# US 12,183,546 B2 · Substrate processing apparatus

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,183,546 B2
- Document ID: US12183546B2
- Status: Granted
- Kind: B2
- Application number: 17/196,374
- Filed: 2021-03-09
- Published: 2021-09-16
- Granted: 2024-12-31
- Earliest claimed: 2020-03-13
- Assignees: ASM IP Holding B.V.
- Applicants: ASM IP Holding B.V.
- Inventors: KiChul Um; YongGyu Han; SangJean Jeon; DooHan Kim; SangYeop Lee
- Web page: https://patentgrep.com/patent/US12183546B2

## CPC

- H01J 37/32137: {controlling of the discharge by modulation of energy}
- C23C 16/505: using radio frequency discharges
- H01J 37/32183: {Matching circuits}
- H01J 37/32724: {Temperature}
- H01J 37/32889: {Connection or combination with other apparatus}
- H01J 37/32899: {Multiple chambers, e.g. cluster tools}
- H01J 37/32926: {Software, data control or modelling}
- H03K 5/24: the characteristic being amplitude
- H01J 37/32091: {the radio frequency energy being capacitively coupled to the plasma}
- H01J 37/32577: {Electrical connecting means}
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)

## Abstract

A substrate processing apparatus capable of removing signal interference between reactors includes: a first reactor, a second reactor adjacent to the first reactor, and a power generator configured to supply first power to the first reactor and supply second power to the second reactor, wherein the power generator is further configured to synchronize phases of the first power and the second power.

## Claims

### Claim 1

A substrate processing apparatus comprising:
a first reactor comprising a first power electrode and a first ground electrode;
a second reactor adjacent to the first reactor, the second reactor comprising a second power electrode and a second ground electrode;
a power generator configured to supply first power to the first power electrode and supply second power to the second power electrode; and
a controller,
wherein the power generator is further configured to synchronize phases of the first power and the second power and wherein the power generator comprises:
a signal generator configured to generate a first signal and a second signal that are phase-synchronized;
a first power generating portion configured to generate the first power based on the first signal; and
a second power generating portion configured to generate the second power based on the second signal,
wherein the signal generator comprises a first sensor, a second sensor, a comparator, and a splitter configured to generate a first RF signal and a second RF signal from a single RF signal,
wherein the first sensor detects a phase of the first RF signal,
wherein the second sensor detects a phase of the second RF signal,
wherein the comparator is configured to receive a signal from the first sensor, receive a signal from the second sensor, and to compare the signal from the first sensor and the signal from the second sensor and output a comparison signal,
wherein the splitter is further configured to adjust the phase of at least one of the first RF signal directed to the first power generating portion and the second RF signal directed to the second power generating portion based on the comparison signal, such that the first RF signal directed to the first power generating portion and the second RF signal directed to the second power generating portion are phase synchronized to form the first signal and the second signal,
wherein the first ground electrode and the second ground electrode are coupled to ground,
wherein at least one of the first power generating portion and the second power generating portion comprises:
a first amplifier configured to amplify a signal output from the signal generator and output a first amplified signal;
a second amplifier configured to amplify a signal output from the signal generator and output a second amplified signal; and
a combiner configured to combine the first amplified signal and the second amplified signal to generate an output signal,
wherein the controller is configured to compare a phase of the signal output from the signal generator with a phase of the output signal and transmit a comparison result to the combiner, and
wherein the controller is configured to perform the functions of the first sensor and the second sensor.

### Claim 2 (depends on 1)

The substrate processing apparatus of claim 1,
wherein the first power generating portion and the second power generating portion are arranged symmetrically with respect to the signal generator.

### Claim 3 (depends on 1)

The substrate processing apparatus of claim 1, further comprising:
a first power transmission line connecting the signal generator to the first power generating portion; and
a second power transmission line connecting the signal generator to the second power generating portion,
wherein a length of the first power transmission line and a length of the second power transmission line are the same.

