# US 12,183,712 B2 · Method and system for manufacturing a semiconductor package structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,712 B2 - Document ID: US12183712B2 - Status: Granted - Kind: B2 - Application number: 18/089,458 - Filed: 2022-12-27 - Published: 2023-05-04 - Granted: 2024-12-31 - Earliest claimed: 2020-10-30 - Assignees: Advanced Semiconductor Engineering, Inc. - Applicants: Advanced Semiconductor Engineering, Inc. - Inventors: Che-Ting Liu; Jheng-Yu Hong; Yu-Ting Lu; Po-Chun Lee; Chih-Hsiang Hsu - Web page: https://patentgrep.com/patent/US12183712B2 ## CPC - H10W 72/0198: {batch processes} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/0614: {Marking devices} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 74/014: {using batch processing} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10P 72/0436: {mainly by radiation} - H10P 72/7416: {used during dicing or grinding} - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d). ## Claims ### Claim 1 A method for manufacturing a semiconductor package structure, comprising: providing a package body including a semiconductor device encapsulated in an encapsulant; removing a portion of the encapsulant to expose a plurality of stud bumps disposed over an active surface of the semiconductor device; attaching a first tape to a first side of the package body; thinning the package body; attaching a second tape to a second side of the package body, opposite to the first side, before removing the first tape; and reducing an adhesive of the first tape earlier than attaching the second tape. ### Claim 2 (depends on 1) The method of claim 1, further comprising: attaching the package body to a first chuck by a suction later than attaching the first tape, and earlier than thinning the package body. ### Claim 3 (depends on 2) The method of claim 2, wherein attaching the second tape is performed by a roller earlier than removing the first tape from the package body. ### Claim 4 (depends on 1) The method of claim 1, wherein reducing the adhesive of the first tape is later than thinning the package body. ### Claim 5 (depends on 4) The method of claim 4, wherein attaching the second tape to the package body is during the package body is attached to a first chuck by a suction, and is after thinning the package body. ### Claim 6 (depends on 4) The method of claim 4, further comprising: attaching the package body to a first chuck by a suction later than attaching the first tape; and turning over an assembly of the first tape, the package body and the second tape sucked by the first chuck after irradiating a UV light to the first tape. ### Claim 7 (depends on 6) The method of claim 6, further comprising: removing the first chuck from the assembly later than attaching the package body to a second chuck by a second suction. ### Claim 8 A method for manufacturing a semiconductor package structure, comprising: providing a package body including a semiconductor device encapsulated in an encapsulant; attaching a dicing tape to the package body; attaching an assembly of the package body and the dicing tape to a first chuck by a suction; turning over the assembly sucked on the first chuck; and forming a mark by a light irradiation passing through the dicing tape later than turning over the assembly sucked on the first chuck. ### Claim 9 (depends on 8) The method of claim 8, further comprising: forming the package body on a carrier; attaching a back grinding (BG) tape to a first surface of the package body before attaching the carrier to a flattening chuck by a third suction, wherein a second surface of the package body opposite to the first surface of the package body faces the carrier; and removing the carrier later than attaching the back grinding (BG) tape to the first chuck by the suction. ### Claim 10 (depends on 9) The method of claim 9, further comprising: attaching a back side film to the package body during the back grinding (BG) tape is attached on the first chuck; and curing the back side film later than removing the back grinding (BG) tape. ### Claim 11 (depends on 10) The method of claim 10, wherein the dicing tape and the back side film are attached to the package body at a same step. ### Claim 12 (depends on 10) The method of claim 10, further comprising: forming a mark on the back side film by a laser passing through the dicing tape. ### Claim 13 (depends on 10) The method of claim 10, wherein a thickness of the back grinding (BG) tape is greater than a thickness of the back side film. ### Claim 14 A method for manufacturing a semiconductor package structure, comprising: forming a package body on a carrier, wherein the package body includes a semiconductor device encapsulated in an encapsulant; attaching a back grinding (BG) tape to a first surface of the package body, wherein a second surface of the package body opposite to the first surface of the package body faces the carrier; attaching the carrier to a flattening chuck by a third suction later than attaching the back grinding (BG) tape to the first surface of the package body; attaching a combination of a dicing tape and a back side film to the package body; forming a mark on the back side film by a light irradiation passing through the dicing tape; and curing the back side film before forming the mark on the back side film, and after attaching the combination of the dicing tape and the back side film to the package body. ### Claim 15 (depends on 14) The method of claim 14, further comprising: removing the carrier during the back grinding (BG) tape is attached to a first chuck by a suction. ### Claim 16 (depends on 14) The method of claim 14, wherein attaching the combination of the dicing tape and the back side film to the package body is during the package body is attached to a first chuck by a suction. ### Claim 17 (depends on 16) The method of claim 16, further comprising: turning over an assembly of the package body and the combination of the dicing tape and the back side film sucked by the first chuck. ### Claim 18 (depends on 17) The method of claim 17, further comprising: attaching the assembly to a second chuck by a second suction earlier than removing the first chuck from the assembly. ### Claim 19 (depends on 18) The method of claim 18, wherein attaching the back grinding (BG) tape to the package body is before attaching the combination of the dicing tape and the back side film to the package body.