# US 12,183,711 B2 · Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,711 B2 - Document ID: US12183711B2 - Status: Granted - Kind: B2 - Application number: 18/109,344 - Filed: 2023-02-14 - Published: 2023-08-17 - Granted: 2024-12-31 - Earliest claimed: 2022-02-15 - Assignees: Kulicke and Soffa Industries, Inc. - Applicants: Kulicke and Soffa Industries, Inc. - Inventors: Basil Milton; David Jeffery Li; Wei Qin - Web page: https://patentgrep.com/patent/US12183711B2 ## CPC - H10W 72/0711: {Apparatus therefor} - H10W 72/075: {of bond wires} - B23K 20/00: Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - H10W 72/50: Bond wires - H10W 72/07531: {Techniques} - H10W 72/07553: {changes in shapes} - H10W 72/07554: {changes in dispositions} - H10W 72/5366: {the bond wires having kinks} - H10W 72/537: {Multiple bond wires having different shapes} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b). ## Claims ### Claim 1 A method of determining a sequence for creating a plurality of wire loops in connection with a workpiece, the method comprising the steps of: (a) providing workpiece data for the workpiece, the workpiece data including (i) position data for bonding locations of the workpiece, and (ii) wire loop data for the plurality of wire loops providing interconnection between ones of the bonding locations of the workpiece, the wire loop data including a three-dimensional shape of each of the plurality of wire loops; (b) analyzing the workpiece data, the step of analyzing including substeps of (b1) considering overlap conditions between ones of the plurality of wire loops, (b2) considering wire loop heights of ones of the plurality of wire loops, (b3) considering lateral bend conditions between ones of the plurality of wire loops, and (b4) considering wire loop positions for ones of the plurality of wire loops, wherein step (b) includes analyzing the workpiece data by prioritizing substeps (b1)-(b4) with respect to each other; and (c) providing the sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b), wherein the sequence includes forming ones of the plurality of wire loops having a lower loop height prior to forming others of the plurality of wire loops having a taller loop height. ### Claim 2 (depends on 1) The method of claim 1 wherein steps (b) and (c) are performed using a computer. ### Claim 3 (depends on 2) The method of claim 2 wherein the computer is on a wire bonding machine. ### Claim 4 (depends on 2) The method of claim 2 wherein the computer is separate from a wire bonding machine. ### Claim 5 (depends on 1) The method of claim 1 wherein steps (b) and (c) are performed using an algorithm running on a computer. ### Claim 6 (depends on 1) The method of claim 1 wherein the wire loop data includes an orientation of ones of the plurality of wire loops with respect to each other. ### Claim 7 (depends on 1) The method of claim 1 wherein step (a) includes assembling the workpiece data in a data structure accessible by a computer. ### Claim 8 (depends on 1) The method of claim 1 wherein step (c) includes determining the sequence of creating the plurality of wire loops such that ground wires included in the plurality of wire loops are created prior to the creation of others of the plurality of wire loops. ### Claim 9 (depends on 1) The method of claim 1 wherein the workpiece includes a semiconductor die, and wherein the sequence includes forming ones of the plurality of wire loops bonded to an outer pad tier of the semiconductor die prior to forming others of the plurality of wire loops bonded to an inner pad tier of the semiconductor die. ### Claim 10 (depends on 1) The method of claim 1 wherein a result of substep (b1) is given priority over a result of substeps (b2)-(b4). ### Claim 11 (depends on 10) The method of claim 10 wherein a result of substep (b2) is given priority over a result of substeps (b3)-(b4). ### Claim 12 (depends on 11) The method of claim 11 wherein a result of substep (b3) is given priority over a result of substep (b4). ### Claim 13 (depends on 1) The method of claim 1 wherein step (c) includes providing the sequence such that the plurality of wire loops are created without interference with adjacent ones of the plurality of wire loops. ### Claim 14 (depends on 1) The method of claim 1 wherein the step of analyzing further includes the substep of (b5) accounting for time efficiency in connection with the creation of the plurality of wire loops. ### Claim 15 A method of determining a sequence for creating a plurality of wire loops in connection with a workpiece, the method comprising the steps of: (a) providing workpiece data for the workpiece, the workpiece data including (i) position data for bonding locations of the workpiece, and (ii) wire loop data for the plurality of wire loops providing interconnection between ones of the bonding locations of the workpiece, the wire loop data including a three-dimensional shape of each of the plurality of wire loops; (b) analyzing each of the plurality of wire loops to be created using the workpiece data, the step of analyzing including substeps of (b1) checking each of the plurality of wire loops for overlap conditions with others of the plurality of wire loops, (b2) checking a height of each of the plurality of wire loops with respect to others of the plurality of wire loops, (b3) checking each of the plurality of wire loops for lateral bend conditions with respect to others of the plurality of wire loops, and (b4) checking a position of each of the wire loops with respect to others of the plurality of wire loops, wherein step (b) includes analyzing the workpiece data by prioritizing substeps (b1)-(b4) with respect to each other; and (c) providing the sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b), wherein the sequence includes forming ones of the plurality of wire loops having a lower loop height prior to forming others of the plurality of wire loops having a taller loop height. ### Claim 16 (depends on 15) The method of claim 15 wherein steps (b) and (c) are performed using a computer. ### Claim 17 (depends on 16) The method of claim 16 wherein the computer is on a wire bonding machine. ### Claim 18 (depends on 16) The method of claim 16 wherein the computer is separate from a wire bonding machine. ### Claim 19 (depends on 15) The method of claim 15 wherein steps (b) and (c) are performed using an algorithm running on a computer. ### Claim 20 (depends on 15) The method of claim 15 wherein the wire loop data includes an orientation of ones of the plurality of wire loops with respect to each other. ### Claim 21 (depends on 15) The method of claim 15 wherein step (a) includes assembling the workpiece data in a data structure accessible by a computer. ### Claim 22 (depends on 15) The method of claim 15 wherein step (c) includes determining the sequence of creating the plurality of wire loops such that ground wires included in the plurality of wire loops are created prior to the creation of others of the plurality of wire loops. ### Claim 23 (depends on 15) The method of claim 15 wherein the workpiece includes a semiconductor die, and wherein the sequence includes forming ones of the plurality of wire loops bonded to an outer pad tier of the semiconductor die prior to forming others of the plurality of wire loops bonded to an inner pad tier of the semiconductor die. ### Claim 24 (depends on 15) The method of claim 15 wherein a result of substep (b1) is given priority over a result of substeps (b2)-(b4). ### Claim 25 (depends on 24) The method of claim 24 wherein a result of substep (b2) is given priority over a result of substeps (b3)-(b4). ### Claim 26 (depends on 25) The method of claim 25 wherein a result of substep (b3) is given priority over a result of substep (b4). ### Claim 27 (depends on 15) The method of claim 15 wherein step (c) includes providing the sequence such that the plurality of wire loops are created without interference with adjacent ones of the plurality of wire loops. ### Claim 28 (depends on 15) The method of claim 15 wherein the step of analyzing further includes the substep of (b5) accounting for time efficiency in connection with the creation of the plurality of wire loops.