# US 12,183,867 B2 · Driving substrate, manufacturtion method thereof and display device

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- Number: US 12,183,867 B2
- Document ID: US12183867B2
- Status: Granted
- Kind: B2
- Application number: 17/628,926
- Filed: 2021-03-10
- Published: 2022-08-11
- Granted: 2024-12-31
- Earliest claimed: 2020-04-30
- Assignees: Boe Technology Group Co., Ltd.
- Applicants: Boe Technology Group Co., Ltd.
- Inventors: Xinhong Lu; Zhanfeng Cao; Jingshang Zhou; Liuqing Li; Ting Zeng; Yongfei Li; Qi Qi
- Web page: https://patentgrep.com/patent/US12183867B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/0364: {of interconnections}
- H10W 90/00: Package configurations
- Y02E 10/549: Organic PV cells
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.

## Claims

### Claim 1

A driving substrate, comprising:
a flexible substrate comprising a display region and a bendable region;
a first conductive layer on the flexible substrate, and comprising a first wire in the display region and a connection wire at least partially in the bendable region;
a flexible insulating layer, comprising: a first insulation pattern in the display region and having a first opening in which the first wire is located, and a second insulation pattern in the bendable region and at a side of the connection wire far away from the flexible substrate;
a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and
a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region,
wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, d2≥2 μm and |d2-d3|≤3 μm.

### Claim 2 (depends on 1)

The driving substrate according to claim 1, wherein the driving substrate is further provided with a protection layer at a side of the planarization layer far away from the flexible substrate and having a hollow structure in the bendable region.

### Claim 3 (depends on 2)

The driving substrate according to claim 2, wherein the protection layer has a hardness greater than 20 GPa.

### Claim 4 (depends on 1)

The driving substrate of claim 1, wherein the first wire comprises a seed pattern and a growth line at a side of the seed pattern far away from the flexible substrate, and
the seed pattern and the connection wire are in a same layer.

### Claim 5 (depends on 1)

The method of claim 1, wherein the second conductive layer comprises a first connection terminal, and
the planarization layer has a second opening communicating to the first connection terminal in a region where the first connection terminal is located.

### Claim 6 (depends on 1)

The driving substrate of claim 1, further comprising:
a first passivation layer between the flexible insulating layer and the flexible substrate, and having a fourth opening formed at a position corresponding to the first opening.

### Claim 7 (depends on 1)

The driving substrate of claim 1, further comprising:
a second passivation layer between the flexible insulating layer and the second conductive layer, and having a hollow structure in the bendable region.

### Claim 8 (depends on 7)

The driving substrate of claim 7, wherein the flexible substrate further comprises a bonding region at a side of the bendable region far away from the display region, and
the second passivation layer has vents in the bonding region.

### Claim 9 (depends on 1)

The driving substrate of claim 1, further comprising:
a third passivation layer between the second conductive layer and the planarization layer, and having a hollow structure in the bendable region.

### Claim 10 (depends on 1)

A display device, comprising a light emitting element and the driving substrate according to claim 1, wherein the light emitting element is at a side of the planarization layer far away from the flexible substrate, and
the light emitting element has a first electrode and a second electrode coupled to a conductive structure in the second conductive layer by a via in the planarization layer.