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US 12,183,499 B2Granted
Structure for forming a 3D-coil transponder
AssigneeCyntec Co., Ltd.
InventorsMin-Feng Chung, Kuan Yu Chiu, Ching Hsiang Yu
Life of this patent
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Abstract
A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
Claims20
A structure for forming a 3D-coil transponder, comprising:
- a plurality of separated groups of leads, wherein each group of leads are encapsulated by a separated insulating molding body, wherein each group of leads consists of two leads and there are four separated insulating molding bodies;
- and
- a magnetic body, disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
A method to form a structure for forming a 3D-coil transponder, the method comprising:
- forming a plurality of separated groups of leads, wherein each group of leads are encapsulated by a separated insulating molding body, wherein each group of leads consists of two leads and there are four separated insulating molding bodies;
- and
- disposing a magnetic body over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
Dependencies are inferred from the claim text.