Display substrate, display device, display substrate, method of forming display substrate, and method of forming display device

A display substrate, comprising:

• a first insulating structure, comprising a display area and a frame area, wherein the frame area is arranged around the display area, and at least one first groove is arranged in the first insulating structure of the display area;
• a first wiring layer arranged on the first insulating structure and covering a side surface and a bottom surface of the first groove, the first wiring layer extends from the frame area to the display area;
• a second insulating structure arranged on the first wiring layer, wherein at least one first via-hole is formed in the second insulating structure of the frame area;
• a part of the first wiring layer is located at a bottom surface of the first via-hole;
• a first conductive structure covering a part of an upper surface of the second insulating structure and at least a sidewall and the bottom surface of the first via-hole, and in contact with the first wiring layer under the first via-hole;
• wherein at least one second groove is arranged in the first insulating structure of the display area, and the second groove and the first groove are arranged at intervals;
• the display substrate further comprises a second wiring layer, wherein the second wiring layer is arranged on the first insulating structure and covers a side surface and a bottom surface of the second groove, the second wiring layer extends from the frame area to the display area, a first insulating dielectric layer is further arranged between the second wiring layer and the first insulating structure, and the first insulating dielectric layer covers the first insulating structure and the first wiring layer;
• at least one second via-hole is further formed in the second insulating structure of the frame area, and the second via-hole and the first via-hole are arranged at intervals;
• a second conductive structure covering a part of an upper surface of the second insulating structure and at least a sidewall and a bottom surface of the second via-hole, and in contact with the second wiring layer under the second via-hole;
• the second conductive structure and the first conductive structure receive different types of signals.