# US 12,183,559 B2 · Apparatus for temperature control in a substrate processing chamber > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,183,559 B2 - Document ID: US12183559B2 - Status: Granted - Kind: B2 - Application number: 17/508,493 - Filed: 2021-10-22 - Published: 2023-04-27 - Granted: 2024-12-31 - Earliest claimed: 2021-10-22 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Vishwas Kumar Pandey; Colin John Dickinson; Dinkesh Huderi Somanna; Ala Moradian; Kartik Bhupendra Shah - Web page: https://patentgrep.com/patent/US12183559B2 ## CPC - H01J 37/3441: {Dark space shields} - C23C 14/34: Sputtering - C23C 14/50: Substrate holders - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H01J 37/32522: {Temperature} - H01J 37/32724: {Temperature} - H01J 2237/002: Cooling arrangements - H01J 2237/332: Coating - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface. ## Claims ### Claim 1 An adapter for a deposition chamber comprising: an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side, the adapter body having a central opening about the central axis, the adapter body having a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side, wherein at least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface, wherein at least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface, wherein the stepped surface includes a mounting surface configured to mount an outer shield to the adapter body and dispose the outer shield below the stepped surface, and wherein the adapter body is configured to couple to a shield extending from the upper side. ### Claim 2 (depends on 1) The adapter according to claim 1, wherein the coolant channel has a profile that has at least one surface that conforms to at least a portion of the stepped surface. ### Claim 3 (depends on 1) The adapter according to claim 1, wherein the coolant channel has a square or rectangular profile. ### Claim 4 (depends on 1) The adapter according to claim 1, wherein the coolant channel has an L-shaped, mushroom shaped, or T-shaped profile. ### Claim 5 (depends on 1) The adapter according to claim 1, wherein the connection surface is a sealing surface configured to seal with the deposition chamber. ### Claim 6 (depends on 1) The adapter according to claim 1, wherein the radially inner portion of the adapter body has at least one section having an L-shaped or T-shaped profile. ### Claim 7 (depends on 6) The adapter according to claim 6, wherein the coolant channel is disposed in the at least one section having an L-shaped profile. ### Claim 8 (depends on 7) The adapter according to claim 7, wherein the coolant channel has an L-shaped, mushroom shaped, or T-shaped profile. ### Claim 9 A deposition chamber comprising: an adapter comprising: an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side, the adapter body having a central opening about the central axis, the adapter body having a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side, wherein at least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface, and wherein at least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface; and a chamber body defining an internal cavity surrounding a heater for heating an interior volume of the internal cavity, the chamber body having a connection surface defining an opening of the chamber body coaxial with the central opening of the adapter body, wherein the connection surface of the adapter body is connected to the connection surface of the chamber body; an outer shield extending longitudinally and radially from the stepped surface; and an inner shield extending longitudinally and radially from the upper side of the adapter body toward the stepped surface and extending partially over the outer shield. ### Claim 10 (depends on 9) The deposition chamber according to claim 9, wherein the coolant channel has a profile that has at least one surface that conforms to at least a portion of the stepped surface. ### Claim 11 (depends on 9) The deposition chamber according to claim 9, wherein the coolant channel has a square or rectangular profile. ### Claim 12 (depends on 9) The deposition chamber according to claim 9, wherein the coolant channel has an L-shaped, mushroom shaped, or T-shaped profile. ### Claim 13 (depends on 9) The deposition chamber according to claim 9, wherein the coolant channel is disposed in the internal cavity. ### Claim 14 (depends on 9) The deposition chamber according to claim 9, wherein the connection surface of the adapter body is sealed with the connection surface of the deposition chamber. ### Claim 15 (depends on 9) The deposition chamber according to claim 9, wherein the radially inner portion of the adapter body has at least one section having an L-shaped or T-shaped profile. ### Claim 16 (depends on 15) The deposition chamber according to claim 15, wherein the coolant channel is disposed in the at least one section having an L-shaped or T-shaped profile. ### Claim 17 (depends on 16) The deposition chamber according to claim 16, wherein the coolant channel has an L-shaped, mushroom shaped, or T-shaped profile. ### Claim 18 (depends on 9) The deposition chamber according to claim 9, wherein the heater is configured to support and heat a substrate. ### Claim 19 A process kit for a deposition chamber comprising: an adapter comprising: an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side, the adapter body having a central opening about the central axis, the adapter body having a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side, wherein at least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface, and wherein at least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface; an outer shield extending longitudinally and radially from the stepped surface of the adapter body; and an inner shield extending longitudinally and radially from an upper surface of the adapter body toward the stepped surface, wherein the inner shield extends partially over the outer shield. ### Claim 20 (depends on 19) The process kit according to claim 19, wherein: the outer shield has a U-shaped or J-shaped profile having opposing longitudinally extending and radially spaced sides, and the inner shield has a free end disposed radially between the opposing longitudinally extending sides.