# US 12,183,749 B2 · Photoelectric conversion device and X-ray imaging device

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- Number: US 12,183,749 B2
- Document ID: US12183749B2
- Status: Granted
- Kind: B2
- Application number: 17/677,303
- Filed: 2022-02-22
- Published: 2022-09-15
- Granted: 2024-12-31
- Earliest claimed: 2021-03-09
- Assignees: Sharp Kabushiki Kaisha
- Applicants: Sharp Kabushiki Kaisha
- Inventors: Fumiki Nakano
- Web page: https://patentgrep.com/patent/US12183749B2

## CPC

- H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes}
- H10D 30/6729: {characterised by the electrodes}
- H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F 39/195: {X-ray, gamma-ray or corpuscular radiation imagers}
- H10F 39/80377: {characterised by the channel of the transistor, e.g. channel having a doping gradient}
- H10F 39/8057: {Optical shielding}
- H10F 39/807: {Pixel isolation structures}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

A photoelectric conversion device includes a photoelectric conversion area in which photoelectric conversion elements each including a first electrode, a second electrode, and a photoelectric conversion layer, provided between the first electrode and the second electrode, that contains a semiconductor material are provided in a matrix and a guard ring surrounding a periphery of the photoelectric conversion area in a form of a frame. The guard ring has an intermediate layer containing the same semiconductor material as the photoelectric conversion layer.

## Claims

### Claim 1

A photoelectric conversion device comprising:
a photoelectric conversion area in which photoelectric conversion elements each including a first electrode, a second electrode, and a photoelectric conversion layer, provided between the first electrode and the second electrode, that contains a semiconductor material are provided in a matrix; and
a guard ring surrounding a periphery of the photoelectric conversion area in a form of a frame,
wherein the guard ring has an intermediate layer containing the same semiconductor material as the photoelectric conversion layer.

### Claim 2 (depends on 1)

The photoelectric conversion device according to claim 1, wherein the guard ring has at least one electrically-conductive layer, stacked at a lower layer or a higher layer than the intermediate layer, that contains the same electrical conducting material as at least either the first electrode or the second electrode.

### Claim 3 (depends on 2)

The photoelectric conversion device according to claim 2, wherein
the at least one electrically-conductive layer comprises a plurality of electrically-conductive layers,
the plurality of electrically-conductive layers includes a first layer containing the same electrical conducting material as the first electrode and a second layer containing the same electrical conducting material as the second electrode, and
the intermediate layer is provided between the first layer and the second layer.

### Claim 4 (depends on 1)

The photoelectric conversion device according to claim 1, wherein
the photoelectric conversion layer is a structure in which an n-type semiconductor layer, an i-type semiconductor layer, and a p-type semiconductor layer are stacked, and
the intermediate layer of the guard ring is a structure in which a first intermediate layer containing the same semiconductor material as the n-type semiconductor layer, a second intermediate layer containing the same semiconductor material as the i-type semiconductor layer, and a third intermediate layer containing the same semiconductor material as the p-type semiconductor layer are stacked.

### Claim 5 (depends on 1)

The photoelectric conversion device according to claim 1, further comprising:
a thin-film transistor (TFT) provided in the photoelectric conversion area and electrically connected to a corresponding one of the photoelectric conversion elements; and
a wire formed using a material that is identical to a metal layer forming the TFT,
wherein the wire extends from a first end to a second end in such a way as to cross the guard ring.

### Claim 6 (depends on 1)

The photoelectric conversion device according to claim 1, further comprising:
thin-film transistors (TFTs), provided in the matrix in the photoelectric conversion area, each of which has a drain electrode, a source electrode, and a gate electrode; and
a resin insulating layer covering the TFTs and having a surface provided with the first electrode,
wherein the first electrode is connected to at least either the drain electrode or the source electrode via a contact hole formed in the resin insulating layer.

### Claim 7 (depends on 5)

The photoelectric conversion device according to claim 5, further comprising a resin insulating layer, provided at a crossing of the guard ring and the wire and between the guard ring and the wire, that contains an insulative resin material.

### Claim 8 (depends on 1)

The photoelectric conversion device according to claim 1, further comprising an intermediate electrically-conductive layer provided over the first electrode and between the first electrode and the photoelectric conversion layer.

### Claim 9 (depends on 1)

An X-ray imaging device comprising:
the photoelectric conversion device according to claim 1; and
a scintillator, provided over the photoelectric conversion device, that emits light according to X-rays falling thereon.