### Claim 4 (depends on 1)

The substrate processing apparatus of claim 1,
wherein a phase of the signal output from the signal generator is compared with a phase of the first amplified signal, and the phase of the first amplified signal is adjusted according to a comparison result.

### Claim 5 (depends on 1)

The substrate processing apparatus of claim 1,
wherein the combiner is configured to receive the comparison result from the controller to change a phase of at least one of the first amplified signal and the second amplified signal based on the comparison result.

### Claim 6 (depends on 1)

The substrate processing apparatus of claim 1,
wherein the combiner is configured to receive the comparison result from the controller to change the phase of the output signal based on the comparison result.

### Claim 7 (depends on 1)

The substrate processing apparatus of claim 1,
wherein the controller is further configured to compare the output signal with a target power value and transmit a comparison result to at least one of the first amplifier and the second amplifier.

### Claim 8 (depends on 7)

The substrate processing apparatus of claim 7,
wherein at least one of the first amplifier and the second amplifier is further configured to receive the comparison result from the controller and adjust a gain.

### Claim 9 (depends on 1)

The substrate processing apparatus of claim 1, further comprising:
a first matching network connected between the power generator and the first reactor; and
a second matching network connected between the power generator and the second reactor,
wherein the first matching network and the second matching network are arranged symmetrically with respect to the power generator.

### Claim 10 (depends on 9)

The substrate processing apparatus of claim 9, further comprising:
a first power supply line connecting the power generator to the first matching network; and
a second power supply line connecting the power generator to the second matching network,
wherein a length of the first power supply line and a length of the second power supply line are the same.

### Claim 11 (depends on 1)

The substrate processing apparatus of claim 1,
wherein the first reactor comprises a first processing unit and a first substrate support unit,
the second reactor comprises a second processing unit and a second substrate support unit, and
the substrate processing apparatus further comprises a support portion configured to support at least a portion of the first reactor and at least a portion of the second reactor,
wherein the support portion is capacitively coupled with at least one of the first processing unit and the first substrate support unit, and
is capacitively coupled with at least one of the second processing unit and the second substrate support unit.

### Claim 12 (depends on 11)

The substrate processing apparatus of claim 11,
wherein at least one or both of the first substrate support unit and the second substrate support unit comprise an insulating heating block.

### Claim 13 (depends on 1)

The substrate processing apparatus of claim 1, further comprising a third sensor to detect a phase of the first output signal, wherein an output of the third sensor is coupled to the controller.

### Claim 14

A substrate processing apparatus comprising:
a signal generator comprising a single signal generator configured to output a single signal, the signal generator comprising:
a splitter configured to generate a first signal and a second signal from the single signal;
a first sensor to receive the first signal;
a second sensor to receive the second signal; and
a comparator configured to compare a signal from the first sensor and a signal from the second sensor;
a first amplifier configured to amplify the first signal and output a first amplified signal;
a second amplifier configured to amplify the first signal and output a second amplified signal;
a first combiner configured to combine the first amplified signal and the second amplified signal to generate a first output signal;
a third amplifier configured to amplify the second signal and output a third amplified signal;
a fourth amplifier configured to amplify the second signal and output a fourth amplified signal;
a second combiner configured to combine the third amplified signal and the fourth amplified signal to generate a second output signal;
a first matching network configured to receive the first output signal;
a second matching network configured to receive the second output signal; and
a controller configured to compare a phase of the first signal with a phase of the first output signal, transmit a comparison result to the first combiner, and perform the functions of the first sensor and the second sensor,
wherein the first sensor detects a phase of the first signal,
wherein the second sensor detects a phase of the second signal, and
wherein the splitter is further configured to adjust the phase of at least one of the first signal and the second signal based on the signal from the first sensor and the signal from the second sensor to thereby phase synchronize the first signal and the second signal.

### Claim 15 (depends on 14)

The substrate processing apparatus of claim 14, wherein the controller is further configured to transmit a gain comparison result to the first amplifier and the second amplifier.