# US 12,183,714 B2 · Package structures and method for forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,714 B2 - Document ID: US12183714B2 - Status: Granted - Kind: B2 - Application number: 17/395,946 - Filed: 2021-08-06 - Published: 2022-11-10 - Granted: 2024-12-31 - Earliest claimed: 2021-05-07 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Chin-Hua Wang; Shu-Shen Yeh; Yu-Sheng Lin; Po-Yao Lin; Shin-Puu Jeng - Web page: https://patentgrep.com/patent/US12183714B2 ## CPC - H10W 90/00: Package configurations - H10P 72/74: {using temporarily an auxiliary support} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 76/01: Manufacture or treatment - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00) - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H10W 72/072: {of bump connectors} - H10W 72/07207: {Temporary substrates, e.g. removable substrates} - H10W 72/073: {of die-attach connectors} - H10W 72/07307: {the auxiliary member being a temporary substrate, e.g. a removable substrate} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 76/10: Containers or parts thereof - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A package structure is provided. The package structure includes a first package component, a second package component, and a lid structure. The first package component includes a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies. The second package component includes a substrate, and the first package component is mounted on the substrate. The lid structure is disposed on the second package component and around the first package component, and the lid structure covers the integrated circuit dies and exposes the underfill. ## Claims ### Claim 1 A package structure, comprising: a first package component, comprising a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies; a second package component comprising a substrate, wherein the first package component is mounted on the substrate; a lid structure disposed on the second package component and around the first package component, wherein the lid structure has a plurality of sections separated from each other by first spaces, and each of the sections of the lid structure covers the integrated circuit dies and exposes the underfill, wherein the underfill is separated from the first spaces; and a thermal interface material comprising a first portion and a second portion vertically sandwiched between the plurality of integrated circuit dies of the first package component and the lid structure, wherein the first portion and the second portion of the thermal interface material are laterally separated from each other, and a space between the first portion and the second portion is exposed from the lid structure. ### Claim 2 (depends on 1) The package structure as claimed in claim 1, further comprising an electronic component disposed on the substrate, wherein the lid structure has a first foot and a second foot, the first foot and the second foot extend toward the substrate, the electronic component is covered by the lid structure and located between the first foot and the second foot. ### Claim 3 (depends on 2) The package structure as claimed in claim 2, wherein the lid structure further has a body connected to the first foot and the second foot, and a gap is formed between the electronic component and the body. ### Claim 4 (depends on 2) The package structure as claimed in claim 2, wherein the lid structure further has a third foot disposed between the first foot and the second foot. ### Claim 5 (depends on 2) The package structure as claimed in claim 2, wherein the second foot is located closer to the first package component than the first foot, and the second foot extends to an edge of the lid structure. ### Claim 6 (depends on 1) The package structure as claimed in claim 1, wherein sidewalls of the first portion and the second portion of the thermal interface material are free from contact with the lid structure. ### Claim 7 A package structure, comprising: a first package component mounted on a substrate; a lid structure disposed on the first package component and around the first package component, wherein the lid structure has a plurality of sections separated from each other, and each of the sections of the lid structure partially covers the first package component and exposes a top surface of an underfill of the first package component, wherein the sections of the lid structure are free from direct contact with the underfill; and a thermal interface material located between the first package component and the lid structure, wherein the thermal interface material has a plurality of sections, and the plurality of sections are separated from each other without overlapping a top surface of the underfill. ### Claim 8 (depends on 7) The package structure as claimed in claim 7, wherein in a top view, areas of the sections of the lid structure are substantially the same. ### Claim 9 (depends on 7) The package structure as claimed in claim 7, wherein in a top view, an area of one section of the lid structure is different from an area of another section of the lid structure. ### Claim 10 (depends on 7) The package structure as claimed in claim 7, wherein the lid structure has a first foot and a second foot, the first foot and the second foot extend toward the substrate, the second foot is located closer to the first package component than the first foot, and the second foot extends to an edge of the lid structure. ### Claim 11 (depends on 10) The package structure as claimed in claim 10, wherein the first foot and the second foot are separated from the thermal interface material in a top view. ### Claim 12 (depends on 7) The package structure as claimed in claim 7, further comprising an electronic component disposed on the substrate, and the electronic component is located in a recess of the lid structure. ### Claim 13 (depends on 12) The package structure as claimed in claim 12, wherein a height of the recess is greater than a height of the electronic component. ### Claim 14 (depends on 7) The package structure as claimed in claim 7, wherein an edge of the lid structure is aligned with an edge of the thermal interface material. ### Claim 15 (depends on 7) The package structure as claimed in claim 7, wherein areas of the plurality of sections of the thermal interface material are different from each other. ### Claim 16 A method for forming a package structure, comprising: providing a substrate; mounting a first package component to the substrate, wherein the first package component comprises a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies; disposing a thermal interface material on the first package component, wherein the thermal interface material covers the integrated circuit dies and has an opening exposing the underfill in a normal direction of the substrate; and disposing a lid structure on the substrate and around the first package component, wherein the lid structure covers the integrated circuit dies and exposes the underfill in the normal direction of the substrate, a top surface of the underfill is lower than a top surface of the lid structure, and a bottom surface of the underfill is higher than a bottom surface of the lid structure. ### Claim 17 (depends on 16) The method as claimed in claim 16, further comprising disposing an electronic component on the substrate, wherein disposing the lid structure further comprises forming a recess on the lid structure, and the electronic component is contained in the recess. ### Claim 18 (depends on 17) The method as claimed in claim 17, wherein a height of the recess is greater than a height of the electronic component. ### Claim 19 (depends on 16) The method as claimed in claim 16, wherein the lid structure comprises a plurality of sections separated from each other, and each of the sections of the lid structure covers one of the integrated circuit dies and exposes the underfill. ### Claim 20 (depends on 16) The method as claimed in claim 16, wherein on a plane perpendicular to the normal direction of the substrate, a surface area of the thermal interface material is greater than a surface area of the integrated circuit dies.