# US 12,183,721 B2 · Electronic device and manufacturing method thereof

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,183,721 B2
- Document ID: US12183721B2
- Status: Granted
- Kind: B2
- Application number: 18/527,381
- Filed: 2023-12-04
- Published: 2024-03-21
- Granted: 2024-12-31
- Earliest claimed: 2020-02-19
- Assignees: Innolux Corporation
- Applicants: Innolux Corporation
- Inventors: Jian-Jung Shih; Tsau-Hua Hsieh; Fang-Ying Lin; Kai Cheng
- Web page: https://patentgrep.com/patent/US12183721B2

## CPC

- G01R 31/2635: {Testing light-emitting diodes, laser diodes or photodiodes}
- H10W 90/00: Package configurations
- H10H 29/02: using pick-and-place processes
- H10H 29/37: Pixel-defining structures, e.g. banks between the LEDs
- H10H 29/39: Connection of the pixel electrodes to the driving transistors
- H10K 71/70: Testing, e.g. accelerated lifetime tests
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 74/232: {comprising connection or disconnection of parts of a device in response to a measurement}
- H10W 72/0198: {batch processes}
- H10P 72/7432: {used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate}
- H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

## Claims

### Claim 1

An electronic device, comprising:
a substrate;
a spacer disposed on the substrate and having a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction, wherein in a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening; wherein a width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening;
a first element overlapped with the first opening; and
a second element overlapped with the third opening.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein the first element and the second element are light-emitting diodes.

### Claim 3 (depends on 1)

The electronic device according to claim 1, further comprising:
a plurality of the first elements overlapped with the first opening.

### Claim 4 (depends on 1)

The electronic device according to claim 1, further comprising:
a plurality of the second elements overlapped with the third opening.

### Claim 5 (depends on 1)

The electronic device according to claim 1, further comprising:
at least one third element overlapped with the second opening.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein the substrate is a flexible substrate.

### Claim 7 (depends on 1)

The electronic device according to claim 1, further comprising:
a driving circuit disposed on the substrate and configured to drive at least one of the first element and the second element.
