# US 12,183,643 B2 · Implanting system for fabricating semiconductor device structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,643 B2 - Document ID: US12183643B2 - Status: Granted - Kind: B2 - Application number: 17/848,514 - Filed: 2022-06-24 - Published: 2023-12-28 - Granted: 2024-12-31 - Earliest claimed: 2022-06-24 - Assignees: Nanya Technology Corporation - Applicants: Nanya Technology Corporation - Inventors: Tzu-Ching Tsai - Web page: https://patentgrep.com/patent/US12183643B2 ## CPC - H10P 74/238: {comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement} - G06N 3/08: Learning methods - G06N 20/00: Machine learning - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G06N: COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS ## Abstract The present application discloses an implanting system. The implanting system includes an etch module executing a first implanting recipe on a first wafer to turn a first wafer state of the first wafer to a second wafer state; a first measurement module collecting the second wafer state of the first wafer to generate a first set of data; and an artificial intelligence module coupled to the first measurement module and the etch module, analyzing the first set of data and update the first implanting recipe to a second implanting recipe when the first set of data is not within a predetermined range. The artificial intelligence module is configured for generating the second implanting recipe taking into consideration at least one of an implanting rate of the second wafer, a rate of rotation of the second wafer, and a tilt angle of the second wafer. ## Claims ### Claim 1 An implanting system for fabricating a semiconductor device structure, comprising: an etch module configured to execute a first implanting recipe on a first wafer to turn a first wafer state of the first wafer to a second wafer state; a first measurement module configured to collect the second wafer state of the first wafer to generate a first set of data; and an artificial intelligence module coupled to the first measurement module and the etch module, configured to analyze the first set of data and update the first implanting recipe to generate a second implanting recipe when the first set of data is not within a predetermined range; wherein the second implanting recipe is configured to be applied on a second wafer to be processed after the first wafer; wherein the artificial intelligence module is configured for generating the second implanting recipe taking into consideration at least one of an implanting rate of the second wafer, a rate of rotation of the second wafer, a tilt angle of the second wafer, an etching recipe of the first wafer, and a deposition recipe of the first wafer. ### Claim 2 (depends on 1) The implanting system of claim 1, wherein the artificial intelligence module is integrated in the etch module. ### Claim 3 (depends on 2) The implanting system of claim 2, wherein the artificial intelligence module is configured to execute algorithms comprising one or more of the following, alone or in combination: machine learning, hidden Markov models; recurrent neural networks; convolutional neural networks; Bayesian symbolic methods; general adversarial networks; or support vector machines. ### Claim 4 (depends on 3) The implanting system of claim 3, wherein the etch module is configured to feed forward at least one parameter of the etch module to the artificial intelligence module before executing the first implanting recipe on the first wafer. ### Claim 5 (depends on 4) The implanting system of claim 4, further comprising a second measurement module coupled to the artificial intelligence module and configured to collect the first wafer state of the first wafer to generate a second set of data. ### Claim 6 (depends on 5) The implanting system of claim 5, wherein the second set of data is fed forward to the artificial intelligence module, and the second measurement module comprises an after-development-inspection metrology tool for measuring a critical dimension. ### Claim 7 (depends on 4) The implanting system of claim 4, wherein the artificial intelligence module and the first measurement module communicate with each other using analog technologies, digital technologies, network technologies, Bluetooth technologies, or Near-field communication technologies. ### Claim 8 (depends on 4) The implanting system of claim 4, wherein the first measurement module comprises a chip probe module configured to collect electrical characteristics of the second wafer state of the first wafer. ### Claim 9 (depends on 4) The implanting system of claim 4, wherein the first measurement module comprises a wafer acceptance test module configured to collect electrical characteristics of the second state of the first wafer. ### Claim 10 (depends on 4) The implanting system of claim 4, wherein the first measurement module comprises a statistical process control module configured to collect data related to a profile of the second wafer state of the first wafer. ### Claim 11 (depends on 4) The implanting system of claim 4, wherein the artificial intelligence module is configured to receive at least one trace datum of the first wafer state of the first wafer. ### Claim 12 (depends on 1) The implanting system of claim 1, wherein the artificial intelligence module is further configured for generating the second implanting recipe taking into consideration a feature profile of the second wafer state of the first wafer.