# US 12,183,853 B2 · LED module, method for manufacturing LED module, and circuit board

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- Number: US 12,183,853 B2
- Document ID: US12183853B2
- Status: Granted
- Kind: B2
- Application number: 17/444,071
- Filed: 2021-07-30
- Published: 2022-02-10
- Granted: 2024-12-31
- Earliest claimed: 2020-08-04
- Assignees: Japan Display Inc.
- Applicants: Japan Display Inc.
- Inventors: Masanobu Ikeda; Yoshinori Aoki; Akihiro Ogawa
- Web page: https://patentgrep.com/patent/US12183853B2

## CPC

- H10H 20/831: characterised by their shape
- H10H 20/01: Manufacture or treatment
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/032: {of electrodes}
- H10H 20/0364: {of interconnections}
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An LED module includes a first electrode and a second electrode disposed on the substrate, an LED chip disposed on the first electrode and the second electrode, and a first bump between the LED chip and the first electrode, and a second bump between the LED chip and the second electrode. The LED chip includes a cathode electrode facing the first electrode, an anode electrode facing the second electrode, and a step portion between the cathode electrode and the anode electrode, a distance between the first electrode and the cathode electrode is larger than a distance between the second electrode and the anode electrode, and the first bump is disposed to embed the step portion.

## Claims

### Claim 1

A circuit board, comprising: a first electrode for connecting a cathode electrode of an LED; a second electrode for connecting an anode electrode of the LED; a first bump disposed on the first electrode; and a second bump disposed on the second electrode, wherein the shapes of the first bump and the second bump are different, wherein the first bump includes a first spherical body and a second spherical body on the first electrode, each of the first spherical body and the second spherical body is in direct contact with the first electrode, a height of the first spherical body from a top surface of the first electrode is smaller than a height of the second spherical body from the top surface of the first electrode, and the first bump has a shape in which the first spherical body and the second spherical body are fused.

### Claim 2 (depends on 1)

The circuit board according to claim 1, wherein the first spherical body is disposed close to the second bump.

### Claim 3 (depends on 1)

The circuit board according to claim 1, wherein the height of the first spherical body of the first bump is equal to a height of the second bump.