method for manufacturing the connector of claim 15, wherein after inserting the pin into the conductive through hole, the anchor member directly contacts the adhesive layer.

### Claim 17 (depends on 10)

The method for manufacturing the connector of claim 10, wherein inserting the pin into the conductive through hole comprises keeping moving the pin into the conductive through hole until the pin directly contacts the conductive through hole.

### Claim 18 (depends on 10)

The method for manufacturing the connector of claim 10, further comprising:
providing a second coverlay and a plurality of second spring contacts attached to the second coverlay, wherein the second coverlay is substantially identical to the first coverlay, and the plurality of second spring contacts is substantially identical to the plurality of first spring contacts; and
disposing the second coverlay and the plurality of second spring contacts attached to the second coverlay onto the second surface of the substrate when disposing the first coverlay and the plurality of first spring contacts attached to the first coverlay onto the first surface of the substrate.
