# US 12,183,653 B2 · Thermal conductive film

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- Number: US 12,183,653 B2
- Document ID: US12183653B2
- Status: Granted
- Kind: B2
- Application number: 17/726,916
- Filed: 2022-04-22
- Published: 2022-08-04
- Granted: 2024-12-31
- Earliest claimed: 2018-12-28
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Joungphil Lee; Myung-Sung Kang; Yeongseok Kim; Gwangsun Seo; Hyein Yoo; Yongwon Choi
- Web page: https://patentgrep.com/patent/US12183653B2

## CPC

- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- C09J 7/28: Metal sheet (metallised plastics C09J7/22)
- C09J 11/04: inorganic
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 70/611: {for connecting multiple chips together}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 74/473: {containing a filler}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 72/01351: {Changing the shapes of die-attach connectors}
- H10W 72/07354: {changes in dispositions}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/322: {Multilayered die-attach connectors, e.g. a coating on a top surface of a core}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/331: {Shapes of die-attach connectors}
- H10W 72/341: {Dispositions of die-attach connectors, e.g. layouts}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 72/357: {Multiple die-attach connectors having different materials}
- H10W 72/551: {Materials of bond wires}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/00: Package configurations
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

## Claims

### Claim 1

A thermal conductive film, comprising:
a porous metal layer consisting of a sponge comprised entirely of metal, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on and contacting one side of the porous metal layer; and
a plurality of first thermal conductive members distributed in the first adhesive layer.

### Claim 2 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein a porosity of the porous metal layer is about 30% to less than 100%.

### Claim 3 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein:
at least one of the pores is open at a surface of the porous metal layer, and
the adhesive substance filling the at least one of the pores is exposed at the surface of the porous metal layer.

### Claim 4 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein:
the adhesive substance and the first adhesive layer are in contact with each other at an interface between the porous metal layer and the first adhesive layer, and
the adhesive substance and the first adhesive layer are provided in the form of a single body including the same material.

### Claim 5 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein a major axis of the pores has a length of about 5 μm to about 3000 μm.

### Claim 6 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein the plurality of first thermal conductive members have one or more of a bead shape, a wire shape, or a rod shape.

### Claim 7 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein the plurality of first thermal conductive members occupy a volume fraction of about 1% to about 50% of a total volume of the first adhesive layer.

### Claim 8 (depends on 1)

The thermal conductive film as claimed in claim 1, wherein the plurality of first thermal conductive members are distributed in the adhesive substance.

### Claim 9 (depends on 1)

The thermal conductive film as claimed in claim 1, further comprising a second adhesive layer on another side of the porous metal layer, the other side being opposite to the first adhesive layer.

### Claim 10 (depends on 9)

The thermal conductive film as claimed in claim 9, further comprising a plurality of second thermal conductive members distributed in the second adhesive layer, wherein:
the first adhesive layer includes a different material from that of the adhesive substance, and
the second adhesive layer includes a different material from that of the adhesive substance.

### Claim 11 (depends on 9)

The thermal conductive film as claimed in claim 9, further comprising:
a first removable polyethylene terephthalate (PET) or paper layer covering the second adhesive layer; and
a second removable polyethylene terephthalate (PET) or paper layer covering the first adhesive layer.

### Claim 12

A thermal conductive film, comprising:
a porous metal layer consisting of a sponge made entirely of metal, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on and contacting one side of the porous metal layer; and
a plurality of thermal conductive members distributed in the adhesive substance.

### Claim 13 (depends on 12)

The thermal conductive film as claimed in claim 12, further comprising a second adhesive layer on another side of the porous metal layer, the other side being opposite to the first adhesive layer.

### Claim 14 (depends on 13)

The thermal conductive film as claimed in claim 13, wherein:
the plurality of thermal conductive members are distributed in the first adhesive layer,
the first adhesive layer includes a different material from that of the adhesive substance, and
the second adhesive layer includes a different material from that of the adhesive substance.

### Claim 15 (depends on 12)

The thermal conductive film as claimed in claim 12, wherein:
at least one of the pores is open at a surface of the porous metal layer, and
the adhesive substance filling the at least one of the pores is exposed at the surface of the porous metal layer.

### Claim 16 (depends on 12)

The thermal conductive film as claimed in claim 12, wherein:
the adhesive substance and the first adhesive layer are in contact with each other at an interface between the porous metal layer and the first adhesive layer, and
the adhesive substance and the first adhesive layer are provided in the form of a single body including the same material.

### Claim 17 (depends on 12)

The thermal conductive film as claimed in claim 12, wherein a major axis of the pores has a length of about 5 μm to about 3000 μm.

### Claim 18 (depends on 12)

The thermal conductive film as claimed in claim 12, wherein the plurality of thermal conductive members occupy a volume fraction of about 1% to about 50% of a total volume of the first adhesive layer.

### Claim 19

A thermal conductive film, comprising:
a porous metal layer consisting of a sponge, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on one side of the porous metal layer; and
a plurality of first thermal conductive members distributed in the first adhesive layer,
wherein a major axis of the pores has a length in the range of 5 μm to 3000 μm.

### Claim 20 (depends on 19)

The thermal conductive film as claimed in claim 19, wherein a porosity of the porous metal layer is about 30% to less than 100%.